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Patent applications and USPTO patent grants for Ziptronix.The latest application filed is for "3d ic method and device".
Patent | Date |
---|---|
Wafer bonding hermetic encapsulation Grant 7,622,324 - Enquist , et al. November 24, 2 | 2009-11-24 |
3d Ic Method And Device App 20090068831 - Enquist; Paul M. ;   et al. | 2009-03-12 |
Three dimensional device integration method and integrated device App 20080093747 - Enquist; Paul M. ;   et al. | 2008-04-24 |
Three dimensional device integration method and integrated device App 20080061419 - Enquist; Paul M. ;   et al. | 2008-03-13 |
Three dimensional device integration method and integrated device App 20080061418 - Enquist; Paul ;   et al. | 2008-03-13 |
3D IC method and device App 20070037379 - Enquist; Paul M. ;   et al. | 2007-02-15 |
Three dimensional device integration method and integrated device App 20060292744 - Enquist; Paul M. ;   et al. | 2006-12-28 |
Room temperature metal direct bonding App 20050161795 - Tong, Qin-Yi ;   et al. | 2005-07-28 |
Wafer bonding hermetic encapsulation Grant 6,822,326 - Enquist , et al. November 23, 2 | 2004-11-23 |
Room temperature metal direct bonding App 20040157407 - Tong, Qin-Yi ;   et al. | 2004-08-12 |
Self aligned symmetric intrinsic process and device Grant 6,756,281 - Enquist June 29, 2 | 2004-06-29 |
Wafer bonding hermetic encapsulation App 20040058476 - Enquist, Paul M. ;   et al. | 2004-03-25 |
Method of epitaxial-like wafer bonding at low temperature and bonded structure App 20030141502 - Tong, Qin-Yi | 2003-07-31 |
Three dimensional device integration method and integrated device App 20030119279 - Enquist, Paul M. | 2003-06-26 |
Three dimensional device integration method and integrated device App 20020173120 - Enquist, Paul M. | 2002-11-21 |
Three dimensional device integration method and integrated device App 20020164839 - Enquist, Paul M. | 2002-11-07 |
Self aligned symmetric intrinsic process and device App 20020100916 - Enquist, Paul M. | 2002-08-01 |
Three dimensional device intergration method and intergrated device App 20020094661 - Enquist, Paul M. ;   et al. | 2002-07-18 |
Three dimensional device integration method and integrated device App 20020064906 - Enquist, Paul M. | 2002-05-30 |
Self aligned symmetric process and device Grant 6,368,930 - Enquist April 9, 2 | 2002-04-09 |
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