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Machine Learning On Overlay Management
App 20220269184 - LIN; Tzu-Cheng ; et al. | 2022-08-25 |
Machine Learning On Overlay Management
App 20210175105 - LIN; Tzu-Cheng ; et al. | 2021-06-10 |
Machine learning on overlay virtual metrology
Grant 10,964,566 - Lin , et al. March 30, 2 | 2021-03-30 |
Machine Learning On Overlay Virtual Metrology
App 20200006102 - Lin; Tzu-Cheng ; et al. | 2020-01-02 |
Clustering for prediction models in process control and for optimal dispatching
Grant 10,054,938 - Ko , et al. August 21, 2 | 2018-08-21 |
Temperature controlled loadlock chamber
Grant 9,698,030 - Lin , et al. July 4, 2 | 2017-07-04 |
Near non-adaptive virtual metrology and chamber control
Grant 9,588,505 - Wang , et al. March 7, 2 | 2017-03-07 |
Die-tracing in integrated circuit manufacturing and packaging
Grant 9,508,653 - Zuo , et al. November 29, 2 | 2016-11-29 |
System and method for automatic quality control for assembly line processes
Grant 9,390,491 - Zuo , et al. July 12, 2 | 2016-07-12 |
Packaging methods, material dispensing methods and apparatuses, and automated measurement systems
Grant 9,390,060 - Wang , et al. July 12, 2 | 2016-07-12 |
Preventing contamination in integrated circuit manufacturing lines
Grant 9,177,843 - Sung , et al. November 3, 2 | 2015-11-03 |
System and method for through silicon via yield
Grant 9,153,506 - Wang , et al. October 6, 2 | 2015-10-06 |
Clustering for Prediction Models in Process Control and for Optimal Dispatching
App 20150241876 - Ko; Jung Cheng ; et al. | 2015-08-27 |
Clustering for prediction models in process control and for optimal dispatching
Grant 9,037,279 - Ko , et al. May 19, 2 | 2015-05-19 |
Temperature Controlled Loadlock Chamber
App 20150132100 - Lin; Chun-Hsien ; et al. | 2015-05-14 |
Solder joint reflow process for reducing packaging failure rate
Grant 9,010,617 - Yu , et al. April 21, 2 | 2015-04-21 |
Die-Tracing in Integrated Circuit Manufacturing and Packaging
App 20150079734 - Zuo; Kewei ; et al. | 2015-03-19 |
Automatic Optical Appearance Inspection By Line Scan Apparatus
App 20150051860 - ZUO; Kewei ; et al. | 2015-02-19 |
System and method to improve package and 3DIC yield in underfill process
Grant 8,945,983 - Liu , et al. February 3, 2 | 2015-02-03 |
Temperature controlled loadlock chamber
Grant 8,905,124 - Lin , et al. December 9, 2 | 2014-12-09 |
System And Method For Automatic Quality Control For Assembly Line Processes
App 20140210982 - ZUO; Kewei ; et al. | 2014-07-31 |
System and Method to Improve Package and 3DIC Yield in Underfill Process
App 20140183760 - Liu; Yen-Hsin ; et al. | 2014-07-03 |
Near Non-Adaptive Virtual Metrology and Chamber Control
App 20140088747 - Wang; Tzu-Yu ; et al. | 2014-03-27 |
Automatic virtual metrology for semiconductor wafer result prediction
Grant 8,682,466 - Ko , et al. March 25, 2 | 2014-03-25 |
System and Method for Through Silicon Via Yield
App 20140011301 - Wang; Chien Rhone ; et al. | 2014-01-09 |
Packaging Methods, Material Dispensing Methods and Apparatuses, and Automated Measurement Systems
App 20130244346 - Wang; Chien Rhone ; et al. | 2013-09-19 |
Near non-adaptive virtual metrology and chamber control
Grant 8,433,434 - Wang , et al. April 30, 2 | 2013-04-30 |
Solder Joint Reflow Process for Reducing Packaging Failure Rate
App 20120175403 - Yu; Chen-Hua ; et al. | 2012-07-12 |
Method and apparatus for thinning a substrate
Grant 7,972,969 - Yang , et al. July 5, 2 | 2011-07-05 |
System for extraction of key process parameters from fault detection classification to enable wafer prediction
Grant 7,974,728 - Lin , et al. July 5, 2 | 2011-07-05 |
Clustering for Prediction Models in Process Control and for Optimal Dispatching
App 20110060441 - Ko; Francis ; et al. | 2011-03-10 |
Near Non-Adaptive Virtual Metrology and Chamber Control
App 20110009998 - Wang; Amy ; et al. | 2011-01-13 |
Method And Apparatus For Thinning A Substrate
App 20090227047 - Yang; Ku-Feng ; et al. | 2009-09-10 |
Temperature Controlled Loadlock Chamber
App 20090000769 - Lin; Chun-Hsien ; et al. | 2009-01-01 |
Preventing Contamination in Integrated Circuit Manufacturing Lines
App 20080304944 - Sung; Chien-Ming ; et al. | 2008-12-11 |
Extraction Of Key Process Parameter
App 20080275585 - Lin; Chun-Hsien ; et al. | 2008-11-06 |
Novel Methodology To Realize Automatic Virtual Metrology
App 20080275586 - Ko; Francis ; et al. | 2008-11-06 |
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