loadpatents
name:-0.01019287109375
name:-0.0080192089080811
name:-0.00044512748718262
Zutshi; Ajoy Patent Filings

Zutshi; Ajoy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zutshi; Ajoy.The latest application filed is for "chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use".

Company Profile
0.8.8
  • Zutshi; Ajoy - Chandler AZ US
  • Zutshi; Ajoy - Fremont CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use
Grant 9,200,180 - Banerjee , et al. December 1, 2
2015-12-01
System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss
Grant 7,848,839 - Zutshi , et al. December 7, 2
2010-12-07
CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use
Grant 7,678,702 - Compton , et al. March 16, 2
2010-03-16
Chemical-Mechanical Planarization Composition Having Benzenesulfonic Acid and Per-Compound Oxidizing Agents, and Associated Method for Use
App 20090261291 - Banerjee; Gautam ;   et al.
2009-10-22
Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use
Grant 7,514,363 - Banerjee , et al. April 7, 2
2009-04-07
Method for Chemical Mechanical Planarization of A Metal-containing Substrate
App 20090061630 - Palmer; Bentley J. ;   et al.
2009-03-05
System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss
App 20080109104 - Zutshi; Ajoy ;   et al.
2008-05-08
Technique for process-qualifying a semiconductor manufacturing tool using metrology data
Grant 7,354,332 - Surana , et al. April 8, 2
2008-04-08
CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use
App 20070054495 - Compton; Timothy Frederick ;   et al.
2007-03-08
System, method, and medium for an endpoint detection scheme for copper low-dielectric damascene structures for improved dielectric and copper loss
App 20060079007 - Zutshi; Ajoy ;   et al.
2006-04-13
Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use
App 20060046490 - Banerjee; Gautam ;   et al.
2006-03-02
Technique for process-qualifying a semiconductor manufacturing tool using metrology data
App 20050032459 - Surana, Rahul ;   et al.
2005-02-10
Method and apparatus for hard pad polishing
Grant 6,620,027 - Zutshi , et al. September 16, 2
2003-09-16
Method and apparatus for hard pad polishing
App 20020090886 - Zutshi, Ajoy ;   et al.
2002-07-11
Multi-step chemical mechanical polishing
Grant 6,261,158 - Holland , et al. July 17, 2
2001-07-17

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