Zluc; Andreas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zluc; Andreas.The latest application filed is for "embedding component in component carrier by component fixation structure".

Company Profile

15.19.31

Zluc; Andreas - Leoben AT
Zluc; Andreas - Fussach AT
Zluc; Andreas - Fu.beta.ach N/A AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Embedding Component in Component Carrier by Component Fixation Structure App 20220053633 - Schwarz; Timo ; et al.	2022-02-17
Component With Dielectric Layer for Embedding in Component Carrier App 20220037262 - Weidinger; Gerald ; et al.	2022-02-03
Component with dielectric layer for embedding in component carrier Grant 11,171,092 - Weidinger , et al. November 9, 2	2021-11-09
Component Carrier With a Stepped Cavity and a Stepped Component Assembly Embedded Within the Stepped Cavity App 20210280479 - Stahr; Johannes ; et al.	2021-09-09
Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity Grant 11,049,778 - Stahr , et al. June 29, 2	2021-06-29
Connection Arrangement, Component Carrier and Method of Forming a Component Carrier Structure App 20210074662 - Moitzi; Heinz ; et al.	2021-03-11
Component Carrier and Method of Manufacturing the Same App 20210068252 - Stahr; Johannes ; et al.	2021-03-04
Component Carrier With Surface-Contactable Component Embedded in Laminated Stack App 20200365477 - Moitzi; Heinz ; et al.	2020-11-19
Hermetic Optical Component Package Having Organic Portion and Inorganic Portion App 20200365573 - Zluc; Andreas ; et al.	2020-11-19
Method for Embedding a Component in a Printed Circuit Board App 20200323081 - Schwarz; Timo ; et al.	2020-10-08
Component Carrier With Embedded Semiconductor Component and Embedded Highly-Conductive Block Which are Mutually Coupled App 20200312737 - Stahr; Johannes ; et al.	2020-10-01
Method of embedding a component in a printed circuit board Grant 10,779,413 - Schwarz , et al. Sept	2020-09-15
Embedding component with pre-connected pillar in component carrier Grant 10,765,005 - Stahr , et al. Sep	2020-09-01
Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate Grant 10,709,023 - Weidinger , et al.	2020-07-07
Methods of Manufacturing Flexible Electronic Devices App 20200205296 - Zluc; Andreas ; et al.	2020-06-25
Methods of manufacturing flexible printed circuit boards Grant 10,617,012 - Zluc , et al.	2020-04-07
Component With Dielectric Layer For Embedding In Component Carrier App 20200083173 - Weidinger; Gerald ; et al.	2020-03-12
Component Carrier With a Stepped Cavity and a Stepped Component Assembly Embedded Within the Stepped Cavity App 20190378771 - Stahr; Johannes ; et al.	2019-12-12
Method for producing a circuit board element Grant 10,426,040 - Stahr , et al. Sept	2019-09-24
Circuit board and method for manufacturing a circuit board Grant 10,306,750 - Stahr , et al.	2019-05-28
Embedding Component With Pre-Connected Pillar in Component Carrier App 20190124772 - Stahr; Hannes ; et al.	2019-04-25
Method for Making Contact with a Component Embedded in a Printed Circuit Board App 20190082543 - Weidinger; Gerald ; et al.	2019-03-14
Component Embedded in Component Carrier and Having an Exposed Side Wall App 20190045636 - Schuster; Bettina ; et al.	2019-02-07
Method for making contact with a component embedded in a printed circuit board Grant 10,187,997 - Weidinger , et al. Ja	2019-01-22
Embedding Component in Component Carrier by Component Fixation Structure App 20180177045 - Schwarz; Timo ; et al.	2018-06-21
Circuit board having an asymmetric layer structure Grant 9,967,972 - Zluc , et al. May 8, 2	2018-05-08
Circuit Board Having an Asymmetric Layer Structure App 20170339784 - Zluc; Andreas ; et al.	2017-11-23
SemiFlexible Printed Circuit Board With Embedded Component App 20170339783 - Stahr; Hannes ; et al.	2017-11-23
Methods of Manufacturing Flexible Electronic Devices App 20170231098 - Zluc; Andreas ; et al.	2017-08-10
Placement of Component in Circuit Board Intermediate Product by Flowable Adhesive Layer on Carrier Substrate App 20170181293 - Weidinger; Gerald ; et al.	2017-06-22
Method for Making Contact with a Component Embedded in a Printed Circuit Board App 20170048984 - Weidinger; Gerald ; et al.	2017-02-16
Method for Embedding a Component in a Printed Circuit Board App 20160324004 - Schwarz; Timo ; et al.	2016-11-03
Power module Grant 9,418,930 - Stahr , et al. August 16, 2	2016-08-16
Power Module App 20160133558 - Stahr; Johannes ; et al.	2016-05-12
Method For Producing A Circuit Board Element App 20160044794 - STAHR; Johannes ; et al.	2016-02-11
Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product Grant 9,253,888 - Weidinger , et al. February 2, 2	2016-02-02
Method For Integrating An Electronic Component Into A Printed Circuit Board App 20140307403 - Weichslberger; Gunther ; et al.	2014-10-16
Method For Producing A Multilayer Printed Circuit Board, Adhesion Prevention Material And Multilayer Printed Circuit Board And Use Of Such A Method App 20140216795 - Weichslberger; Gunther ; et al.	2014-08-07
Method for integrating an electronic component into a printed circuit board Grant 8,789,271 - Weichslberger , et al. July 29, 2	2014-07-29
Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method Grant 8,685,196 - Weichslberger , et al. April 1, 2	2014-04-01
Method For Integrating An Electronic Component Into A Printed Circuit Board Or A Printed Circuit Board Intermediate Product, And Printed Circuit Board Or Printed Circuit Board Intermediate Product App 20140000941 - Weidinger; Gerald ; et al.	2014-01-02
Method for removing a part of a planar material layer and multilayer structure Grant 8,541,689 - Weidinger , et al. September 24, 2	2013-09-24
Method For Producing A Multilayer Printed Circuit Board, Adhesion Prevention Material And Multilayer Printed Circuit Board And Use Of Such A Method App 20110272177 - Weichslberger; Gunther ; et al.	2011-11-10
Method For Integrating At Least One Electronic Component Into A Printed Circuit Board, And Printed Circuit Board App 20110069448 - Weichslberger; Gunther ; et al.	2011-03-24
Method For Removing A Part Of A Planar Material Layer And Multilayer Structure App 20100059262 - Weidinger; Gerald ; et al.	2010-03-11

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