U.S. patent application number 11/876886 was filed with the patent office on 2008-09-11 for semiconductor manufacturing process modules.
Invention is credited to Christopher C. Kiley, Patrick D. Pannese, Peter van der Meulen.
Application Number | 20080219810 11/876886 |
Document ID | / |
Family ID | 39870072 |
Filed Date | 2008-09-11 |
United States Patent
Application |
20080219810 |
Kind Code |
A1 |
van der Meulen; Peter ; et
al. |
September 11, 2008 |
SEMICONDUCTOR MANUFACTURING PROCESS MODULES
Abstract
A variety of process modules are described for use in
semiconductor manufacturing processes.
Inventors: |
van der Meulen; Peter;
(Newburyport, MA) ; Kiley; Christopher C.;
(Carlisle, MA) ; Pannese; Patrick D.; (Lynnfield,
MA) |
Correspondence
Address: |
STRATEGIC PATENTS P.C..
C/O PORTFOLIOIP, P.O. BOX 52050
MINNEAPOLIS
MN
55402
US
|
Family ID: |
39870072 |
Appl. No.: |
11/876886 |
Filed: |
October 23, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11681978 |
Mar 5, 2007 |
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11876886 |
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Current U.S.
Class: |
414/217 |
Current CPC
Class: |
H01L 21/6719 20130101;
H01L 21/67184 20130101; H01L 21/67161 20130101 |
Class at
Publication: |
414/217 |
International
Class: |
H01L 21/677 20060101
H01L021/677 |
Claims
1. A device comprising: a single entry shaped and sized for passage
of a single wafer; an interior chamber adapted to hold a plurality
of wafers in a side-by-side configuration; a slot valve operable to
selectively isolate the interior chamber; and a tool for processing
the plurality of wafers within the interior chamber.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation-in-part of U.S.
application Ser. No. 11/679,829 filed on Feb. 27, 2007, which
claims the benefit of U.S. Prov. App. No. 60/777,443 filed on Feb.
27, 2006, and is a continuation-in-part of U.S. application Ser.
No. 10/985,834 filed on Nov. 10, 2004 which claims the benefit of
U.S. Prov. App. No. 60/518,823 filed on Nov. 10, 2003 and U.S.
Prov. App. No. 60/607,649 filed on Sep. 7, 2004.
[0002] This application also claims the benefit of the following
U.S. applications: U.S. Prov. App. No. 60/779,684 filed on Mar. 5,
2006; U.S. Prov. App. No. 60/779,707 filed on Mar. 5, 2006; U.S.
Prov. App. No. 60/779,478 filed on Mar. 5, 2006; U.S. Prov. App.
No. 60/779,463 filed on Mar. 5, 2006; U.S. Prov. App. No.
60/779,609 filed on Mar. 5, 2006; U.S. Prov. App. No. 60/784,832
filed on Mar. 21, 2006; U.S. Prov. App. No. 60/746,163 filed on May
1, 2006; U.S. Prov. App. No. 60/807,189 filed on Jul. 12, 2006; and
U.S. Prov. App. No. 60/823,454 filed on Aug. 24, 2006.
[0003] All of the foregoing applications are commonly owned, and
all of the foregoing applications are incorporated herein by
reference.
BACKGROUND
[0004] 1. Field
[0005] The invention herein disclosed generally relates to
semiconductor processing systems in a vacuum environment, and
specifically relates to configurations of handling and process
chambers for semiconductor processing in a vacuum environment.
[0006] 2. Description of the Related Art
[0007] In a conventional semiconductor manufacturing system, a
number of different process modules are interconnected within a
vacuum or other environment and controlled to collectively process
semiconductor wafers for various uses. The complexity of these
manufacturing systems continues to grow both due to the increased
complexity of processing larger wafers with smaller features, and
due to the increasing possibilities for using a single system for
several different end-to-end processes, as described for example in
commonly-owned U.S. application Ser. No. 11/679,829 filed on Feb.
27, 2007. As the complexity of a fabrication system grows, it
becomes increasingly difficult to schedule resources within the
system in a manner that maintains good utilization of all the
various process modules. While a part of this difficulty flows from
the complexity of the processing recipe itself, another part of the
difficulty comes from the differences in processing time for
various processing steps. The generally high acquisition and
operating costs of production semiconductor vacuum processing
systems dictate high utilization of the handling, processing, and
other modules within the systems.
[0008] Within a family of similar semiconductor products, or within
a range of families within a technology, at least some of the
processing steps may be commonly applied to all wafers. However,
because of the unique processing requirements to achieve the final
semiconductor device, sharing common processing steps may be very
difficult with fixed processing systems. While it may be possible
to share these common process steps by configuring them as separate
machines, every machine-to-machine transfer imposes time delays and
risks of contamination As a result, duplication of equipment, and
the resulting underutilization of the equipment, is a common
challenge with semiconductor vacuum processing operation in a
semiconductor fabrication facility.
[0009] There remains a need for process modules adapted to current
semiconductor manufacturing needs, and in particular, for process
modules that can help to balance load, increase throughput, and
improve utilization within complex processing systems.
SUMMARY
[0010] A variety of process modules are described for use in
semiconductor manufacturing processes.
[0011] In one aspect, a device disclosed herein includes a single
entry shaped and sized for passage of a single wafer; an interior
chamber adapted to hold a plurality of wafers in a side-by-side
configuration; a slot valve operable to selectively isolate the
interior chamber; and a tool for processing the plurality of wafers
within the interior chamber.
[0012] The plurality of wafers may consist of two wafers. The two
wafers may be equidistant from the single entry. The two wafers may
be in line with the single entry. The plurality of wafers may
consist of three entries. The plurality of wafers may be arranged
in a triangle. The device may include a wafer handler within the
interior chamber, the wafer handler rotatable to position one of
the plurality of wafers nearest to the single entry. The tool may
process one of the plurality of wafers at a time. The device may
include a single robotic arm adapted to place or retrieve any one
of the plurality of wafers within the interior chamber.
[0013] In another aspect, a device disclosed herein includes an
interior chamber adapted to hold a plurality of wafers; a first
entry to the interior chamber shaped and size for passage of a
single wafer and selectively isolated with a first slot valve; a
second entry to the interior chamber shaped and size for passage of
a single wafer and selectively isolated with a second slot valve;
and a tool for processing the plurality of wafers within the
interior chamber.
[0014] The first entry and the second entry may be positioned for
access by two robotic arms positioned for a robot-to-robot hand
off. The first entry and the second entry may be positioned for
access by two robotic arms having center axes spaced apart by less
than twice a wafer diameter. The first entry and the second entry
may be positioned for access by two adjacent robotic arms
positioned for hand off using a buffer location. The device may
include two robotic arms, each one of the robotic arms positioned
to access one of the first and second entries, and the robotic arms
operable to concurrently place at least two wafers into the
interior chamber substantially simultaneously. The device may
include two robotic arms and a buffer sharing a common isolation
environment, each one of the robotic arms positioned to access one
of the first and second entries and adapted to transfer one of the
plurality of wafers to the other one of the robotic arms using the
buffer. The device may include a third entry to the interior
chamber shaped and size for passage of a single wafer and
selectively isolated with a third slot valve.
[0015] In another aspect, a device disclosed herein includes an
entry shaped and size for passage of at least one wafer, the entry
having a width substantially larger than the diameter of the at
least one wafer; an interior chamber adapted to hold a plurality of
wafers; a slot valve operable to selectively isolate the interior
of the chamber; and a tool for processing the plurality of wafers
within the interior chamber.
[0016] The entry may be adapted to accommodate linear access by a
robot to a plurality of wafers within the interior chamber. The
entry may have a width at least twice the diameter of one of the
plurality of wafers.
[0017] In another aspect, a device disclosed herein includes a
first entry shaped and sized for passage of a wafer; a first
interior accessible through the first entry; a first slot valve
operable to selectively isolate the first interior; a second entry
shaped and sized for passage of the wafer; a second interior
accessible through the second entry; and a second slot valve
operable to selectively isolate the second interior.
[0018] The device may include a robotic arm adapted to access the
first interior and the second interior. The robotic arm may include
a four-link SCARA arm. The device may include two robotic arms,
including a first robotic arm adapted to access the first interior
and a second robotic arm adapted to access the second interior. The
first robotic arm and the second robotic arm may be separated by a
buffer station. The first interior may include a vacuum sub-chamber
adapted for independent processing of wafers. The second interior
may include a second vacuum sub-chamber having a different
processing tool than the first interior. The second interior may be
separated from the first interior by a wall. The first entry and
the second entry may be substantially coplanar. The first entry may
form a first plane angled to a second plane formed by the first
entry. The device may include a robotic arm adapted to access the
first entry and the second entry, wherein the first plane and the
second plane are substantially normal to a line through a center
axis of the robotic arm. The device may include a third entry
shaped and sized for passage of a wafer, a third interior
accessible through the third entry, and a third slot valve operable
to selectively isolate the third interior.
[0019] In another aspect, a device disclosed herein includes a
first entry shaped and sized for passage of a wafer; an interior
chamber adapted to hold a wafer; a second entry shaped and sized
for passage of the wafer, the second entry on an opposing side of
the interior chamber from the first entry; a slot valve at each of
the first and second entries, the slot valves operable to
selectively isolate the interior chamber; and a tool for processing
the wafer within the interior chamber.
[0020] The devices disclosed herein may be combined in various ways
within a semiconductor fabrication system, for example to form
fabrication facilities adapted to balance processing load among
relatively fast and relatively slow processes, or between processes
amenable to batch processing and processes that are dedicated to a
single wafer.
[0021] In one aspect, a system disclosed herein includes a
plurality of process modules coupled together to form a vacuum
environment, the plurality of process modules including at least
one process module selected from the group consisting of an in-line
process module, a dual-entry process module, and a wide-entry
process module; one or more robot handlers within the vacuum
environment adapted to transfer wafers among the plurality of
process modules; and at least one load lock adapted to transfer
wafers between the vacuum environment and an external
environment.
[0022] The system may include at least one multi-wafer process
module having an entry shaped and sized for passage of a single
wafer.
[0023] These and other systems, methods, objects, features, and
advantages of the present invention will be apparent to those
skilled in the art from the following detailed description of the
preferred embodiment and the drawings. All documents mentioned
herein are hereby incorporated in their entirety by reference.
BRIEF DESCRIPTION OF THE FIGURES
[0024] The invention and the following detailed description of
certain embodiments thereof may be understood by reference to the
following figures:
[0025] FIG. 1 depicts a generalized layout of a vacuum
semiconductor manufacturing system.
[0026] FIG. 2 shows a multi-wafer process module.
[0027] FIG. 3 shows a multi-wafer process module.
[0028] FIG. 4 shows a multi-wafer process module.
[0029] FIG. 5 shows a multi-wafer process module.
[0030] FIG. 6 shows adjacent process modules sharing a
controller.
[0031] FIG. 7 shows two robotic arms sharing a buffer.
[0032] FIG. 8 shows dual entry process modules.
[0033] FIG. 9 shows dual entry process modules.
[0034] FIG. 10 shows a process module with an oversized entry.
[0035] FIG. 11 shows side-by-side process modules.
[0036] FIG. 12 shows multi-process modules.
[0037] FIG. 13 shows multi-process modules.
[0038] FIG. 14 shows multi-process modules.
[0039] FIG. 15 shows an in-line process module in a layout.
[0040] FIG. 16 shows a layout using dual entry process modules.
[0041] FIG. 17 shows a layout using dual entry process modules.
[0042] FIG. 18 shows a process module containing a scanning
electron microscope.
[0043] FIG. 19 shows a process module containing an ion
implantation system.
[0044] FIG. 20 shows a layout using a scanning electron microscope
module.
[0045] FIG. 21 shows a layout using an ion implantation module.
DETAILED DESCRIPTION
[0046] FIG. 1 shows a generalized layout of a semiconductor
manufacturing system. The system 100 may include one or more wafers
102, a load lock 112, one or more transfer robots 104, one or more
process modules 108, one or more buffer modules 110, and a
plurality of slot valves 114 or other isolation valves for
selectively isolated chambers of the system 100, such as during
various processing steps. In general operation, the system 100
operates to process wafers for use in, for example, semiconductor
devices.
[0047] Wafers 102 may be moved from atmosphere to the vacuum
environment through the load lock 112 for processing by the process
modules 108. It will be understood that, while the following
description is generally directed to wafers, a variety of other
objects may be handled within the system 100 including a production
wafer, a test wafer, a cleaning wafer, a calibration wafer, or the
like, as well as other substrates (such as for reticles, magnetic
heads, flat panels, and the like), including square or rectangular
substrates, that might usefully be processed in a vacuum or other
controlled environment. All such workpieces are intended to fall
within the scope of the term "wafer" as used herein unless a
different meaning is explicitly provided or otherwise clear from
the context.
[0048] The transfer robots 104, which may include robotic arms and
the like, move wafers within the vacuum environment such as between
process modules, or to and from the load lock 112.
[0049] The process modules 108 may include any process modules
suitable for use in a semiconductor manufacturing process. In
general, a process module 108 includes at least one tool for
processing a wafer 102, such as tools for epitaxy, chemical vapor
deposition, physical vapor deposition, etching, plasma processing,
lithography, plating, cleaning, spin coating, and so forth. In
general, the particular tool or tools provided by a module 108 are
not important to the systems and methods disclosed herein, except
to the extent that particular processes or tools have physical
configuration requirements that constrain the module design 108 or
wafer handling. Thus, in the following description, references to a
tool or process module will be understood to refer to any tool or
process module suitable for use in a semiconductor manufacturing
process unless a different meaning is explicitly provided or
otherwise clear from the context.
[0050] Various process modules 108 will be described below. By way
of example and not limitation, the process modules 108 may have
various widths, such as a standard width, a doublewide width, a
stretched width, or the like. The width may be selected to
accommodate other system components, such as two side-by-side
transfer robot modules, two transfer robot modules separated by a
buffer module, two transfer robot modules separated by a transfer
station, or the like. It will be understood that the width may
instead be selected to accommodate more robots, such as three
robots, four robots, or more, either with or without buffers and/or
transfer stations. In addition, a process module 108 may
accommodate a plurality of vacuum sub-chamber modules within the
process module 108, where access to the vacuum sub-chamber modules
may be from a plurality of transfer robot modules through a
plurality of isolation valves. Vacuum sub-chamber modules may also
accommodate single wafers or groups of wafers. Each sub-chamber
module may be individually controlled, to accommodate different
processes running in different vacuum sub-chamber modules.
[0051] A number of buffer modules 110 may be employed in the system
100 to temporarily store wafers 102, or facilitate transfer of
wafers 102 between robots 104. Buffer modules 110 may be placed
adjacent to a transfer robot module 104, between two transfer robot
modules 104, between a transfer robot module 104 and an equipment
front-end module ("EFEM"), between a plurality of robots 104
associated with modules, or the like. The buffer module 110 may
hold a plurality of wafers 102, and the wafers 102 in the buffer
module 110 may be accessed individually or in batches. The buffer
module 110 may also offer storage for a plurality of wafers 102 by
incorporating a work piece elevator, or multi-level shelving (with
suitable corresponding robotics). Wafers 102 may undergo a process
step while in the buffer module 110, such as heating, cooling,
cleaning, testing, metrology, marking, handling, alignment, or the
like.
[0052] The load lock 112 permits movement of wafers 102 into and
out of the vacuum environment. In general, a vacuum system
evacuates the load lock 112 before opening to a vacuum environment
in the interior of the system, and vents the load lock 112 before
opening to an exterior environment such as the atmosphere. The
system 100 may include a number of load locks at different
locations, such as at the front of the system, back of the system,
middle of the system, and the like. There may be a number of load
locks 112 associated with one location within the system, such as
multiple load locks 112 located at the front of the linear
processing system. In addition, front-end load locks 112 may have a
dedicated robot and isolation valve associated with them for
machine assisted loading and unloading of the system. These
systems, which may include EFEMs, front opening unified pods
("FOUPs"), and the like, are used to control wafer movement of
wafers into and out of the vacuum processing environment.
[0053] The isolation valves 114 are generally employed to isolate
process modules during processing, or to otherwise isolate a
portion of the vacuum environment from other interior regions.
Isolation valves 114 may be placed between other components to
temporarily isolate the environments of the system 100, such as the
interior chambers of process modules 108 during wafer processing.
An isolation valve 114 may open and close, and provide a vacuum
seal when closed. Isolation valves 114 may have a variety of sizes,
and may control entrances that are serviced by one or more robots.
A number of isolation valves 114 are described in greater detail
below.
[0054] Other components may be included in the system 100. For
example, the system 100 may include a scanning electron microscope
module, an ion implantation module, a flow through module, a
multifunction module, a thermal bypass module, a vacuum extension
module, a storage module, a transfer module, a metrology module, a
heating or cooling station, or any other process module or the
like. In addition these modules may be vertically stacked, such as
two load locks stacked one on top of the other, two process modules
stacked one on top of the other, or the like.
[0055] It will be understood that, while FIG. 1 shows a particular
arrangement of modules and so forth, that numerous combinations of
process modules, robots, load locks, buffers, and the like may
suitably be employed in a semiconductor manufacturing process. The
components of the system 100 may be changed, varied, and configured
in numerous ways to accommodate different semiconductor processing
schemes and customized to adapt to a unique function or group of
functions. All such arrangements are intended to fall within this
description. In particular, a number of process modules are
described below that may be used with a semiconductor processing
system such as the system 100 described with reference to FIG.
1.
[0056] FIG. 2 shows a multi-wafer process module. The module 202
may include a processing tool (not shown) for processing wafers 204
disposed in an interior thereof. Access to the interior may be
through an entry 206 that includes an isolation valve or the like
operable to selectively isolate the interior of the module 202. A
robot 208 may be positioned outside the entry 206, and adapted to
place wafers 204 in the interior, or to retrieve the wafers 204
from the interior. In the embodiment of FIG. 2, the module 202 is
adapted to receive two wafers 204 side by side and substantially
equidistant from the entry 206 and the robot 208. In this
arrangement, a clear access path is provided for the robot 208 to
each wafer 204, and the symmetry may advantageously simplify design
of the module 202.
[0057] In general the size of the entry 206 would be only wide
enough and tall enough to accommodate a single wafer 204, along
with an end effector and any other portions of the robot that must
pass into the interior during handling. This size may be optimized
by having the robot 208 move wafers straight through a center of
the entry 206, which advantageously conserves valuable volume
within the vacuum environment. However, it will be understood that
the size of the wafer 204 may vary. For example, while 300 mm is a
conventional size for current wafers, new standards for
semiconductor manufacturing provide for wafers over 400 mm in size.
Thus it will be understood that the shape and size of components
(and voids) designed for wafer handling may vary, and one skilled
in the art would understand how to adapt components such as the
entry 206 to particular wafer dimensions. In other embodiments, the
entry 206 may be positioned and sized to provide a straight-line
path from the wafer's position within the module 202 and the
wafer's position when at a center 210 of a chamber 212 housing the
robot 208. In other embodiments, the entry 206 may be positioned
and sized to provide a straight-line path from the wafer's position
within the module 202 and a center axis of the robot 208 (which
will vary according to the type of robotic arm employed).
[0058] FIG. 3 shows a multi-wafer process module. The module 302
typically includes one or more tools to process wafers 304 therein.
As depicted, the three wafers 304 may be oriented in a triangle.
The entry 306 may be shaped and sized for passage of a single
wafer, or may be somewhat wider to accommodate different paths for
wafer passage in and out of an interior of the module 302. It will
be understood that other arrangements of three wafers 304 may be
employed, including wafers spaced radially equidistant from a
center 310 of a robot handling module 312, or linearly in various
configurations. It will also be understood that, unless the robot
308 has z-axis or vertical movement capability, the wafer 304
closest to the entrance 306 must generally be placed in last and
removed first.
[0059] FIG. 4 shows a multi-wafer process module. This module 402
positions two wafers 404 in-line with the entry 406, which may
advantageously permit the robot 408 to employ a single linear
motion for accessing both wafers 404.
[0060] FIG. 5 shows a multi-wafer process module. This module 502
includes a wafer handler 520 adapted to move wafers 504 within the
module 502. In one embodiment, the wafer handler 520 may operate in
a lazy-Suzan configuration to rotate one of the wafers 504 nearest
to the entry 512. In this configuration, the wafer handler 520 may
also rotate wafers 504 on the rotating handler 520 (using, for
example, individual motors or a planetary gear train) to maintain
rotational alignment of each wafer relative to the module 502. It
will be understood that, while a rotating handler is one possible
configuration for the handler 520 that advantageously provides a
relatively simple mechanical configuration, other arrangements are
also possible including a conveyer belt, a Ferris wheel, a vertical
conveyer belt with shelves for wafers, an elevator, and so forth.
In general, any mechanical system suitable for accommodating
loading of multiple wafers into the module 502, and preferable
systems that accommodate use of an entry 512 sized for a single
wafer and/or systems that reduce the required reach of robots into
the module, may be useful employed in a multi-wafer process module
as described herein.
[0061] FIG. 6 shows a controller shared by a number of process
modules. In a conventional system, each process module has a
controller adapted specifically for control of hardware within the
process module. The system 600 of FIG. 6 includes a plurality of
process modules 602 which may be any of the process modules
described above, and may perform identical, similar, or different
processes from one another. As depicted, two of the modules 602 are
placed side-by-side and share a controller 604. The controller 604
may control hardware for both of the side-by-side modules 602, and
provide an interface for external access/control. In addition,
sensors may be associated with the modules 602 to provide data to
the controller 604, as well as to recognize when a module is
attached to an integrated processing system. Using a shared
controller 604, which may be a generic controller suitable for use
with many different types of modules 602 or a module-specific
controller, advantageously conserves space around process modules
602 permitting denser configurations of various tools, and may
reduce costs associated with providing a separate controller for
each process module 602. The modules 602 may also, or instead,
share facilities such as a gas supply, exhaust(s), water, air,
electricity, and the like. In an embodiment, the shared controller
604 may control shared facilities coupled to the modules 602.
[0062] FIG. 7 shows two robotic arms sharing a buffer. In this
system 700, two robots 702 transfer wafers via a buffer 704. It
will be noted that no isolation valves are employed between the
robots 702 and/or the buffer 704. This arrangement may
advantageously reduce or eliminate the need for direct
robot-to-robot hand offs (due to the buffer 704), and permit closer
spacing of robots 702 because no spacing is required for isolation
valves. The buffer 704 may include multiple shelves or other
hardware for temporary storage of wafers. In one embodiment, the
buffer 704 has a number of vertically stacked shelves, and remains
stationary while robotic arms 702 move vertically to pick and place
on different shelves. In another embodiment, the buffer 704 has a
number of vertically stacked shelves, and the buffer 704 moves
vertically to bring a specific shelf to the height of one of the
robots 702. In this embodiment, each robot may have an end effector
or the like with a different elevation so that both robots 702 can
access the buffer 704 simultaneously without collision. In other
embodiments, the end effectors of different robots 702 may have
complementary shapes to accommodate simultaneous linear access, or
may have offset linear positions so that fingers of each end
effector do not collide when both robots 702 are accessing the
buffer 704. More generally, it will be appreciated that numerous
physical arrangements may be devised for a robotic system 700 that
includes two or more robots 702 sharing a buffer 704 within a
single isolation chamber. In other embodiments, two or more buffers
704 may also be employed. Each robot may also have multiple end
effectors stacked vertically, which allows the robot to transfer
multiple wafers simultaneously.
[0063] FIG. 8 shows a layout for dual-entry process modules. In the
system 800 of FIG. 8, double-wide process modules 802 include two
different entries 804, each having an isolation valve for
selectively coupling an interior of the process module 802 to an
external environment. As depicted, the external environment of FIG.
8 includes a single volume 806 (i.e., a shared or common
environment without isolation valves) that contains two robots 808
and a buffer 810. In this embodiment, the robots 808 may hand off
to one another using shelves or the like within the buffer 810, as
generally described above. It will be understood that the robots
808 may also, or instead, directly hand off to one another. Each
process module 802 may concurrently hold and process a number of
wafers, such as two wafers, three wafers, four wafers, and so
forth. It will be readily understood that two wafers may be
directly accessed by the two robots 808 and entries 804, permitting
parallel handling of wafers through the side-by-side entries 804.
Thus, for example, two wafers (or more wafers using, e.g., batch
end effectors or the like), may be simultaneously transferred from
the process module 802 depicted on the left of FIG. 8 and the
process module 802 depicted on the right of FIG. 8. In addition,
the dual processing chamber may advantageously employ shared
facilities, such as gasses, vacuum, water, electrical, and the
like, which may reduce cost and overall footprint. This arrangement
may be particularly useful for a module 802 having long process
times (for example, in the range of several minutes) by permitting
concurrent processing and/or handling of multiple wafers.
[0064] FIG. 9 shows a layout for a dual-entry process module. In
the embodiment of FIG. 9, the robotic handlers are in chambers 902
isolated from one another by a buffer 904 with isolation valves
906. This configuration of robotics provides significant
advantages. For example, the buffer 904 may be isolated to
accommodate interim processing steps such as metrology or
alignment, and may physically accommodate more wafers. In addition,
this arrangement permits one of the robotic handlers to access a
load lock/EFEM in isolation from the other robotic handler and
process modules. However, this configuration requires greater
separation between the robotic handlers, and requires a
correspondingly wider process module 908. As noted above, various
internal transport mechanisms may be provided within the process
module 908 to permit movement of wafers within the module to a
position close to the entry or entries. However, in some
embodiments, the process module 908 may only process two wafers
simultaneously.
[0065] It will be understood that the embodiments of FIGS. 8-9 may
be readily adapted to accommodate three, four, or more entries with
suitable modifications to entries, modules, and robotics. All such
variations are intended to fall within the scope of this
disclosure. As with other process modules described herein, these
modules may also be readily adapted to batch processing by
providing, for example, vertically stacked shelves and robots with
dual or other multiple end effectors.
[0066] FIG. 10 shows a process module with an over-sized entry. In
the embodiment of FIG. 10, an entry 1002 to a process module 1004
may be substantially wider than the diameter of wafers handled by
the system 1000. In general, the increased width of the entry 1002
and a corresponding isolation valve permits linear access by a
robot 1006 to more of the space within an interior chamber of the
process module 1004. In embodiments, the entry 1002 may have a
width that is 50% greater than the diameter of a wafer, twice the
diameter of a wafer, or more than twice the diameter of a wafer. In
embodiments, the entry 1002 has a width determined by clearance for
linear robotic access (with a wafer) to predetermined positions
within the process module 1004, such as the corners of the module
1004 opposing the entry 1002, or other positions within the module
1004. While it is possible for robots to reach around corners and
the like, linear access or substantially linear access simplifies
robotic handling and requires less total length of links within a
robotic arm. In one aspect, two such process modules 1004 may share
a robotic handler, thereby permitting a high degree of flexibility
in placement and retrieval motions for wafers among the modules
1004.
[0067] FIG. 11 shows a dual entry process module. Each process
module 1102 may be a dual-entry process module having two entries
as described, for example with reference to FIG. 9 above. In the
embodiment of FIG. 11, a single robot 1104 may service each entry
1106 of one or more of the process modules 1102. Due to the long
reach requirements, the robot 1104 may include a four-link SCARA
arm, a combination of telescoping and SCARA components, or any
other combination of robotic links suitable for reaching into each
entry 1106 to place and retrieve wafers in the process module(s)
1102.
[0068] FIG. 12 shows multi-process modules. In the embodiment of
FIG. 12, a process module 1202 may include two (or more) vacuum
sub-chambers 1204 for independently processing wafers 1206. Each
vacuum sub-chamber 1204 may be separated from the other by a wall
or similar divider that forms two isolated interiors within the
module 1202. Each vacuum sub-chamber 1204 may, for example include
one or more independent processing tools and an independent vacuum
environment in the corresponding interior chamber selectively
isolated with an isolation valve. In other embodiments, each
sub-chamber 1204 may include a shared tool that independently
processes each wafer 1206, so that a single environment is employed
within the process module 1202 even through wafers are processed
separately and/or independently. FIG. 13 shows a multi-process
module system 1300 employing a buffer 1302 between robots 1304. The
isolation entries and/or isolation valves may be substantially
coplanar, such as to abut linearly arranged robotic handlers or
other planar surfaces of handling systems.
[0069] FIG. 14 shows multi-process modules. In the embodiment of
FIG. 14, each process module 1402 may include a number of entries
1404 for selective isolation of the processing environment within
the process modules 1402. In this embodiment, the entries 1404 for
each module 1402 form planes that are angled with respect to one
another. In one embodiment, these planes are oriented substantially
normal to a ray from a wafer center within the module 1402 to a
center of the robotic handler 1408 or a center axis of the robotic
handler 1408. This configuration provides a number of advantages.
For example, in this arrangement, a single robot 1408 may have
linear access to each process module 1402 sub-chamber. Further,
three process modules 1402 may be arranged around a single robot
1408. As a significant advantage, this general configuration
affords the versatility of a cluster tool in combination with the
modularity of individual process modules. It will be understood
that while FIG. 14 depicts each entry 1404 as servicing a single
sub-chamber within a process module 1402, the process module 1402
may have a single, common interior where multiple wafers are
exposed to a single process.
[0070] FIG. 15 shows an in-line process module in a layout. In the
system 1500, each linear process module 1502 includes two entries
1504 on substantially opposite sides of the module 1502. This
configuration facilitates linear arrangements of modules by
permitting a wafer to be passed into the module 1502 on one side,
processed with a tool (which may be, for example, any of the tools
described above, and retrieved from the module 1502 on an opposing
side so that multiple linear modules 1502 and/or other modules may
be linked together in a manner that effectively permits processing
during transport from one EFEM 1506 (or the like) to another EFEM
1508. In one embodiment, the in-line process modules may provide
processes used for all wafers in the system 1500, while the other
process modules may provide optional processes used only on some of
the wafers. As a significant advantage, this layout permits use of
a common system for different processes having partially similar
processing requirements.
[0071] In general, the embodiments depicted above may be further
expanded to incorporate additional processing modules and transfer
robot modules. The following figures illustrate a number of layouts
using the process modules described above.
[0072] FIG. 16 shows a layout using dual entry process modules. In
this system 1600, two dual-entry process modules share a robotic
handling system with a conventional, single process module. In an
example deployment, the dual-entry process modules may implement
relatively long processes, while the conventional module provides a
single, short process. The robotics may quickly transfer a series
of wafers between the buffer and the short process module while a
number of wafers are being processed in the dual entry process
modules.
[0073] FIG. 17 shows a layout using dual entry process modules. In
this system 1700, two additional process modules are added. This
may be useful, for example, to balance the duty cycles of various
process modules thereby providing higher utilization of each
module, or provide for more efficient integration of relatively
fast and slow processes or process modules within a single
environment.
[0074] FIG. 18 shows a process module containing a scanning
electron microscope. The system 1800 may include an EFEM or FOUP
1802, an entry 1804 including an isolation valve, a robotic handler
1806, and a scanning electron microscope 1808. The entry 1804 may
provide selective isolation to the robotic handler 1806 and/or
microscope 1808, and the robotic handler 1806 may transfer wafers
between the microscope 1808 and the rest of the system 1800. This
general configuration may be employed to add a scanning electron
microscope to a semiconductor manufacturing system in a manner
similar to any other process module, which advantageously permits
microscopic inspection of wafers without removing wafers from the
vacuum environment, or to add a stand-alone microscope to a vacuum
environment fabrication facility
[0075] FIG. 19 shows a process module containing an ion
implantation system. The system 1900 may include an EFEM or FOUP
1902, an entry 1904 including an isolation valve, a robotic handler
1906, and an ion implantation system 1908. The entry 1904 may
provide selective isolation to the robotic handler 1906 and/or ion
implantation system 1908, and the robotic handler 1906 may transfer
wafers between the ion implantation system 1908 and the rest of the
system 1900. This general configuration may be employed to add an
ion implantation tool to a semiconductor manufacturing system in a
manner similar to any other process module, which advantageously
permits ion implantation on wafers without removing wafers from the
vacuum environment, or to add a stand-alone implantation system to
a vacuum environment fabrication facility.
[0076] FIG. 20 shows a layout using a scanning electron microscope
module. As illustrated, the system 2000 includes a scanning
electron microscope module 2002 with an integrated transfer robot
2004. This hardware is incorporated into the semiconductor
processing system 2000, including additional transfer robotics,
process modules, and EFEM. Such an embodiment may be useful for
handling and setup of a microscopic scanning function within a
vacuum processing environment, allowing the semiconductor work
piece to be kept in vacuum throughout the process, including
intermittent or final inspection using electron microscopy. While
the illustrated system 2000 includes two dual-entry process modules
as additional processing hardware, it will be understood that any
suitable combination of process modules may be employed with the
systems described herein.
[0077] FIG. 21 shows a layout using an ion implantation module. As
illustrated, the system 2100 includes an ion implantation system
2102 and two robotic handlers 2104. This hardware is incorporated
into the semiconductor processing system 2100, which includes
additional transfer robotics, process modules, and two EFEMs. Such
an embodiment may be useful for handling and setup of ion
implantation within a vacuum-processing environment, allowing the
wafer to be kept in vacuum throughout a multi-step process that
includes one or more ion implantation steps. The process system is
configured such that wafers that do not require ion implantation
may bypass the ion implantation system through two robots and a
buffer. Such a wafer may nonetheless be processed in other process
modules connected to the system 2100.
[0078] A linear process module 2106 may also be provided. This
configuration may be particularly useful in high-throughput
processes so that a bottleneck is avoided at either entry to or
exit from the vacuum environment. In addition, the linear process
module 2106 may be simultaneously or nearly simultaneously loaded
from one entry while being unloaded from the other entry.
[0079] It will be understood that, while specific modules and
layouts are have been described in detail, these examples are not
intended to be limiting, and all such variations and modifications
as would be apparent to one of ordinary skill in the art are
intended to fall within the scope of this disclosure. For example,
while FIG. 12 depicts two robots in a shared common environment
handling wafers for the modules 1202, a variety of other
arrangements are possible. For example, all of the entries 1204 may
be serviced by a single robot as described above with reference to
FIG. 11, or the entries 1204 may be serviced by a pair of robots
separated by an isolated buffer as described above with reference
to FIG. 9. As another example, while numerous examples are provided
above of dual entry or dual process modules, these concepts may be
readily adapted to three entry or three process modules, or more
generally, to any number of modules consistent with a particular
fabrication facility or process.
[0080] Further, it should be understood that the devices disclosed
herein may be combined in various ways within a semiconductor
fabrication system, for example to form fabrication facilities
adapted to balance processing load among relatively fast and
relatively slow processes, or between processes amenable to batch
processing and processes that are dedicated to a single wafer.
Thus, while a number of specific combinations of modules are shown
and described above, it will be appreciated that these combinations
are provided by way of illustration and not by way of limitation,
and that all combinations of the process modules disclosed herein
that might usefully be employed in a semiconductor fabrication
system are intended to fall within the scope of this
disclosure.
[0081] More generally, it will be understood that, while various
features of process modules are described herein by way of specific
examples, that numerous combinations and variations of these
features are possible and that, even where specific combinations
are not illustrated or described in detail, all such combinations
that might be usefully employed in a semiconductor manufacturing
environment are intended to fall within the scope of this
disclosure.
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