Zuniga-Ortiz; Edgar R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zuniga-Ortiz; Edgar R..The latest application filed is for "microelectromechanical system having movable element integrated into substrate-based package".

Company Profile

0.6.12

Zuniga-Ortiz; Edgar R. - McKinney TX
Zuniga-Ortiz; Edgar R - McKinney TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectromechanical system having movable element integrated into substrate-based package Grant 8,648,430 - Zuniga-Ortiz , et al. February 11, 2	2014-02-11
Microelectromechanical System Having Movable Element Integrated Into Substrate-based Package App 20130062711 - Zuniga-Ortiz; Edgar R. ; et al.	2013-03-14
Bumpless wafer scale device and board assembly Grant 7,910,471 - Zuniga-Ortiz , et al. March 22, 2	2011-03-22
Semiconductor device having post-mold nickel/palladium/gold plated leads Grant 7,368,328 - Abbott , et al. May 6, 2	2008-05-06
Semiconductor Package Having Improved Adhesion and Solderability App 20080012101 - Zuniga-Ortiz; Edgar R. ; et al.	2008-01-17
Semiconductor Device Having Post-Mold Nickel/Palladium/Gold Plated Leads App 20070269932 - Abbott; Donald C. ; et al.	2007-11-22
Hard disk drive preamp heat dissipation methods App 20070246822 - Glover; Kerry C. ; et al.	2007-10-25
Semiconductor device having post-mold nickel/palladium/gold plated leads Grant 7,268,415 - Abbott , et al. September 11, 2	2007-09-11
Method for efficient annealing of plated semiconductor package leads App 20060189029 - Koduri; Sreenivasan K. ; et al.	2006-08-24
Semiconductor device having directly attached heat spreader App 20060170080 - Zuniga-Ortiz; Edgar R. ; et al.	2006-08-03
Semiconductor package having improved adhesion and solderability App 20060125062 - Zuniga-Ortiz; Edgar R. ; et al.	2006-06-15
Semiconductor device having post-mold nickel/palladium/gold plated leads App 20060097363 - Abbott; Donald C. ; et al.	2006-05-11
Flip-chip without bumps and polymer for board assembly App 20060006532 - Zuniga-Ortiz; Edgar R. ; et al.	2006-01-12
Bumpless wafer scale device and board assembly App 20050167826 - Zuniga-Ortiz, Edgar R. ; et al.	2005-08-04
Flip-chip without bumps and polymer for board assembly Grant 6,914,332 - Zuniga-Ortiz , et al. July 5, 2	2005-07-05
Bumpless wafer scale device and board assembly Grant 6,768,210 - Zuniga-Ortiz , et al. July 27, 2	2004-07-27
Flip-chip without bumps and polymer for board assembly App 20030141593 - Zuniga-Ortiz, Edgar R. ; et al.	2003-07-31
Bumpless wafer scale device and board assembly App 20030080392 - Zuniga-Ortiz, Edgar R. ; et al.	2003-05-01

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