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name:-0.012133121490479
name:-0.011826992034912
name:-0.00046706199645996
Zschech; Ehrenfried Patent Filings

Zschech; Ehrenfried

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zschech; Ehrenfried.The latest application filed is for "device for carrying out bending tests on panel-shaped or beam shaped samples".

Company Profile
0.12.11
  • Zschech; Ehrenfried - Moritzburg DE
  • Zschech, Ehrenfried - Morizburg DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Device for carrying out bending tests on panel-shaped or beam shaped samples
Grant 11,243,151 - Sander , et al. February 8, 2
2022-02-08
Device For Carrying Out Bending Tests On Panel-shaped Or Beam Shaped Samples
App 20200309652 - SANDER; Christoph ;   et al.
2020-10-01
Illumination and imaging device for high-resolution X-ray microscopy with high photon energy
Grant 10,153,062 - Gall , et al. Dec
2018-12-11
Arrangement and method for the synchronous determination of the shear modulus and of the Poisson's number on samples of elastically isotropic and anisotropic materials
Grant 10,151,645 - Yeap , et al. Dec
2018-12-11
Illumination And Imaging Device For High-resolution X-ray Microscopy With High Photon Energy
App 20170003234 - GALL; Martin ;   et al.
2017-01-05
Insulation material for integrated circuits and use of said integrated circuits
Grant 9,117,771 - Seifert , et al. August 25, 2
2015-08-25
Arrangement And Method For The Synchronous Determination Of The Shear Modulus And Of The Poisson's Number On Samples Of Elastically Isotropic And Anisotropic Materials
App 20150066394 - YEAP; Kong Boon ;   et al.
2015-03-05
Insulation Material For Integrated Circuits And Use Of Said Integrated Circuits
App 20110297869 - Seifert; Gotthart ;   et al.
2011-12-08
Nanoprobe tip for advanced scanning probe microscopy comprising a layered probe material patterned by lithography and/or FIB techniques
Grant 8,056,402 - Hecker , et al. November 15, 2
2011-11-15
Technique for forming embedded metal lines having increased resistance against stress-induced material transport
Grant 8,039,395 - Meyer , et al. October 18, 2
2011-10-18
Nanoprobe Tip For Advanced Scanning Probe Microscopy Comprising A Layered Probe Material Patterned By Lithography And/or Fib Techniques
App 20090114000 - Hecker; Michael ;   et al.
2009-05-07
Method and apparatus for determining surface characteristics by using SPM techniques with acoustic excitation and real-time digitizing
Grant 7,441,446 - Chumakov , et al. October 28, 2
2008-10-28
Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
Grant 7,311,008 - Langer , et al. December 25, 2
2007-12-25
Method And Apparatus For Determining Surface Characteristics By Using Spm Techniques With Acoustic Excitation And Real-time Digitizing
App 20070044544 - Chumakov; Dmytro ;   et al.
2007-03-01
Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal line
Grant 7,183,629 - Engelmann , et al. February 27, 2
2007-02-27
Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure
App 20050263760 - Langer, Eckhard ;   et al.
2005-12-01
Technique for monitoring the state of metal lines in microstructures
Grant 6,953,755 - Meyer , et al. October 11, 2
2005-10-11
Technique for forming embedded metal lines having increased resistance against stress-induced material transport
App 20050161817 - Meyer, Moritz-Andreas ;   et al.
2005-07-28
Soft error resistant semiconductor device
Grant 6,894,390 - Schammler , et al. May 17, 2
2005-05-17
Technique for monitoring the state of metal lines in microstructures
App 20050072919 - Meyer, Moritz Andreas ;   et al.
2005-04-07
Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal line
App 20050046031 - Engelmann, Hans-Juergen ;   et al.
2005-03-03
Soft error resistant semiconductor device
App 20040164409 - Schammler, Gisela ;   et al.
2004-08-26

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