U.S. patent application number 13/433185 was filed with the patent office on 2012-10-04 for coating on pdc/tsp cutter for accelerated leaching.
This patent application is currently assigned to SMITH INTERNATIONAL INC.. Invention is credited to Anthony Griffo, Madapusi K. Keshavan, Yuelin Shen, Ted Tessitore, Youhe Zhang.
Application Number | 20120247841 13/433185 |
Document ID | / |
Family ID | 46925768 |
Filed Date | 2012-10-04 |
United States Patent
Application |
20120247841 |
Kind Code |
A1 |
Tessitore; Ted ; et
al. |
October 4, 2012 |
COATING ON PDC/TSP CUTTER FOR ACCELERATED LEACHING
Abstract
A cutting element that includes a polycrystalline diamond layer
having a cutting face and a diamond layer side surface, a substrate
attached to the polycrystalline diamond layer, the substrate having
a bottom surface and a substrate side surface, an interface between
the diamond layer and the substrate, and a mask covering at least
the bottom surface and the substrate side surface of the cutting
element is disclosed.
Inventors: |
Tessitore; Ted; (The
Woodlands, TX) ; Griffo; Anthony; (The Woodlands,
TX) ; Shen; Yuelin; (Spring, TX) ; Zhang;
Youhe; (Spring, TX) ; Keshavan; Madapusi K.;
(The Woodlands, TX) |
Assignee: |
SMITH INTERNATIONAL INC.
Houston
TX
|
Family ID: |
46925768 |
Appl. No.: |
13/433185 |
Filed: |
March 28, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61468849 |
Mar 29, 2011 |
|
|
|
Current U.S.
Class: |
175/428 ; 216/41;
216/49 |
Current CPC
Class: |
C22C 26/00 20130101;
C22C 1/1094 20130101; B22F 2003/244 20130101; E21B 10/54 20130101;
C03C 25/68 20130101 |
Class at
Publication: |
175/428 ; 216/41;
216/49 |
International
Class: |
E21B 10/46 20060101
E21B010/46; C03C 25/68 20060101 C03C025/68 |
Claims
1. A cutting element, comprising: a polycrystalline diamond layer,
comprising: a cutting face; and a diamond layer side surface; a
substrate attached to the polycrystalline diamond layer, the
substrate comprising: a bottom surface; and a substrate side
surface; and an interface between the diamond layer and the
substrate; and a mask covering at least the bottom surface and the
substrate side surface of the cutting element.
2. The cutting element of claim 1, wherein the mask is
removable.
3. The cutting element of claim 1, wherein the mask comprises
diamond-like carbon.
4. The cutting element of claim 1, wherein the mask comprises a
chemical resistant air dry ink.
5. The cutting element of claim 1, wherein the mask comprises a
chemical resistant UV cured ink.
6. The cutting element of claim 1, wherein the mask comprises
Teflon.
7. The cutting element of claim 1, wherein the mask is sealed to
the cutting element.
8. The cutting element of claim 1, wherein the mask comprises a top
end, wherein the top end is substantially parallel with the cutting
face.
9. The cutting element of claim 1, wherein the mask comprises a top
end, wherein the top end is non-planar.
10. A method for leaching a cutting element, comprising: providing
a cutting element, the cutting element comprising a substrate and
polycrystalline diamond layer attached to the substrate; masking at
least the substrate portion of the cutting element with a mask,
leaving an unmasked portion of the diamond layer of the cutting
element; placing the masked cutting element in a leaching agent,
wherein at least the unmasked portion of the cutting element
contacts the leaching agent; and removing the masked cutting
element from the leaching agent.
11. The method of claim 10, further comprising removing the
mask.
12. The method of claim 10, wherein the step of placing the masked
cutting element in the leaching agent further comprises holding the
masked cutting element in place.
13. The method of claim 12, wherein the masked cutting element is
held in place by a magnetic capturing device.
14. The method of claim 10, wherein the mask comprises diamond-like
carbon.
15. The method of claim 10, wherein the mask comprises a material
selected from a chemical resistant air dry ink and a chemical
resistant UV cured ink.
16. The method of claim 10, wherein the mask comprises an institute
mask.
17. The method of claim 10, wherein the step of masking comprises
encasing the cutting element with a mask material using injection
molding.
18. A method of leaching a cutting element, comprising: providing a
cutting element, comprising a substrate and polycrystalline diamond
layer attached to the substrate; fitting at least the substrate
portion of the cutting element in a pre-formed mask, leaving an
unmasked portion of the diamond layer of the cutting element;
placing the cutting element in a leaching agent, wherein at least
the unmasked portion of the cutting element contacts the leaching
agent; and removing the cutting element from the leaching
agent.
19. The method of claim 18, wherein the step of fitting further
comprises: placing the pre-formed mask and the cutting element in a
vacuum and applying heat to the pre-formed mask to tighten the
pre-formed mask around the cutting element.
20. The method of claim 18, further comprising sealing the
pre-formed mask to the cutting element.
21. The method of claim 18, further comprising removing the
pre-formed mask.
22. The method of claim 18, wherein the pre-formed mask comprises
polyvinylchloride.
23. The method of claim 18, wherein the step of placing the cutting
element in the leaching agent further comprises holding the cutting
element in place.
24. The method of claim 23, wherein the masked cutting element is
held in place by a magnetic capturing device.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Application 61/468,849 filed on Mar. 29, 2011, which is herein
incorporated by reference in its entirety.
BACKGROUND
[0002] 1. Technical Field
[0003] Embodiments disclosed herein relate generally to
polycrystalline diamond composites and cutting structures. More
particularly, embodiments disclosed herein relate to methods of
leaching polycrystalline diamond cutting elements.
[0004] 2. Background Art
[0005] Polycrystalline diamond compact ("PDC") cutters have been
used in industrial applications including rock drilling and metal
machining for many years. In a typical application, a compact of
polycrystalline diamond (PCD) (or other superhard material) is
bonded to a substrate material, which is typically a sintered
metal-carbide to form a cutting structure. PCD comprises a
polycrystalline mass of diamonds (typically synthetic) that are
bonded together to form an integral, tough, high-strength mass or
lattice. The resulting PCD structure produces enhanced properties
of wear resistance and hardness, making PCD materials extremely
useful in aggressive wear and cutting applications where high
levels of wear resistance and hardness are desired.
[0006] A PDC cutting element may be formed by placing a cemented
carbide substrate into the container of a press. A mixture of
diamond grains or diamond grains and catalyst binder is placed atop
the substrate and treated under high pressure, high temperature
conditions. In doing so, metal binder (often cobalt) migrates from
the substrate and passes through the diamond grains to promote
intergrowth between the diamond grains. As a result, the diamond
grains become bonded to each other to form the diamond layer, and
the diamond layer is in turn bonded to the substrate. The substrate
often comprises a metal-carbide composite material, such as
tungsten carbide. The deposited diamond layer is often referred to
as the "diamond table" or "abrasive layer."
[0007] Conventional PCD includes 85-95% by volume diamond and a
balance of the binder material, which is present in PCD within the
interstices existing between the bonded diamond grains. Binder
materials that are typically used in forming PCD include Group VIII
elements, with cobalt (Co) being the most common binder material
used.
[0008] An example of a drag bit for earth formation drilling using
PDC cutters is shown in FIG. 1. FIG. 1 shows a rotary drill bit 10
having a bit body 12. The lower face of the bit body 12 is formed
with a plurality of blades 14, which extend generally outwardly
away from a central longitudinal axis of rotation 16 of the drill
bit. A plurality of PDC cutters 18 are disposed side by side along
the length of each blade. The number of PDC cutters 18 carried by
each blade may vary. The PDC cutters 18 are individually brazed to
a stud-like carrier (or substrate), which may be formed from
tungsten carbide, and are received and secured within sockets in
the respective blade.
[0009] A significant factor in determining the longevity of PDC
cutters is the generation of heat at the cutter contact point,
specifically at the exposed part of the PDC layer, caused by
friction between the PCD and the work material. This heat causes
thermal damage to the PCD in the form of cracks (due to differences
in thermal expansion coefficients) which lead to spalling of the
polycrystalline diamond layer, delamination between the
polycrystalline diamond and substrate, and back conversion of the
diamond to graphite causing rapid abrasive wear. The thermal
operating range of conventional PDC cutters is typically
700.degree. C. or less.
[0010] As mentioned, conventional polycrystalline diamond is stable
at temperatures of up to 700.degree. C., after which observed
increases in temperature may result in permanent damage to and
structural failure of polycrystalline diamond. This deterioration
in polycrystalline diamond is due to the significant difference in
the coefficient of thermal expansion of the binder material,
cobalt, as compared to diamond. Upon heating of polycrystalline
diamond, the cobalt and the diamond lattice will expand at
different rates, which may cause cracks to form in the diamond
lattice structure and result in deterioration of the
polycrystalline diamond. However, thermal fatigue does not only
occur at temperatures above 700.degree. C. Rather, the differential
expansion (between cobalt and diamond) even occurs at temperatures
as low as 300-400.degree. C., still causing thermal fatigue in the
diamond body. Further, damage to polycrystalline diamond can also
result from the loss of some diamond-to-diamond bonds (from the
initiation of a graphitization process) leading to loss of
microstructural integrity and strength loss.
[0011] In order to overcome this problem, strong acids may be used
to "leach" the binder from the diamond lattice structure (either a
thin volume or entire tablet) to at least reduce the damage
experienced from heating diamond-binder composite at different
rates upon heating. Examples of "leaching" processes can be found,
for example, in U.S. Pat. Nos. 4,288,248 and 4,104,344. Briefly, a
strong acid, typically nitric acid or combinations of several
strong acids (such as nitric and hydrofluoric acid) may be used to
treat the diamond table, removing at least a portion of the
co-catalyst from the PDC composite. By leaching out the binder,
thermally stable polycrystalline (TSP) diamond may be formed. In
certain embodiments, only a select portion of a diamond composite
is leached, in order to gain thermal stability without losing
impact resistance. As used herein, the term TSP includes both of
the above (i.e., partially and completely leached) compounds.
Interstitial volumes remaining after leaching may be reduced by
either furthering consolidation or by filling the volume with a
secondary material, such as by processes known in the art and
described in U.S. Pat. No. 5,127,923, which is herein incorporated
by reference in its entirety.
[0012] Accordingly, there exists a continuing need for developing
methods and apparatuses that accelerate the leaching process,
and/or reduce the hazards inherent in the leaching process.
SUMMARY
[0013] In one aspect, embodiments disclosed herein relate to a
cutting element that includes a polycrystalline diamond layer
having a cutting face and a diamond layer side surface, a substrate
attached to the polycrystalline diamond layer, the substrate having
a bottom surface and a substrate side surface, an interface between
the diamond layer and the substrate, and a mask covering at least
the bottom surface and the substrate side surface of the cutting
element.
[0014] In another aspect, embodiments disclosed herein relate to a
method for leaching a cutting element that includes providing a
cutting element, the cutting element having a substrate and
polycrystalline diamond layer attached to the substrate, masking at
least the substrate portion of the cutting element with a mask,
leaving an unmasked portion of the diamond layer of the cutting
element, placing the masked cutting element in a leaching agent,
wherein at least the unmasked portion of the cutting element
contacts the leaching agent, and removing the masked cutting
element from the leaching agent.
[0015] In yet another aspect, embodiments disclosed herein relate
to a method of leaching a cutting element that includes providing a
cutting element, the cutting element having a substrate and
polycrystalline diamond layer attached to the substrate, fitting at
least the substrate portion of the cutting element in a pre-formed
mask, leaving an unmasked portion of the diamond layer of the
cutting element, placing the cutting element in a leaching agent,
wherein at least the unmasked portion of the cutting element
contacts the leaching agent, and removing the cutting element from
the leaching agent.
[0016] Other aspects and advantages of the invention will be
apparent from the following description and the appended
claims.
BRIEF DESCRIPTION OF DRAWINGS
[0017] FIG. 1 is an illustration of a PCD drill bit.
[0018] FIG. 2 shows a PCD cutting element.
[0019] FIG. 3 is a cross-sectional view of a masked PCD cutting
element according to embodiments of the present disclosure.
[0020] FIGS. 4A-B show side views of masked PCD cutting elements
according to embodiments of the present disclosure.
[0021] FIGS. 5A-B is an illustration of steps for forming a masked
PCD cutting element according to embodiments of the present
disclosure.
[0022] FIG. 6 is a cross-sectional view of a masked cutting element
according to embodiments of the present disclosure.
DETAILED DESCRIPTION
[0023] Embodiments described herein relate to polycrystalline
diamond cutting elements and to methods of leaching the same.
Polycrystalline diamond cutting elements of the present disclosure
include a carbide substrate and a polycrystalline diamond layer
attached thereon. The methods of leaching described below include
protecting the carbide substrate from the leaching process.
[0024] As used herein, the term "PCD" refers to polycrystalline
diamond that has been formed, at high pressure/high temperature
(HPHT) conditions, through the use of a solvent metal catalyst,
such as those included in Group VIII of the Periodic Table. The
term "thermally stable polycrystalline diamond" (TSP), as used
herein, refers to intercrystalline bonded diamond that includes a
volume or region that has been rendered substantially free of the
solvent metal catalyst used to form PCD, or the solvent metal
catalyst used to form PCD remains in the region of the diamond body
but is otherwise reacted or rendered ineffective in its ability to
adversely impact the bonded diamond at elevated temperatures as
discussed above.
[0025] Referring to FIG. 2, a PCD cutting element 20 has a
polycrystalline diamond (PCD) layer 22 attached to a substrate 24.
The substrate 24 has a bottom surface 25 and a substrate side
surface 26. The PCD layer has a cutting face 27 and a diamond layer
side surface 28. An interface 23 is formed between the PCD layer 22
and the substrate 24. The diamond layer side surface 28 and the
substrate side surface 26 together form the outer surface of the
PCD cutting element. The outer surface of PCD cutting elements of
the present disclosure may be referred herein to as the "outer side
surface," the "side surface," the "outer circumferential surface,"
or the like.
[0026] Forming Polycrystalline Diamond
[0027] A PCD layer may be formed in a conventional manner, such as
by HPHT sintering of "green" particles to create intercrystalline
bonding between the particles. Examples of HPHT processes can be
found, for example, in U.S. Pat. Nos. 4,694,918; 5,370,195; and
4,525,178. Briefly, to form PCD, an unsintered mass of diamond
crystalline particles is placed within a metal enclosure of the
reaction cell of a HPHT apparatus. A metal catalyst, such as cobalt
or other Group VIII metals, may be included with the unsintered
mass of crystalline particles to promote intercrystalline
diamond-to-diamond bonding. The catalyst material may be provided
in the form of powder and mixed with the diamond grains, or may be
infiltrated into the diamond grains during HPHT sintering. An
exemplary minimum temperature is about 1200.degree. C. and an
exemplary minimum pressure is about 35 kbars. Typical processing is
at a pressure of about 45 kbar and 1300.degree. C. Those of
ordinary skill will appreciate that a variety of temperatures and
pressures may be used, and the scope of the present invention is
not limited to specifically referenced temperatures and
pressures.
[0028] Diamond grains useful for forming PCD may include any type
of diamond particle, including natural or synthetic diamond powders
having a wide range of grain sizes. For example, such diamond
powders may have an average grains size in the range from
submicrometer in size to 100 micrometers, and from 1 to 80
micrometers in other embodiments. Further, one skilled in the art
would appreciate that the diamond powder may include grains having
a mono- or multi-modal distribution.
[0029] Synthetic diamond powder is known to include small amounts
of solvent metal catalyst material and other materials entrained
within the diamond crystals themselves. Unlike synthetic diamond
powder, natural diamond powder does not include such solvent metal
catalyst material and other materials entrained within the diamond
crystals. It is theorized that the inclusion of materials other
than the solvent catalyst in the synthetic diamond powder can
operate to impair or limit the extent to which the resulting PCD
body can be rendered thermally stable, as these materials along
with the solvent catalyst must also be removed or otherwise
neutralized.
[0030] The diamond grain powder, whether synthetic or natural, may
be combined with or already includes a desired amount of catalyst
material to facilitate desired intercrystalline diamond bonding
during HPHT processing. Suitable catalyst materials useful for
forming the PCD body include those solvent metals selected from
Group VIII of the Periodic Table, with cobalt (Co) being the most
common, and mixtures or alloys of two or more of these materials.
In a particular embodiment, the diamond grain powder and catalyst
material mixture may comprise 85-95% by volume diamond grain powder
and the remaining amount catalyst material. Alternatively, the
diamond grain powder can be used without adding a solvent metal
catalyst in applications where the solvent metal catalyst can be
provided by infiltration during HPHT processing from the adjacent
substrate or adjacent other body to be bonded to the PCD body.
[0031] The diamond powder may be combined with the desired catalyst
material in a reaction cell, and the reaction cell is then placed
under processing conditions sufficient to cause the
intercrystalline bonding between the diamond particles. In the
event that the formation of a PCD compact comprising a substrate
bonded to the PCD body is desired, a selected substrate is loaded
into the container adjacent the diamond powder mixture prior to
HPHT processing. Additionally, in the event that the PCD body is to
be bonded to a substrate, and the substrate includes a metal
solvent catalyst, the metal solvent catalyst needed for catalyzing
intercrystalline bonding of the diamond may be provided by
infiltration, in which case it may not be necessary to mix the
diamond powder with a metal solvent catalyst prior to HPHT
processing.
[0032] During HPHT processing, the catalyst material in the mixture
melts and infiltrates the diamond grain powder to facilitate
intercrystalline diamond bonding. During the formation of such
intercrystalline diamond bonding, the catalyst material may migrate
into the interstitial regions within the microstructure of the
so-formed PCD body that exists between the diamond bonded grains.
It should be noted that if too much additional non-diamond material
is present in the powdered mass of crystalline particles,
appreciable intercrystalline bonding is prevented during the
sintering process. Such a sintered material where appreciable
intercrystalline bonding has not occurred is not within the
definition of PCD. Following such formation of intercrystalline
bonding, a PCD body may be formed that has, in one embodiment, at
least about 80 percent by volume diamond, with the remaining
balance of the interstitial regions between the diamond grains
occupied by the catalyst material. In other embodiments, such
diamond content may comprise at least 85 percent by volume of the
formed PCD body, and at least 90 percent by volume in yet another
embodiment. However, one skilled in the art would appreciate that
other diamond densities (or gradients of diamond densities) may be
used in alternative embodiments. For example, in some embodiments,
the PCD bodies being leached in accordance with the present
disclosure include what is frequently referred to in the art as
"high density" PCD, which refers to a diamond body having a diamond
content of at least 90 percent by volume. However, in other
embodiments, the high density PCD used in the method of the present
disclosure may have a density of at least 92 percent by volume up
to 97 percent by volume. One skilled in the art would appreciate
that conventionally, as diamond density increases, the leaching
time (and potential inability to effectively leach) similarly
increases.
[0033] Masking a Cutting Element
[0034] The PCD layer may be attached to a substrate during the
formation of the PCD layer or subsequent to forming the PCD layer.
Embodiments disclosed herein may have carbide substrate such as,
for example, a cemented tungsten carbide substrate formed from
tungsten carbide particles dispersed in a binder metal matrix, such
as iron, nickel, or cobalt.
[0035] Once the PCD layer is attached to the substrate, a mask may
then be applied to the cutting element such that the mask covers at
least the entire outer surface of the substrate. In embodiments of
the present disclosure, the mask may also cover a portion of the
outer side surface of the diamond layer. As used herein, a "mask"
refers to a masking coating, a pre-formed mask or an institute mask
that coats the outer surface of a portion of a cutting element to
protect the masked portion from a leaching environment. In certain
embodiments, the term "mask" may be interchangeable with the term
"masking coating" or "coating." In other embodiments described
below, the term "mask" may be interchangeable with the term
"pre-formed mask" or "institute mask."
[0036] Referring to FIG. 3, a PCD cutter 30 has a PCD layer 32
attached to a substrate 34. The substrate 34 has a bottom surface
35 and a substrate side surface 36. The PCD layer has a cutting
face 37 and a diamond layer side surface 38. An interface 33 is
formed between the PCD layer 32 and the substrate 34. The substrate
side surface 36 and the diamond layer side surface 38 form the
outer circumferential surface of the PCD cutter 30. Additionally,
as shown in FIG. 3, the intersection of the diamond layer side
surface 38 and the cutting face 37 forms a cutting edge 39, which
in this case is a bevel. A mask 31 is applied to the outer surface
of the PCD cutter 30 such that it covers the entire bottom surface
35 of the substrate and extends a distance D from the bottom
surface 35 up the outer circumferential surface of the PCD cutter
30 toward the cutting face 37 to cover the entire substrate side
surface 36 and a portion of the diamond layer side surface 38.
[0037] In some embodiments, a mask may extend a uniform distance
around the outer side surface of a cutting element from the bottom
surface. In other embodiments, a mask may be applied to the outer
surface of a cutting element such that the mask extends a
non-uniform distance around the outer circumferential surface of
the cutting element from the bottom surface toward the cutting face
of the cutting element. For example, referring to FIGS. 4A and 4B,
masked cutting elements are shown as having a mask extending up the
side surface of the cutting elements. In FIG. 4A, the mask 41
extends the same distance D around the outer side surface of a
cutting element 40 such that the mask has a planar top end 41a that
is parallel with the cutting face 47. In FIG. 4B, the mask 41
extends up the side surface of a cutting element 40 to varying but
continuous distances D.sub.1, D.sub.2, etc. along the outer
circumferential surface of the cutting element 40 such that the
mask 41 has a slanted top end 41a (i.e., not parallel to the
cutting face). It is within the scope of this disclosure that the
top of the mask may form other non-planar, or non-continuous
shapes. For example, in some embodiments, the unmasked portion of
the cutting element may be designed to have a particular shape or
depth (from the cutting face) such that upon leaching the unmasked
portion, residual stresses in the PCD cutting element are
minimized.
[0038] A mask may be applied to a cutting element by applying a
masking coating to the outer surface of a cutting element.
According to embodiments of the present disclosure, a masking
coating may include diamond-like carbon ("DLC") material. As used
herein, the term "DLC" or diamond-like carbon" refers to an
amorphous carbonaceous coating that possesses a significant amount
of (if not all) sp.sup.3 hybridization, with a balance of sp.sup.2
hybridization. While diamond is traditionally formed in a cubic
crystal structure, DLC is amorphous due to the mixture of cubic and
hexagonal lattice structure (mixed layer by layer) formed as a
result of a high energy process (i.e., PE-CVD, among others). Thus,
while DLC can contain pure sp.sup.3 carbon and/or a mixture of
sp.sup.3 and sp.sup.2 carbon, it has no long range crystalline
order and is referred to as "amorphous." DLC masking coatings may
be applied to the outer surface of a cutting element by chemical
vapor deposition (CVD) methods, including plasma enhanced chemical
vapor deposition (PE-CVD), and hallow cathode PE-CVD, for
example.
[0039] To apply a DLC masking coating, a carbon precursor such as
methane, acetylene, butane, toluene, etc, may be used as the source
gas. Properties of the coating may be tailored by adjusting the
sp.sup.3 (diamond), sp.sup.2 (graphite) and sp.sup.1 (linear)
bonding hybridization ratios in the coating, by varying the source
gas and hydrogen content. For example, the highest sp.sup.3 ratio
(most diamond-like) is obtained by methane, but this also may
produce a lower deposition rate compared to higher carbon molecules
and also a higher compressive stress, limiting film thickness to
approximately 5000 Angstroms. The addition of certain dopants
(e.g., silicon or silicon oxide) to the DLC matrix may improve
thermal stability and may reduce compressive stress. An
organic-based precursor, such as hexemethyldisiloxane can be mixed
with the hydrocarbon precursor(s) to introduce these dopants.
[0040] Additionally, it is also within the scope of the present
disclosure that multiple layers of coatings may be deposited. For
example, to produce a thick deposited coating, the deposition
process can be modified by deposition of a thin methane-based
layer, followed by the use of a higher deposition rate, lower
stress precursors such as toluene, or by higher energy ion
bombardment to increase adhesion and reduce stress. Alternatively,
several layers, including DLC and non-DLC layers, may be deposited
on the cutting element. For example, multiple layers may be applied
to the cutting element under a DLC top layer to promote
adhesion.
[0041] Further, masking coatings according to embodiments of the
present disclosure may include a wide range of inert materials that
are able to sustain strong acid attack under elevated temperature
and pressure. For example, masking coatings of the present
disclosure may include chemical resistant air dry inks, chemical
resistant UV cured inks, Teflon, and microwave cured materials.
Masking coatings made of such materials may be applied by sputter
coating, physical vapor deposition, CVD, or other spray coating
methods, for example.
[0042] Additionally, it is also within the scope of the present
disclosure that multiple layers of coatings may be deposited.
According to some embodiments having multiple layers of coatings, a
first layer may coat the majority of the cutting element and a
second layer may coat only the interface area, or potential gaps,
between the cutting element and the first layer. For example,
referring to FIG. 6, a mask coating 61 may have potential gaps, or
crevices, at the mask top end 61a, between the mask 61 and the
cutting element 60. In such instances, a second layer 68 of coating
or masking material may be applied to the top end 61a of the mask
in order to seal any potential gaps. Advantageously, the first
layer may offer processing protection, while the second layer may
further prevent processing materials from invading the protected
area. The second layer may be made of the same material or a
different type of material as required to provide an adequate seal
at the interface area. In other embodiments having multiple layers
of coatings, a first layer may be applied to coat only the
protected area of the cutting element and the second layer may be
applied to seal any potential voids or holes in the first layer,
i.e., the second layer may be applied over the first layer.
[0043] The masking coating deposited may depend on the number of
layers, but may generally be less than 200 microns. In particular,
the masking coating may be applied so that the mask has a thickness
ranging from about 1 micron to about 200 microns. In other
embodiments, the masking coating may have a thickness ranging from
about 0.5 microns to about 20 microns. While thinner coatings may
reduce cost and the likelihood of spalling, defects inside the
coating may cause leaching acid to leak in. Thicker coatings may
improve continuity of the coating and prevent such acid leakage.
Thus, the thickness of the masking coating may depend on, for
example, the type of coating and the surface roughness of the
surface to be coated.
[0044] Advantageously, by masking at least the substrate portion of
a cutting element with a masking coating, a protective seal is
formed around the masked portion of the cutting element, thereby
shielding it from a leaching environment. The leaching environment,
while beneficial in forming TSP in a cutting element, may be
detrimental to the substrate portion of the cutting element. In
particular, the leaching agent may remove or react with the binder
material that holds the substrate together. By forming a barrier on
the substrate by use of a masking coating, leaching agents are
unable to attack and weaken the substrate.
[0045] According to other embodiments of the present disclosure, a
pre-formed mask may be fitted around a PCD cutting element to
protect at least the substrate of a PCD cutting element during a
leaching process. As used herein, a "pre-formed mask" refers to a
material that has been extruded into the shape of a cup, into which
a cutting element snugly fits. A pre-formed mask may also be
referred to as a pod, shell, casing, or other like terminology. A
pre-formed mask differs from the masking coating described above in
that the pre-formed mask holds its shape (i.e., holds the shape of
a cup). A pre-formed mask may have special properties that allow
the pre-formed mask to reduce in size or shrink in the form of an
encapsulating device around a cutting element by use of heat, ultra
violet radiation, microwave, etc. However, similar to the masking
coating described above, a pre-formed mask covers, or coats, the
outer surface of at least the substrate of a cutting element to
protect it from a leaching environment.
[0046] In particular, a pre-formed mask may be formed by extruding
polyvinyl chloride or other suitable materials, such as any
acid-proof material, a high temperature material, and/or plastics
such as polyvinylidene fluoride, into the shape of a cup. Methods
of extruding a pre-formed mask include any that are known to those
skilled in the art, including, for example, thermoforming, tubing
extruding, or blown film extrusion methods. Once the pre-formed
mask is fitted around a cutting element, a second layer material
may be applied at the interface area between the pre-formed mask
and the cutting element to provide additional sealing protection,
such as described above.
[0047] Referring now to FIGS. 5A and 5B, a PCD cutting element
masked with a pre-formed mask is shown. In FIG. 5A, a pre-formed
mask 51 is extruded into a cup shape having a bottom 51c and a
cylindrically-shaped wall 51b extending perpendicular from the
bottom 51c. The wall 51b has a thickness t and a height H.
According to embodiments of the present disclosure, a pre-formed
mask may have a wall thickness t. The thickness t may be determined
based on the ability of the pre-formed mask material to resist
process chemical attack over time and on the temperature of the
process and temperature limitations of the pre-formed mask
material. A PCD cutter 50 having a polycrystalline diamond layer 52
attached to a substrate 54 may then be fitted into the pre-formed
mask 51 by inserting the cutter 50, substrate 54 end first, through
the top end 51a of the pre-formed mask 51. The pre-formed mask 51
may be made so that the inner diameter is only slightly larger than
the diameter of the cutter 50, thereby providing a snug fit between
the pre-formed mask 51 and the cutter 50. As shown in FIG. 5B, the
pre-formed mask 51 covers at least the substrate and extends over a
portion of the diamond layer 52. In some embodiments, a pre-formed
mask may have a wall height H that covers only the substrate. In
other embodiments, the wall height may extend over the substrate
outer surface to about 1 to 1.5 mm from the cutting surface of the
diamond layer.
[0048] According to embodiments of the present disclosure, a
pre-formed mask may be fitted around a cutting element by inserting
the cutting element into a pre-formed mask, placing the assembly in
a vacuum, and applying heat to the pre-formed mask to tighten the
pre-formed mask around the cutting element. It should be
appreciated that depending on the type of material used to make the
pre-formed mask, different vacuum pressures and temperatures may be
used to shrink-fit the pre-formed mask to the cutting element. A
sealing process, as described above, may then be used to seal the
top part of the pre-formed mask to the outer surface of the cutting
element.
[0049] According to yet other embodiments of the present
disclosure, an institute mask may be formed around a PCD cutting
element to protect at least the substrate of a PCD cutting element
during a leaching process. As used herein, an "institute mask"
refers to a material that encases one or more cutting elements by
injection molding or similar practices known in the art. An
institute mask may be made of the protective mask materials
described above, such as plastics, acid-proof materials, and/or
high temperature materials. Methods of encasing one or more cutting
elements with an institute mask may include, for example, enclosing
one or more cutting elements into a single block or fixture. A
protective material used to form the institute mask may then be
injected into the block or fixture around the one or more cutting
elements to encase the cutting elements, thereby forming the
institute mask. Advantageously, by using injection molding
practices to form an institute mask, one or more cutting elements
may be coated with a protective material during a single process,
thereby reducing processing time.
[0050] Leaching
[0051] Upon masking a PCD cutting element according to embodiments
of the present disclosure, the masked cutting element may be
subjected to a leaching process. The seal formed between the mask
and the PCD cutting element prevent leaching agents from
contacting, and thus removing material from the part of the cutting
element protected by the mask. Thus, when subjecting a masked PCD
cutting element according to embodiments of this disclosure to a
leaching process, the catalyst material is removed only from the
unmasked portion of the PCD cutting element, which includes at
least a portion of the PCD layer.
[0052] As used herein, the term "removed" refers to the reduced
presence of catalyst material in the PCD layer, and is understood
to mean that a substantial portion of the catalyst material no
longer resides in the leached PCD. However, one skilled in the art
would appreciate that trace amounts of catalyst material may still
remain in the microstructure of the leached PCD layer within the
interstitial regions and/or adhered to the surface of the diamond
grains. Alternatively, rather than actually removing the catalyst
material from the leached portion of the PCD layer, the selected
region of the PCD layer can be rendered thermally stable by
treating the catalyst material in a manner that reduces or
eliminates the potential for the catalyst material to adversely
impact the intercrystalline bonded diamond at elevated
temperatures. For example, the catalyst material may be combined
chemically with another material to cause it to no longer act as a
catalyst material (or to have less thermal mismatch with diamond),
or can be transformed into another material that again causes it to
no longer act as a catalyst material (or to have less thermal
mismatch with diamond). Accordingly, as used herein in reference to
the catalyst material, the terms "removing substantially all" or
"substantially free" is intended to cover the different methods in
which the catalyst material can be treated to no longer adversely
impact the intercrystalline diamond in the leached portion of the
PCD layer with increasing temperature.
[0053] The quantity of the catalyst material remaining in the PCD
microstructure after the PCD layer has been subjected to a leaching
treatment may vary, for example, on factors such as the treatment
conditions, including treatment time. Further, one skilled in the
art would appreciate that it may be acceptable or desired in
certain applications to allow a small amount of catalyst material
to stay in the leached area of the PCD layer. In a particular
embodiment, the leached area of the PCD layer may include up to 1-2
percent by weight of the catalyst material. However, one skilled in
the art would appreciate that the amount of residual catalyst
present in the leached area of a PCD layer may depend on the
diamond density of the material and the thickness of the area
leached.
[0054] As described above, a conventional leaching process involves
the exposure of an object to be leached with a leaching agent, such
as described in U.S. Pat. No. 4,224,380, which is herein
incorporated by reference in its entirety. In select embodiments,
the leaching agent may be a weak, strong, or mixtures of acids. In
other embodiments, the leaching agent may be a caustic material
such as NaOH or KOH. Suitable acids may include, for example,
nitric acid, hydrofluoric acid, hydrochloric acid, sulfuric acid,
phosphoric acid, or perchloric acid, or combinations of these
acids. In addition, other acidic and basic leaching agents may be
used as desired. Those having ordinary skill in the art will
appreciate that the molarity of the leaching agent may be adjusted
depending on the time desired to leach, concerns about hazards,
etc.
[0055] PCD cutting elements that have been masked according to
embodiments of the present disclosure may be leached by
conventional means. For example, a masked PCD cutting element may
be placed in a leaching agent bath, wherein the masked PCD cutting
element is placed in the bath container with the PCD layer facing
the bottom of the container so that the PCD layer may be fully
immersed in the leaching agent. Other exemplary leaching methods
may also include subjecting the PCD cutting element to increased
pressures and/or increased temperatures in addition to immersing
the PCD layer in a leaching agent.
[0056] In an embodiment of the present disclosure, a masked PCD
cutting element may be held in place during the leaching process to
ensure more controlled exposure of the PCD layer to the leaching
bath. In particular, a masked PCD cutting element may be held in
place above a leaching agent bath such that a specific amount of
the PCD layer (e.g., a uniform distance from the cutting face of
the PCD layer) is immersed in the leaching agent. Means of holding
a masked PCD cutting element in place during the leaching process
may include using a magnetic capturing device. For example, a
masked PCD cutting element according to embodiments of the present
disclosure may be held by a magnetic capturing device so that the
area immersed in a leaching agent bath includes the distance of the
desired leaching depth. In some embodiments, the desired leaching
depth may range from about 1,000 microns to about 2/3 of the
diamond table thickness from the cutting face of the PCD layer. In
other embodiments, the desired leaching depth may range from about
600 microns to about 800 microns.
[0057] A magnetic capturing device may be a fixture, form, frame or
other shape that has strong magnets imbedded within it that may be
used to attract and hold cutting elements, once coated or masked,
in place during the chemical process. The protected cutting
elements may be held in such a manner as to suspend them in a
liquid chemical or otherwise held and exposed to a vapor or mist
chemical for processing. In other embodiments, the use of a strong
magnet may also be used to fabricate a fixture or device for
holding the cutting element during application, curing, etc. of a
mask and then again during the mask removal process. In embodiments
using a magnetic capturing device, the magnets may be protected by
the device casing or by other means from the processing
environments, including during applying a mask, leaching, and
removing a mask.
[0058] Removal of Coatings
[0059] According to embodiments of the present disclosure, upon
leaching an unmasked portion of a cutting element, masks may be
removed by thermal, mechanical, or other processes. Processes that
will cause the mask materials to breakdown or weaken may be used to
remove the mask, which may be chosen based on the time, cost, and
susceptibility of the mask material to break down. For example,
according to some embodiments of the present disclosure, masks may
be removed by grit blasting or grinding in order to break the bond
between the surface of the cutting element and the mask.
[0060] Advantageously, by leaching a masked PCD cutting element
according to embodiments of the present disclosure, greater control
may be exercised over the size and shape of the PCD cutting element
that is leached. For example, partially leached prior art PCD
cutting elements are typically limited to having a planar interface
between the portion of PCD that is exposed to a leaching agent and
the remaining portion of the PCD cutting element. However,
embodiments of the present disclosure may have curved or other
non-planar unmasked sections of the PCD cutting element to be
leached. Thus, higher stress regions of a PCD cutting element may
be targeted and selectively leached according to embodiments
disclosed herein. Furthermore, by using DLC materials to mask a
cutting element, the DLC mask provides resistance to leaching acids
and to increased processing temperatures and pressures, while also
being able to form a strong bond with the cutting element.
[0061] While the invention has been described with respect to a
limited number of embodiments, those skilled in the art, having
benefit of this disclosure, will appreciate that other embodiments
can be devised which do not depart from the scope of the invention
as disclosed herein. Accordingly, the scope of the invention should
be limited only by the attached claims.
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