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Temporary bonding method with thermoplastic adhesive incorporating a rigid ring
Grant 11,088,010 - Montmeat , et al. August 10, 2 | 2021-08-10 |
Method for wafer trimming
Grant 10,818,500 - Fournel , et al. October 27, 2 | 2020-10-27 |
Temporary Bonding Method With Thermoplastic Adhesive Incorporating A Rigid Ring
App 20200090977 - Montmeat; Pierre ; et al. | 2020-03-19 |
Method For Wafer Trimming
App 20190206693 - Fournel; Franck ; et al. | 2019-07-04 |
Method for recycling a substrate holder
Grant 10,100,400 - Fournel , et al. October 16, 2 | 2018-10-16 |
Method for thinning samples
Grant 9,842,742 - Dechamp , et al. December 12, 2 | 2017-12-12 |
Method for thinning samples
App 20170117158 - DECHAMP; Jerome ; et al. | 2017-04-27 |
Process For Assembling Two Wafers And Corresponding Device
App 20160218178 - HALIMAOUI; AOMAR ; et al. | 2016-07-28 |
Process for assembling two wafers and corresponding device
Grant 9,330,957 - Halimaoui , et al. May 3, 2 | 2016-05-03 |
Method for producing a substrate holder
Grant 9,321,636 - Fournel , et al. April 26, 2 | 2016-04-26 |
Method of fabricating polymer film in the cavity of a wafer
Grant 9,219,004 - Moriceau , et al. December 22, 2 | 2015-12-22 |
Method for building a substrate holder
Grant 8,828,244 - Fournel , et al. September 9, 2 | 2014-09-09 |
Method For Performing A Mechanical Operation In A Structure Comprising Two Layers Of Different Stiffness
App 20140238213 - Moriceau; Hubert ; et al. | 2014-08-28 |
Method For Recycling A Substrate Holder
App 20140178596 - FOURNEL; Frank ; et al. | 2014-06-26 |
Method For Producing A Substrate Holder
App 20140014618 - Fournel; Frank ; et al. | 2014-01-16 |
Method for trimming a structure obtained by the assembly of two plates
Grant 8,628,674 - Zussy , et al. January 14, 2 | 2014-01-14 |
Process For Producing A Film, For Example A Single-crystal Film, On A Polymer Substrate
App 20130196484 - Moriceau; Hubert ; et al. | 2013-08-01 |
Method For Building A Substrate Holder
App 20130075365 - Fournel; Frank ; et al. | 2013-03-28 |
Method For Trimming A Structure Obtained By The Assembly Of Two Plates
App 20130078785 - Zussy; Marc ; et al. | 2013-03-28 |
Method for trimming a structure obtained by the assembly of two plates
Grant 8,329,048 - Zussy , et al. December 11, 2 | 2012-12-11 |
Method and device for separating a structure
Grant 8,302,278 - Zussy , et al. November 6, 2 | 2012-11-06 |
Process For Assembling Two Wafers And Corresponding Device
App 20120161292 - Halimaoui; Aomar ; et al. | 2012-06-28 |
Method of fabricating a mixed microtechnology structure and a structure obtained thereby
Grant 7,947,564 - Kostrzewa , et al. May 24, 2 | 2011-05-24 |
Microbattery comprising through-connections and production method thereof
Grant 7,811,702 - Laurent , et al. October 12, 2 | 2010-10-12 |
Detachable substrate or detachable structure and method for the production thereof
Grant 7,713,369 - Aspar , et al. May 11, 2 | 2010-05-11 |
Method And Device For Separating A Structure
App 20090165277 - Zussy; Marc ; et al. | 2009-07-02 |
Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localized
Grant 7,541,263 - Moriceau , et al. June 2, 2 | 2009-06-02 |
Method For Trimming A Structure Obtained By The Assembly Of Two Plates
App 20090095399 - Zussy; Marc ; et al. | 2009-04-16 |
Method of producing mixed substrates and structure thus obtained
Grant 7,494,897 - Fournel , et al. February 24, 2 | 2009-02-24 |
Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding Layer
App 20080311725 - Di Cioccio; Lea ; et al. | 2008-12-18 |
Method Of Fabricating A Mixed Microtechnology Structue And A Structure Obtained Thereby
App 20080079123 - Kostrzewa; Marek ; et al. | 2008-04-03 |
Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle
App 20080020547 - Kostrzewa; Marek ; et al. | 2008-01-24 |
Method for Providing Mixed Stacked Structures, with Various Insulating Zones and/or Electrically Conductiong Zones Vertically Localized
App 20070259528 - Moriceau; Hubert ; et al. | 2007-11-08 |
Microbattery Comprising Through-Connections and Production Method Thereof
App 20070238019 - Laurent; Jean-Yves ; et al. | 2007-10-11 |
Method for producing a stacked structure
Grant 7,229,897 - Fournel , et al. June 12, 2 | 2007-06-12 |
Method for handling semiconductor layers in such a way as to thin same
Grant 7,205,211 - Aspar , et al. April 17, 2 | 2007-04-17 |
Method of producing mixed substrates and structure thus obtained
App 20060166461 - Fournel; Franck ; et al. | 2006-07-27 |
Method for re-routing lithography-free microelectronic devices
App 20060128134 - Baleras; Francois ; et al. | 2006-06-15 |
Method for handling semiconductor layers in such a way as to thin same
App 20050124138 - Aspar, Bernard ; et al. | 2005-06-09 |
Method for producing a stacked structure
App 20050101095 - Fournel, Franck ; et al. | 2005-05-12 |
Detachable substrate or detachable structure and method for the production thereof
App 20050029224 - Aspar, Bernard ; et al. | 2005-02-10 |
Process for the manufacture of passive and active components on the same insulating substrate
Grant 6,197,695 - Joly , et al. March 6, 2 | 2001-03-06 |
Process for transferring a thin film from an initial substrate onto a final substrate
Grant 5,993,677 - Biasse , et al. November 30, 1 | 1999-11-30 |
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