U.S. patent application number 13/281850 was filed with the patent office on 2012-02-16 for method for manufacturing heat sink having heat-dissipating fins and structure of the same.
This patent application is currently assigned to NENG TYI PRECISION INDUSTRIES CO., LTD.. Invention is credited to WEN-CHEN WEI.
Application Number | 20120037351 13/281850 |
Document ID | / |
Family ID | 39642625 |
Filed Date | 2012-02-16 |
United States Patent
Application |
20120037351 |
Kind Code |
A1 |
WEI; WEN-CHEN |
February 16, 2012 |
METHOD FOR MANUFACTURING HEAT SINK HAVING HEAT-DISSIPATING FINS AND
STRUCTURE OF THE SAME
Abstract
A method for manufacturing a heat sink having heat-dissipating
fins and a structure of the same are provided. The method includes
the steps of: providing a substrate comprising a center portion and
a plurality of extending arms, a gap being provided between each
two adjacent extending arms; providing a plurality of
heat-dissipating fins, the heat-dissipating fins being inserted
into the gaps between the extending arms, each heat-dissipating fin
comprising a base piece and two heat-dissipating plates; and
bending and pressing each extending arm of the substrate with one
of the two opposite side walls of each extending arm abutting
against one of the two opposite surface of each heat-dissipating
plate. Via the above arrangement, the present invention has an
effect of avoiding the heat transfer loss.
Inventors: |
WEI; WEN-CHEN; (TAIPEI
HSIEN, TW) |
Assignee: |
NENG TYI PRECISION INDUSTRIES CO.,
LTD.
TAIPEI HSIEN
TW
|
Family ID: |
39642625 |
Appl. No.: |
13/281850 |
Filed: |
October 26, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12073720 |
Mar 10, 2008 |
8087456 |
|
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13281850 |
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Current U.S.
Class: |
165/185 |
Current CPC
Class: |
F21V 29/773 20150115;
H01L 23/3672 20130101; B23P 15/26 20130101; B23P 2700/10 20130101;
H01L 2924/0002 20130101; Y10T 29/4935 20150115; F21V 29/71
20150115; F21V 29/86 20150115; H01L 2924/0002 20130101; F21V 29/89
20150115; F21V 29/77 20150115; H01L 2924/00 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 7/00 20060101
F28F007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 16, 2008 |
TW |
97101661 |
Claims
1. A structure of a heat sink having heat-dissipating fins,
comprising: a substrate comprising a center portion and a plurality
of extending arms, the center portion having a top surface, a
bottom surface and two side walls, the extending arms extending
from the side walls of the center portion with two gaps
respectively provided between each extending arm and two adjacent
extending arms; and a plurality of heat-dissipating fins each
comprising a base piece and heat-dissipating plates connected on
both sides of the base piece, each heat-dissipating plate having a
top end and a bottom end, both heat-dissipating plates of each
heat-dissipating fin being inserted into the gaps between the
corresponding extending arm and two adjacent extending arms, one of
the two opposite side walls of each extending arm abutting against
one of the two opposite surfaces of each heat-dissipating plate,
the top and bottom ends of the two heat-dissipating plates of each
heat-dissipating fin protruding from the top and bottom surfaces of
the substrate.
2. The structure of a heat sink having heat-dissipating fins
according to claim 1, wherein the center portion is a circular
plate.
Description
RELATED APPLICATIONS
[0001] This application is a Divisional patent application of
co-pending application Ser. No. 12/073,720, filed on 10 Mar. 2008,
now pending. The entire disclosure of the prior application, Ser.
No. 12/073,720, from which an oath or declaration is supplied, is
considered a part of the disclosure of the accompanying Divisional
application and is hereby incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention is related to a method for
manufacturing a heat sink having heat-dissipating fins and a
structure of the same, and in particular to a method for
manufacturing a heat sink having heat-dissipating fins and a
structure of the same whereby solder for welding the
heat-dissipating fins can be avoided.
[0004] 2. Description of Related Art
[0005] Heat sinks are widely used with heat-generating electronic
elements such as CPUs or lamps (e.g. halogen lamp, LED lamp etc.),
thereby facilitating heat dissipation. The heat sink having
heat-dissipating fins is the most popular heat sink. FIG. 1 shows a
conventional heat sink, in which a plurality of heat-dissipating
fins 13 is arranged equidistantly on the top surface 111 of a base
11 by means of soldering.
[0006] The heat-dissipating fins 13 are used to increase the
heat-dissipating area. With the bottom surface 112 of the base 11
contacting a heat source, the base 11 absorbs the heat and
transmits the heat rapidly to surfaces 131 of each heat-dissipating
fin 13, thereby facilitating the heat dissipation.
[0007] Since the heat-dissipating fins 13 are welded on the top
surface 111 of the base 11, and the heat transfer coefficient of
the solder 12 is different from that of the base 11 or the
heat-dissipating fins 13, the solder 12 may cause some heat
transfer loss when the heat is transmitted to the heat-dissipating
fins 13, which affects the heat-dissipating effect of the
heat-dissipating fins 13. Therefore, it is an important issue to
develop a heat sink that is capable of dissipating the heat
efficiently.
[0008] Consequently, because of the above technical defects, the
inventor keeps on carving unflaggingly through wholehearted
experience and research to develop the present invention, which can
effectively improve the defects described above.
SUMMARY OF THE INVENTION
[0009] In view of the above problems, the object of the present
invention is to provide a method for manufacturing a heat sink
having heat-dissipating fins and a structure of the same, whereby
the solder can be avoided to reduce the heat transfer loss and the
heat dissipation of electronic elements can be achieved.
[0010] According to one aspect of the present invention, the
present invention provides a method for manufacturing a heat sink
having heat-dissipating fins, which includes the steps of:
providing a substrate comprising a center portion and a plurality
of extending arms, the center portion having a top surface, a
bottom surface and side walls, the extending arms extending from
the side walls of the center portion with a gap provided between
each extending arm and two adjacent extending arms; providing a
plurality of heat-dissipating fins, the heat-dissipating fins being
inserted into the gaps between the corresponding extending arms of
the substrate, each heat-dissipating fin comprising a base piece
and heat-dissipating plates connected on both sides of the base
piece, the two heat-dissipating plates of each heat-dissipating fin
being inserted into the gaps between the corresponding extending
arm and two adjacent extending arms, each heat-dissipating plate
having a top end and a bottom end; and bending and pressing each
extending arm of the substrate with one of the two opposite side
walls of each extending arm abutting against one of the two
opposite surfaces of each heat-dissipating plate, the top and
bottom ends of the two heat-dissipating plates of each
heat-dissipating fin protruding from the top and bottom surfaces of
the substrate.
[0011] Alternatively, in the above-mentioned steps, two substrates
that are overlapped with each other can be provided. Each extending
arm of one of the substrates corresponds to each gap of the other
substrate. Each heat-dissipating fin is inserted into the gap
between the two corresponding extending arms of the two
substrates.
[0012] According to another aspect of the present invention, the
present invention further provides a structure of a heat sink
having heat-dissipating fins, which includes: a substrate
comprising a center portion and a plurality of extending arms, the
center portion having a top surface, a bottom surface and two side
walls, the extending arms extending from the side walls of the
center portion with a gap provided between each extending arm and
two adjacent extending arms; and a plurality of heat-dissipating
fins each comprising a base piece and heat-dissipating plates
connected on both sides of the base piece, each heat-dissipating
plate having a top end and a bottom end, both heat-dissipating
plates of each heat-dissipating fin being inserted into the gap
between the corresponding extending arm and two adjacent extending
arms, one of the two opposite side walls of each extending arm
abutting against one of the two opposite surfaces of each
heat-dissipating plate, the top and bottom ends of the two
heat-dissipating plates of each heat-dissipating fin protruding
from the top and bottom surfaces of the substrate.
[0013] Alternatively, two substrates can be provided and they are
overlapped with each other. Each extending arm of one substrate
corresponds to each gap of the other substrate. The two
heat-dissipating plates of each heat-dissipating fin are inserted
into the gaps between the corresponding extending arm and two
adjacent extending arms of the two substrates.
[0014] The present invention has advantageous effects as follows.
Since the heat-dissipating fins are inserted into the gaps
respectively between each extending arm of the substrate, and the
two side walls of each extending arm abut against and thus fix the
heat-dissipating plate and the heat-dissipating fin, in comparison
with the prior art of welding the heat-dissipating fins by solder,
the present invention avoids the heat transfer loss caused by
solder. Further, the overall manufacturing steps of the present
invention are simple without increasing the difficulty in
assembling and manufacturing processes.
[0015] Next, the top surface or bottom surface of the substrate, or
one top surface or bottom surface of the two substrates can be
adhered to contact heat-generating electronic elements. The top and
bottom ends of each heat-dissipating plate protrude from the top
and bottom surfaces of the substrate. Via this arrangement, the
cooling airflow or the airflow of a heat source can be flowed
into/out of the top and bottom surfaces of the substrate in two
ways. In this way, the heat dissipation of the electronic elements
can be achieved more easily.
[0016] In order to further understand the techniques, methods and
effects employed by the present invention to achieve the desired
objects, a detailed description relating thereto will be made with
reference to the accompanying drawings. In this way, the objects,
characteristics and features of the present invention can be
appreciated more thoroughly. However, the drawings are illustrative
only, but not used to limit the scope of the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] FIG. 1 is a perspective view showing a conventional heat
sink;
[0018] FIG. 2 is a flow chart of the method of the present
invention;
[0019] FIG. 3 is a perspective view showing the substrate of the
present invention;
[0020] FIG. 4 is a partially exploded perspective and assembled
view showing the substrate and the heat-dissipating fins of the
present invention;
[0021] FIG. 5 is an assembled perspective view showing the
substrate and the heat-dissipating fins of the present
invention;
[0022] FIG. 6 is a front view showing the portion A of FIG. 5;
[0023] FIG. 7 is an exploded perspective view showing the substrate
of another embodiment of the present invention;
[0024] FIG. 8 is an exploded perspective view (I) showing the
heat-dissipating fins and the substrate of another embodiment of
the present invention; and
[0025] FIG. 9 is an exploded perspective view (II) showing the
heat-dissipating fins and the substrate of another embodiment of
the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0026] Please refer to FIGS. 2 to 5. The present invention provides
a method for manufacturing a heat sink having heat-dissipating fins
and a structure of the same. The method includes the steps as
follows.
[0027] (1) A substrate 2 is provided. The substrate 2 comprises a
center portion 21 and a plurality of extending arms 22. The center
portion 21 has a top surface 211, a bottom surface 212 and side
walls 213. The extending arms 22 extend from the side walls 213 of
the center portion 21. A gap 23 is provided between each extending
arm 22 and two adjacent extending arms 22 respectively.
[0028] (2) A plurality of heat-dissipating fins 3 is provided. The
heat-dissipating fins 3 are inserted into the gaps 23 between the
corresponding extending arms 22 of the substrate 2 respectively.
Each heat-dissipating fin 3 comprises a base piece 31 and two
heat-dissipating plates 32 connected on both sides of the base
piece 31.
[0029] The two heat-dissipating plates 32 of each heat-dissipating
fin 3 are inserted into the gaps 23 between the corresponding
extending arm 22 and the two adjacent extending arms 22
respectively. Each heat-dissipating plate 32 has a top end 321 and
a bottom end 322.
[0030] (3) Each extending arm 22 of the substrate 2 is bent and
pressed, so that one of the two opposite side walls 223 of each
extending arm 22 abuts against one of the two opposite surfaces 323
of each heat-dissipating plate 32, as shown in FIG. 6. At the same
time, the top and bottom ends 321, 322 of the two heat-dissipating
plates 32 of each heat-dissipating fin 3 protrude from the top and
bottom surfaces 211, 212 of the center portion 21 of the substrate
2. In this way, a heat sink product can be obtained.
[0031] In the above step (3) of bending and pressing, the free end
of each extending arm 22 is bent (upwardly or downwardly, and an
upward bending is shown in the present invention) toward the center
portion 21, so that each extending arm 22 is bent to point upwards
or downwards from the side walls 213 of the center portion 21.
Further, each extending arm 22 is pressed in such a manner that
both side wall surfaces 221 abut against the heat-dissipating
plates 32 of the corresponding heat-dissipating fin 3. In this way,
each heat-dissipating fin 3 can be fixed to the side edge of the
center portion 21 firmly.
[0032] According to the above description, the structure of the
heat sink of the present invention includes the above substrate 2
and a plurality of heat-dissipating fins 3. Each extending arm 22
of the substrate 2 is bent to extend from the side walls 213 of the
center portion 21. A gap 23 is formed between each extending arm 22
and two adjacent extending arms 22 respectively. Each
heat-dissipating fin 3 is provided in the gap 23 between the
corresponding extending arms 22 of the substrate 2. One of the two
side wall surfaces 221 of each extending arm 22 abuts against one
of the two surfaces 323 of each heat-dissipating plate 32. The top
end 321 and the bottom end 322 of the two heat-dissipating plates
32 of each heat-dissipating fin 3 protrude from the top surface 211
and the bottom surface 212 of the substrate 2.
[0033] The center portion 21 of the above substrate 2 can be a
circular plate. Thus, each extending arm 22 is radially provided on
the side walls 213 of the circular plate-like center portion 21. Of
course, the above center portion 21 can be a polygonal plate (such
as quadrangle). The extending arms 22 are formed to extend from
each side wall 213 of the center portion 21 respectively.
Preferably, the center portion 21 is a circular plate. Therefore,
the above step (2) of inserting the heat-dissipating fins 3 can be
performed automatically, thereby achieving mass production. More
specifically, each heat-dissipating fin 3 can be inserted on the
substrate 2 manually in sequence. Of course, the insertion can be
performed automatically, thereby achieving mass production. In
addition, the substrate 2 and the heat-dissipating fins 3 can be
made of the same metallic material having a heat-dissipating
effect, such as copper and aluminum.
[0034] Please refer to FIGS. 7 and 9, which show another
embodiment. The difference between the present embodiment and the
previous embodiment lies in that:
[0035] (1) Two substrates 2, 2' are provided. The two substrates 2,
2' are overlapped with each other. Each extending arm 22' of one
substrate 2' corresponds to each gap 23 of the other substrate 2,
so that the extending arms 22, 22' of the two substrates 2, 2' are
arranged alternatively in the vertical direction.
[0036] (2) Each heat-dissipating fin 3 is inserted in the gaps 23,
23' of the corresponding extending arms 22, 22' of the two
substrates 2, 2'. Both heat-dissipating plates 32 of each
heat-dissipating fin 3 are inserted into the gaps 23, 23' between
the extending arms 22, 22' and two adjacent extending alms 22,
22'.
[0037] (3) Each of the extending arms 22, 22' of the two substrates
2, 2' is bent and pressed, so that one of the two opposite side
wall surfaces 221, 221'abuts against one of the two opposite
surfaces 323 of each heat-dissipating plate 32.
[0038] As shown in FIG. 8, in the step (3) of bending and pressing
of the present embodiment, the free ends of the extending arms 22,
22' of the two substrates 2, 2' are bent (upwardly or downwardly)
toward the two center portions 21, 21' in the same direction.
Alternatively, as shown in FIG. 9, the free ends of the extending
arms 22, 22' of the two substrates 2, 2' are bent toward the two
center portions 21, 21' in opposite directions. That is to say, the
free end of each extending arm 22 of one substrate 2 is opposite to
the free end of each extending arm 22' of the other substrate
2'.
[0039] According to the above, the structure of the heat sink of
the present embodiment includes two substrates 2, 2' that are
overlapped with other and a plurality of heat-dissipating fins 3.
The extending arms 22, 22' of each substrate 2, 2' are bent to
extend from the side walls 213, 213' of the center portions 21,
21'. Each extending arm 22' of one substrate 2' corresponds to each
gap 23 of the other substrate 2.
[0040] Each heat-dissipating fin 3 is provided in the gaps 23, 23'
between the corresponding extending arms 22, 22' of the two
substrates 2, 2'. Two heat-dissipating plates 32 of each
heat-dissipating fin 3 are inserted into the gaps 23, 23' between
the corresponding extending arms 22, 22' and two adjacent extending
arms 22, 22'. One of the two side wall surfaces 221, 221' of each
extending arm 22, 22' abuts against one of the two opposite
surfaces 323 of each heat-dissipating plate 32.
[0041] In addition, the free ends of the extending arms 22, 22' of
the two substrates 2, 2' extend in the same direction.
Alternatively, the free ends of the extending arms 22, 22' of the
two substrates 2, 2' extend in opposite directions.
[0042] According to the above description, in the present
invention, the heat-dissipating fin 3 is inserted into the gaps 23,
23' respectively between each extending arm 22, 22'of the substrate
2, 2', and the two side walls 221, 221' of each extending arm 22,
22' abut against and thus fix the heat-dissipating plates 32 and
the heat-dissipating fins 3. In comparison with the prior art of
welding the heat-dissipating fins by solder, the present invention
avoids the heat transfer loss caused by solder. Further, the
overall manufacturing steps of the present invention are simple
without increasing the difficulty in assembling and manufacturing
processes. Further, avoiding the solder conforms to the concept of
environmental protection (because the solder usually contains lead,
while the lead-free solder has increased cost.)
[0043] Next, the top surface 211 or bottom surface 212 of the
substrate 2, or one top surface 211' or bottom surface 212 of the
two substrates 2, 2' can be adhered to contact heat-generating
electronic elements (such as LED lamp). The top and bottom ends
321, 322 of each heat-dissipating plate 32 protrude from the top
surfaces 211, 211' and the bottom surfaces 212, 212' of the
substrates 2, 2'. Via this arrangement, the cooling airflow or the
airflow of a heat source can be flowed into /out of the top surface
211, 211' and the bottom surface 212, 212' of the substrate 2, 2'
in two ways. In this way, the heat dissipation of the electronic
elements can be achieved more easily.
[0044] While the invention has been described in terms of what is
presently considered to be the most practical and preferred
embodiments, it is to be understood that the invention needs not be
limited to the disclosed embodiment. On the contrary, it is
intended to cover various modifications and similar arrangements
included within the spirit and scope of the appended claims which
are to be accorded with the broadest interpretation so as to
encompass all such modifications and similar structures.
* * * * *