Zistl; Christian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zistl; Christian.The latest application filed is for "method of patterning a low-k dielectric using a hard mask".

Company Profile

0.10.7

Zistl; Christian - Dresden DE
Zistl; Christian - Austin TX
Zistl, Christian - Oresden DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device including a hybrid metallization layer stack for enhanced mechanical strength during and after packaging Grant 8,698,312 - Werking , et al. April 15, 2	2014-04-15
Resist trim process to define small openings in dielectric layers Grant 7,737,021 - Dakshina-Murthy , et al. June 15, 2	2010-06-15
Method of patterning a low-k dielectric using a hard mask Grant 7,416,992 - Lehr , et al. August 26, 2	2008-08-26
Method of patterning a low-k dielectric using a hard mask App 20060246711 - Lehr; Matthias ; et al.	2006-11-02
Simultaneous formation of device and backside contacts on wafers having a buried insulator layer Grant 7,005,380 - Aminpur , et al. February 28, 2	2006-02-28
Semiconductor device including a hybrid metallization layer stack for enhanced mechanical strength during and after packaging App 20050242435 - Werking, James ; et al.	2005-11-03
Depth of focus (DOF) for trench-first-via-last (TFVL) damascene processing with hard mask and low viscosity photoresist Grant 6,881,665 - Tsui , et al. April 19, 2	2005-04-19
Semiconductor device with a copper line having an increased resistance against electromigration and a method of forming the same Grant 6,806,191 - Zistl , et al. October 19, 2	2004-10-19
Simultaneous formation of device and backside contacts on wafers having a buried insulator layer App 20040121599 - Aminpur, Massud ; et al.	2004-06-24
Diffusion barrier layer in semiconductor substrates to reduce copper contamination from the back side App 20030232466 - Zistl, Christian ; et al.	2003-12-18
Semiconductor device with a copper line having an increased resistance against electromigration and a method of forming the same App 20030224599 - Zistl, Christian ; et al.	2003-12-04
Locally increasing sidewall density by ion implantation Grant 6,610,594 - Apelgren , et al. August 26, 2	2003-08-26
Locally increasing sidewall density by ion implantation App 20030013296 - Apelgren, Eric M. ; et al.	2003-01-16
Resist trim process to define small openings in dielectric layers Grant 6,500,755 - Dakshina-Murthy , et al. December 31, 2	2002-12-31
Resist trim process to define small openings in dielectric layers App 20020068436 - Dakshina-Murthy, Srikanteswara ; et al.	2002-06-06
Method of forming a semiconductor device with metal silicide regions Grant 6,268,255 - Besser , et al. July 31, 2	2001-07-31

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