Zitz; Jeffrey Allen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zitz; Jeffrey Allen.The latest application filed is for "fatigue failure resistant eletronic package".

Company Profile

2.12.13

Zitz; Jeffrey Allen - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fatigue Failure Resistant Eletronic Package App 20220157685 - Sikka; Kamal K. ; et al.	2022-05-19
Hybrid TIMs for electronic package cooling Grant 11,264,306 - Sikka , et al. March 1, 2	2022-03-01
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover Grant 11,156,409 - Zhang , et al. October 26, 2	2021-10-26
Coolant-cooled Heat Sinks With Internal Thermally-conductive Fins Joined To The Cover App 20210222956 - ZHANG; Hongqing ; et al.	2021-07-22
HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING App 20210098334 - Sikka; Kamal K. ; et al.	2021-04-01
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins Grant 10,842,043 - Zhang , et al. November 17, 2	2020-11-17
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,803,664 - Colgan , et al. September 28, 2	2010-09-28
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,768,121 - Colgan , et al. August 3, 2	2010-08-03
Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures App 20080242002 - Colgan; Evan George ; et al.	2008-10-02
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,394,659 - Colgan , et al. July 1, 2	2008-07-01
Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures App 20080042264 - Colgan; Evan George ; et al.	2008-02-21
Apparatus and methods for cooling semiconductor integrated circuit package structures Grant 7,288,839 - Colgan , et al. October 30, 2	2007-10-30
Apparatus and methods for cooling semiconductor integrated circuit package structures App 20060109630 - Colgan; Evan George ; et al.	2006-05-25
Stress resistant land grid array (LGA) module and method of forming the same Grant 6,964,885 - Coico , et al. November 15, 2	2005-11-15
Apparatus and methods for cooling semiconductor integrated circuit package structures App 20050189568 - Colgan, Evan George ; et al.	2005-09-01
Chip cooling Grant 6,774,482 - Colgan , et al. August 10, 2	2004-08-10
Stress resistant land grid array (LGA) module and method of forming the same App 20040141296 - Coico, Patrick Anthony ; et al.	2004-07-22
Chip Cooling App 20040124525 - Colgan, Evan George ; et al.	2004-07-01
EMI shielding for semiconductor chip carriers Grant 6,740,959 - Alcoe , et al. May 25, 2	2004-05-25
Stress resistant land grid array (LGA) module and method of forming the same Grant 6,703,560 - Coico , et al. March 9, 2	2004-03-09
EMI shielding for semiconductor chip carriers App 20030025180 - Alcoe, David James ; et al.	2003-02-06
Land grid array (LGA) module assembly that maximizes substrate area for electronic devices App 20020137369 - Edwards, David Linn ; et al.	2002-09-26
Method for direct attachment of a chip to a cooling member Grant 6,413,353 - Pompeo , et al. July 2, 2	2002-07-02
Stress resistant land grid array (LGA) module and method of forming the same App 20020050398 - Coico, Patrick Anthony ; et al.	2002-05-02
Method For Direct Attachment Of A Chip To A Cooling Member App 20010040006 - POMPEO, FRANK LOUIS ; et al.	2001-11-15

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