Zuo; Jon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zuo; Jon.The latest application filed is for "modular heat sink".
- Zuo; Jon - Lancaster PA
| Patent | Date |
|---|---|
| Double sided heat exchanger cooling unit Grant 11,184,996 - Garner , et al. November 23, 2 | 2021-11-23 |
| Double sided heat exchanger cooling unit Grant 10,638,639 - Garner , et al. | 2020-04-28 |
| Modular heat sink Grant 7,306,028 - Zuo , et al. December 11, 2 | 2007-12-11 |
| Modular heat sink App 20060289147 - Zuo; Jon ; et al. | 2006-12-28 |
| Semiconductor package with lid heat spreader Grant 7,005,738 - Zuo , et al. February 28, 2 | 2006-02-28 |
| Hybrid capillary cooling apparatus Grant 6,990,816 - Zuo , et al. January 31, 2 | 2006-01-31 |
| Heat pipe having a wick structure containing phase change materials App 20050269063 - Zuo, Jon ; et al. | 2005-12-08 |
| Hybrid loop cooling of high powered devices Grant 6,948,556 - Anderson , et al. September 27, 2 | 2005-09-27 |
| Heat pipe having a wick structure containing phase change materials Grant 6,889,755 - Zuo , et al. May 10, 2 | 2005-05-10 |
| Semiconductor package with lid heat spreader App 20050093139 - Zuo, Jon ; et al. | 2005-05-05 |
| Semiconductor package with lid heat spreader Grant 6,858,929 - Zuo , et al. February 22, 2 | 2005-02-22 |
| Heat pipe having a wick structure containing phase change materials App 20040159422 - Zuo, Jon ; et al. | 2004-08-19 |
| Heat spreader with oscillating flow Grant 6,631,077 - Zuo October 7, 2 | 2003-10-07 |
| Heat spreader with oscillating flow App 20030151895 - Zuo, Jon | 2003-08-14 |
| Thermal control layer in miniature LHP/CPL wicks App 20030075306 - Zuo, Jon ; et al. | 2003-04-24 |
| Thermal bus for cabinets housing high power electronics equipment Grant 6,536,510 - Khrustalev , et al. March 25, 2 | 2003-03-25 |
| Semiconductor package with lid heat spreader Grant 6,525,420 - Zuo , et al. February 25, 2 | 2003-02-25 |
| Method and apparatus for pumped liquid cooling App 20030030987 - Zuo, Jon ; et al. | 2003-02-13 |
| Method and apparatus for pumped liquid cooling App 20030030981 - Zuo, Jon ; et al. | 2003-02-13 |
| Semiconductor package with lid heat spreader App 20030015789 - Zuo, Jon ; et al. | 2003-01-23 |
| Thermal bus for cabinets housing high power electronics equipment App 20030010477 - Khrustalev, Dmitry ; et al. | 2003-01-16 |
| Heat pipe with a secondary wick for supplying subcooled liquid to high heat flux areas App 20020139516 - Zuo, Jon | 2002-10-03 |
| Semiconductor package with internal heat spreader Grant 6,437,437 - Zuo , et al. August 20, 2 | 2002-08-20 |
| Semiconductor package with lid heat spreader App 20020100968 - Zuo, Jon ; et al. | 2002-08-01 |
| Metal hydride storage apparatus App 20020100288 - Zuo, Jon | 2002-08-01 |
| Folded fin plate heat-exchanger Grant 6,408,941 - Zuo June 25, 2 | 2002-06-25 |
| Integrated thermal architecture for thermal management of high power electronics Grant 6,388,882 - Hoover , et al. May 14, 2 | 2002-05-14 |
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