Thermally Conductive Module

Abstract

A thermally conductive module includes a base seat, a thermally conductive copper block and a heat pipe. A side face of the base seat is arranged an accommodation slot, a lateral side of which is arranged a fixing slot. The thermally conductive copper seat is inset into the fixing slot and combined therewith. The heat pipe has a heated section, on which a plane is configured and flush with the side face of the base seat, and which is accommodated by being clamped between the accommodation slot and the thermally conductive copper block. Thus, it is possible to effectively boost the thermally conductive speed and thermally conductive performance entirely.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention in general relates to a thermally conductive module, in particular, to a thermally conductive module having heat pipe and thermally conductive copper block.

[0003] 2. Description of Prior Art

[0004] Heat pipe has the characteristics of high heat-transferring capability, high thermal conductivity, light weight, simple structure and a variety of functions, and it also can transfer a large amount of heat, consumes no power and has the merit of low cost so, in use, it is usually integrated with a base seat to constitute a thermally conductive module, which has been applied to the thermal conduction of electronic heating elements, the heat generated from which can be dissipated quickly, thus, effectively solving the thermally concentrating phenomenon faced by electronic heating elements in current stage.

[0005] The thermally conductive module according to prior arts is provided by attaching to a surface of heating element. The thermally conductive module is comprised of a base seat and a heat pipe. The base seat is made of a copper material. The heat pipe is arranged by passing through the base seat and has a heated section and a heat-releasing section extended from the heated section. The heated section is arranged in an interior of the base seat, while the heat-releasing section passes out from one side of the base seat. In use, the base seat is arranged by attaching to a surface of the heating element, whereby a thermally conducting operation is experienced.

[0006] However, the thermally conductive module according to prior arts still has following drawbacks in terms of practical use. For example, sine the base seat is made of a copper material, its weight is heavier and it has a higher cost caused by complicated manufacturing process. In addition, the only thermally conductive mechanism is constituted by attaching the base seat to the heating element, which is unable to effectively conduct the heat away from the heating element, because of a larger thermal resistance, so its thermally conductive effect is quite limited.

[0007] Accordingly, after a substantially devoted study, in cooperation with the application of relative academic principles, the inventor has finally proposed the present invention that is designed reasonably to possess the capability to improve the drawbacks of the prior art significantly.

SUMMARY OF THE INVENTION

[0008] Therefore, in order to solve aforementioned problems, the invention is mainly to provide a thermally conductive module, whereby heat pipe, base seat and thermally conductive copper block are simultaneously attached to a surface of heating element, thus, effectively boosting the thermally conductive performance entirely.

[0009] Secondary, the invention is to provide a thermally conductive module, whereby a thermally conductive copper block is inset into a base seat, such that the thermally conductive copper seat is contacted tightly with the heat pipe, effectively increasing the thermally conductive area and entirely boosting the thermally conductive speed.

[0010] Thirdly, the invention is to provide a thermally conductive module comprised of a base seat, a thermally conductive copper block and a heat pipe. A side face of the base seat is arranged an accommodation slot, one lateral side of which is arranged a fixing slot. The thermally conductive copper seat is inset into the fixing slot and combined therewith. The heat pipe has a heated section, on which a plane is configured and flush with the side face of the base seat, and which is accommodated by being clamped between the accommodation slot and the thermally conductive copper block.

[0011] Fourthly, the invention is to provide a thermally conductive module, whereby a heat-releasing section is extended from a heated section of heat pipe and formed at one side of a base seat or is extended to two sides of the base seat, thus, effectively increasing the thermally conductive area of the heat pipe and entirely increasing the thermally conductive performance of the invention.

[0012] Finally, the invention is to provide a thermally conductive module, whereby a base seat is made by an aluminum extrusion, so its weight is lighter, effectively reducing the manufacturing cost entirely.

BRIEF DESCRIPTION OF DRAWING

[0013] The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description, which describes a number of embodiments of the invention, taken in conjunction with the accompanying drawings, in which:

[0014] FIG. 1 is a perspective explosive illustration of the present invention;

[0015] FIG. 2 is a perspective assembled illustration of the present invention;

[0016] FIG. 3 is a cross-sectional illustration along a sectional line "3-3" in FIG. 2;

[0017] FIG. 4 is a using status of the present invention; and

[0018] FIG. 5 is another embodiment illustration of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0019] In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.

[0020] Please refer to FIG. 1 through FIG. 3. A thermally conductive module 1 according to the present invention is comprised of a base seat 1, a thermally conductive copper block 20 and a heat pipe 30.

[0021] The base seat 10 has a side face 13 and another side face 14 corresponding to the side face 13. An accommodation slot 11 is arranged on the side face 13 and a fixing slot 12 is arranged at a lateral side of the accommodation slot 11. The fixing slot 12 can be a dovetail slot. One or more cooling fins can be attached to another side face 14, as shown in FIG. 4. The base seat can be made by an aluminum extrusion or of an aluminum-magnesium alloy, so its weight is lighter, effectively reducing the manufacturing cost entirely.

[0022] The thermally conductive copper block 20 is inset into the fixing slot 12 and combined therewith. The thermally conductive copper block 20 is a dovetail seat comprised of a bottom section 21, a middle section 23 connected to the bottom section 21 and a top section 22 connected to the middle section 23. The bottom section 21 is inset into the fixing slot 12 of the base seat 10 and fixed therein. The top section 22 is exposed to the outside of the fixing slot 12. The width of the top section 22 is greater than that of the middle section 23 and that of the fixing slot 12. The thermally conductive coefficient of the thermally conductive copper block 20 is greater than that of the base seat 10. The specific weight of the base seat 10 is lower than that of the thermally conductive copper block 20.

[0023] The heat pipe 30 has a heated section 31 and a heat-releasing section 32 extended from the heated section 31. The heated section 31 is arranged by being clamped between the accommodation slot 11 and the thermally conductive copper block 20. A plane 311 is formed on the heated section 31. Therefore, the profile of the heated section 31 is shown as a "D" character, as shown in FIG. 3. The plane 11 is flush with the side face 13 of the base seat 10. The heat-releasing section 32 is formed at one side of the base seat 10. The heat pipe 30 is made of a copper material to have a superiority of thermally conductive efficiency. The plane 311 of the heated section 31 can be formed by machining processes of forging and stamping.

[0024] In assembling the invention, please refer again to FIG. 1 and FIG. 2. First of all, the heated section 31 of the heat pipe 30 is accommodated in the accommodation slot 11 of the base seat 10. Then, the thermally conductive copper block 20 is inset into the fixing slot 12 of the base seat 10 (it can be processed by a machining manner of riveting), making the top section 22 of the thermally conductive copper 20 abutted against and contacted with the heated section 31 of the heat pipe 30 as tightly as possible, thus that an assembly job of the invention is completed.

[0025] In using the invention, please refer to FIG. 4. Firstly, another side face 14 of the base seat 10 is attached to the cooling fins 3. Then, the side face 13 of the base seat 10 is arranged by attaching to a surface of heating element 2. Thus, the heat generated from the heating element 2 can be effectively conducted to the cooling fins 3 via the base seat 10, the heat pipe 30 and the thermally conductive copper block 20. Finally, the heat generated from the heating element 2 is dissipated by the cooling fins 3.

[0026] According to the invention, since the thermally conductive copper block 20 is inset into the base seat 10 and tightly contacted with the heat pipe 10, the heat-transferring area is effectively increased and the thermally conductive speed is enhanced entirely. In addition, since the base seat 10, the heat pipe 30 and the thermally conductive copper block 20 are simultaneously attached to the surface of heating element 2, it can effectively boost the thermally conductive performance entirely.

[0027] Please refer to FIG. 5, which is another embodiment illustration of the invention. This embodiment is same as the aforementioned embodiment, except that the heat-releasing section 32 of the heat pipe 30 can be connected to other cooling fins 4, quickly and effectively dissipating the heat generated by the heating element 2. Therefore, both embodiments have a same effect of thermal dissipation.

[0028] Accordingly, through the constitution of aforementioned assemblies, a thermally conductive module according to the invention is thus obtained.

[0029] Summarizing aforementioned description, the thermally conductive module is an indispensably design indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of a new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.

[0030] However, the aforementioned description is only a number of preferable embodiments according to the present invention, not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.

Claims

1. A thermally conductive module, including: a base seat, a side face of which is arranged an accommodation slot, a lateral side of which is arranged a fixing slot; a thermally conductive copper seat, which is inset into the fixing slot and combined therewith; and a heat pipe, which has a heated section, on which a plane is configured and flush with the side face of the base seat, and which is accommodated by being clamped between the accommodation slot and the thermally conductive copper block.

2. The thermally conductive module according to claim 1, wherein the base seat is made by an aluminum extrusion.

3. The thermally conductive module according to claim 1, wherein the fixing slot is a dovetail slot, while the thermally conductive copper block is formed as a dovetail seat correspondingly matched with the dovetail slot.

4. The thermally conductive module according to claim 1, wherein the thermally conductive copper block is comprised of a bottom section, a middle section and a top section, whereby the bottom section is inset into the fixing slot and a width of the top section is greater than that of the middle section.

5. The thermally conductive module according to claim 1, wherein a thermally conductive coefficient of the thermally conductive copper block is greater than that of the base seat.

6. The thermally conductive module according to claim 1, wherein a specific weight of the base seat is lower than that of the thermally conductive copper block.

7. The thermally conductive module according to claim 1, wherein the heat pipe further has a heat-releasing section extended from the heated section and formed at a side of the base seat.

8. The thermally conductive module according to claim 1, wherein a profile of the heated section is shown as a "D" character.