Zitz; Jeffrey A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zitz; Jeffrey A..The latest application filed is for "conformal integrated circuit (ic) device package lid".
Company Profile
3.57.55
- Zitz; Jeffrey A. - Poughkeepsie NY
- Zitz; Jeffrey A. - Hopewell Junction NY US
- Zitz; Jeffrey A. - Poughkepsie NY US
- Zitz; Jeffrey A - Poughkeepsie NY
Patent Activity
| Patent | Date |
|---|---|
| Conformal integrated circuit (IC) device package lid Grant 11,158,562 - Lewison , et al. October 26, 2 | 2021-10-26 |
| Conformal Integrated Circuit (IC) Device Package Lid App 20210249333 - Lewison; David J. ; et al. | 2021-08-12 |
| Multi integrated circuit chip carrier package Grant 10,978,314 - Interrante , et al. April 13, 2 | 2021-04-13 |
| Cooling structure for electronic boards Grant 10,905,029 - Bodenweber , et al. January 26, 2 | 2021-01-26 |
| Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader Grant 10,892,170 - Colgan , et al. January 12, 2 | 2021-01-12 |
| Cooling structure for electronic boards Grant 10,757,833 - Bodenweber , et al. A | 2020-08-25 |
| Multi Integrated Circuit Chip Carrier Package App 20200135495 - Interrante; Marcus E. ; et al. | 2020-04-30 |
| Lid attach optimization to limit electronic package warpage Grant 10,593,564 - Iruvanti , et al. | 2020-03-17 |
| Cooling Structure For Electronic Boards App 20200068744 - BODENWEBER; Paul F. ; et al. | 2020-02-27 |
| Method of fabricating a chip module with stiffening frame and orthogonal heat spreader Grant 10,566,215 - Colgan , et al. Feb | 2020-02-18 |
| Multi integrated circuit chip carrier package Grant 10,541,156 - Interrante , et al. Ja | 2020-01-21 |
| Cooling structure for electronic boards Grant 10,542,636 - Bodenweber , et al. Ja | 2020-01-21 |
| Cooling Structure For Electronic Boards App 20190335617 - BODENWEBER; Paul F. ; et al. | 2019-10-31 |
| Chip module with stiffening frame and orthogonal heat spreader Grant 10,424,494 - Colgan , et al. Sept | 2019-09-24 |
| Test cell for laminate and method Grant 10,381,276 - Iruvanti , et al. A | 2019-08-13 |
| Lid attach optimization to limit electronic package warpage Grant 10,332,813 - Iruvanti , et al. | 2019-06-25 |
| Test cell for laminate and method Grant 10,249,548 - Iruvanti , et al. | 2019-04-02 |
| Cooling structure for electronic boards Grant 10,172,258 - Bodenweber , et al. J | 2019-01-01 |
| Cooling Structure For Electronic Boards App 20180338390 - BODENWEBER; Paul F. ; et al. | 2018-11-22 |
| Method of fabricating a chip module with stiffening frame and directional heat spreader Grant 10,090,173 - Colgan , et al. October 2, 2 | 2018-10-02 |
| Chip Module With Stiffening Frame And Orthogonal Heat Spreader App 20180277396 - Colgan; Evan G. ; et al. | 2018-09-27 |
| Lid attach optimization to limit electronic package warpage Grant 10,083,886 - Iruvanti , et al. September 25, 2 | 2018-09-25 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20180233381 - Iruvanti; Sushumna ; et al. | 2018-08-16 |
| Lid attach optimization to limit electronic package warpage Grant 10,049,896 - Iruvanti , et al. August 14, 2 | 2018-08-14 |
| Lid attach optimization to limit electronic package warpage Grant 9,947,603 - Iruvanti , et al. April 17, 2 | 2018-04-17 |
| Test Cell For Laminate And Method App 20180076101 - Iruvanti; Sushumna ; et al. | 2018-03-15 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20180068916 - Iruvanti; Sushumna ; et al. | 2018-03-08 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20180068917 - Iruvanti; Sushumna ; et al. | 2018-03-08 |
| Chip Module With Stiffening Frame And Orthogonal Heat Spreader App 20180061733 - Colgan; Evan G. ; et al. | 2018-03-01 |
| Chip Module With Stiffening Frame And Orthogonal Heat Spreader App 20180061732 - Colgan; Evan G. ; et al. | 2018-03-01 |
| Cooling structure for electronic boards Grant 9,721,870 - Bodenweber , et al. August 1, 2 | 2017-08-01 |
| Cooling Structure For Electronic Boards App 20170196119 - BODENWEBER; Paul F. ; et al. | 2017-07-06 |
| Test Cell For Laminate And Method App 20170178982 - Iruvanti; Sushumna ; et al. | 2017-06-22 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20170170086 - Iruvanti; Sushumna ; et al. | 2017-06-15 |
| Lid Attach Optimization To Limit Electronic Package Warpage App 20170170030 - Iruvanti; Sushumna ; et al. | 2017-06-15 |
| Reducing directional stress in an orthotropic encapsulation member of an electronic package Grant 9,583,408 - Interrante , et al. February 28, 2 | 2017-02-28 |
| Reducing Directional Stress In An Orthotropic Encapsulation Member Of An Electronic Package App 20170053845 - INTERRANTE; Marcus E. ; et al. | 2017-02-23 |
| Chip Module With Stiffening Frame And Orthogonal Heat Spreader App 20160358836 - Colgan; Evan G. ; et al. | 2016-12-08 |
| Heat spreading layer with high thermal conductivity Grant 9,437,515 - Colgan , et al. September 6, 2 | 2016-09-06 |
| Determining magnitude of compressive loading Grant 9,366,591 - Bodenweber , et al. June 14, 2 | 2016-06-14 |
| Cooling Structure For Electronic Boards App 20160165755 - BODENWEBER; Paul F. ; et al. | 2016-06-09 |
| Heat Spreading Layer With High Thermal Conductivity App 20150371917 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150371919 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150371922 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150371918 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150373880 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heat Spreading Layer With High Thermal Conductivity App 20150373879 - Colgan; Evan G. ; et al. | 2015-12-24 |
| Heatsink attachment module Grant 9,153,460 - Colgan , et al. October 6, 2 | 2015-10-06 |
| Non-hermetic sealed multi-chip module package Grant 9,105,500 - Bodenweber , et al. August 11, 2 | 2015-08-11 |
| Multichip electronic packages and methods of manufacture Grant 9,087,834 - Kadakia , et al. July 21, 2 | 2015-07-21 |
| Disassemblable electronic assembly with leak-inhibiting coolant capillaries Grant 9,066,460 - Brunschwiler , et al. June 23, 2 | 2015-06-23 |
| Electronic assembly with detachable coolant manifold and coolant-cooled electronic module Grant 8,937,810 - Brunschwiler , et al. January 20, 2 | 2015-01-20 |
| Multichip electronic packages and methods of manufacture Grant 8,906,809 - Beaumier , et al. December 9, 2 | 2014-12-09 |
| Multichip electronic packages and methods of manufacture Grant 8,900,927 - Beaumier , et al. December 2, 2 | 2014-12-02 |
| Determining Magnitude Of Compressive Loading App 20140331792 - Bodenweber; Paul F. ; et al. | 2014-11-13 |
| Multichip electronic packages and methods of manufacture Grant 8,860,206 - Sikka , et al. October 14, 2 | 2014-10-14 |
| Heat Spreading Layer With High Thermal Conductivity App 20140284040 - Colgan; Evan G. ; et al. | 2014-09-25 |
| Heatsink attachment module Grant 8,823,164 - Colgan , et al. September 2, 2 | 2014-09-02 |
| Determining magnitude of compressive loading Grant 8,794,079 - Bodenweber , et al. August 5, 2 | 2014-08-05 |
| Disassemblable Electronic Assembly With Leak-inhibiting Coolant Capillaries App 20140198452 - BRUNSCHWILER; Thomas J. ; et al. | 2014-07-17 |
| Determining thermal interface material (TIM) thickness change Grant 8,717,043 - Bodenweber , et al. May 6, 2 | 2014-05-06 |
| Semiconductor device cooling module Grant 8,693,200 - Colgan , et al. April 8, 2 | 2014-04-08 |
| Electronic Assembly With Detachable Coolant Manifold And Coolant-cooled Electronic Module App 20140078672 - BRUNSCHWILER; Thomas J. ; et al. | 2014-03-20 |
| Multichip Electronic Packages And Methods Of Manufacture App 20140051211 - KADAKIA; Suresh D. ; et al. | 2014-02-20 |
| Multichip Electronic Packages And Methods Of Manufacture App 20140027898 - SIKKA; Kamal K. ; et al. | 2014-01-30 |
| Non-hermetic Sealed Multi-chip Module Package App 20140015387 - Bodenweber; Paul F. ; et al. | 2014-01-16 |
| Heatsink Attachment Module App 20130344660 - Colgan; Evan G. ; et al. | 2013-12-26 |
| Multichip electronic packages and methods of manufacture Grant 8,592,970 - Sikka , et al. November 26, 2 | 2013-11-26 |
| Multichip electronic packages and methods of manufacture Grant 8,587,114 - Kadakia , et al. November 19, 2 | 2013-11-19 |
| Semiconductor Device Cooling Module App 20130199752 - Colgan; Evan G. ; et al. | 2013-08-08 |
| Multichip electronic packages and methods of manufacture Grant 8,445,331 - Kadakia , et al. May 21, 2 | 2013-05-21 |
| Determining Magnitude Of Compressive Loading App 20130112006 - BODENWEBER; PAUL F. ; et al. | 2013-05-09 |
| Heatsink Attachment Module App 20130105994 - Colgan; Evan G. ; et al. | 2013-05-02 |
| Determining Thermal Interface Material (tim) Thickness Change App 20130027063 - BODENWEBER; PAUL F. ; et al. | 2013-01-31 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120326294 - SIKKA; KAMAL K. ; et al. | 2012-12-27 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120241944 - BEAUMIER; Martin M. ; et al. | 2012-09-27 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120196408 - KADAKIA; Suresh D. ; et al. | 2012-08-02 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120080784 - KADAKIA; SURESH D. ; et al. | 2012-04-05 |
| Multichip Electronic Packages And Methods Of Manufacture App 20120039046 - BEAUMIER; Martin M. ; et al. | 2012-02-16 |
| Segmentation of a die stack for 3D packaging thermal management Grant 7,928,562 - Arvelo , et al. April 19, 2 | 2011-04-19 |
| Electronic package method and structure with cure-melt hierarchy Grant 7,834,442 - Furman , et al. November 16, 2 | 2010-11-16 |
| Lid edge capping load Grant 7,733,655 - Beaumier , et al. June 8, 2 | 2010-06-08 |
| Segmentation Of A Die Stack For 3d Packaging Thermal Management App 20100019377 - Arvelo; Amilcar R. ; et al. | 2010-01-28 |
| Lid Edge Capping Load App 20100020503 - BEAUMIER; MARTIN ; et al. | 2010-01-28 |
| Electronic Package Method And Structure With Cure-melt Hierarchy App 20090179322 - FURMAN; BRUCE K ; et al. | 2009-07-16 |
| IC chip package having force-adjustable member between stiffener and printed circuit board Grant 7,443,026 - Goldmann , et al. October 28, 2 | 2008-10-28 |
| Elastomer interposer with voids in a compressive loading system Grant 7,436,057 - Long , et al. October 14, 2 | 2008-10-14 |
| Ic Chip Package Having Force-adjustable Member Between Stiffener And Printed Circuit Board App 20080123311 - Goldmann; Lewis S. ; et al. | 2008-05-29 |
| Chip package having chip extension and method Grant 7,250,576 - Colgan , et al. July 31, 2 | 2007-07-31 |
| Land Grid Array Interposer Compressive Loading System App 20070052111 - Long; David C. ; et al. | 2007-03-08 |
| Chip Package Having Chip Extension And Method App 20060261467 - Colgan; Evan G. ; et al. | 2006-11-23 |
| Method and apparatus to form a reworkable seal on an electronic module Grant 6,955,543 - Messina , et al. October 18, 2 | 2005-10-18 |
| Method And Apparatus To Form A Reworkable Seal On An Electronic Module App 20050037640 - Messina, Gaetano P. ; et al. | 2005-02-17 |
| High density thermal solution for direct attach modules Grant 6,657,864 - Dyckman , et al. December 2, 2 | 2003-12-02 |
| Method for forming chip carrier with a single protective encapsulant Grant 5,471,027 - Call , et al. November 28, 1 | 1995-11-28 |
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