Ziptronix

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ziptronix.The latest application filed is for "3d ic method and device".

Company Profile

0.4.16

Ziptronix - Research Triangle Park NC
Ziptronix - Morrisville NC
ZIPTRONIX - 800 Perimeter Park Drive, Suite B Morrisville NC
Ziptronix - 3040 Cornwallis Road PO Box 12194 Research Triangle Park NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer bonding hermetic encapsulation Grant 7,622,324 - Enquist , et al. November 24, 2	2009-11-24
3d Ic Method And Device App 20090068831 - Enquist; Paul M. ; et al.	2009-03-12
Three dimensional device integration method and integrated device App 20080093747 - Enquist; Paul M. ; et al.	2008-04-24
Three dimensional device integration method and integrated device App 20080061419 - Enquist; Paul M. ; et al.	2008-03-13
Three dimensional device integration method and integrated device App 20080061418 - Enquist; Paul ; et al.	2008-03-13
3D IC method and device App 20070037379 - Enquist; Paul M. ; et al.	2007-02-15
Three dimensional device integration method and integrated device App 20060292744 - Enquist; Paul M. ; et al.	2006-12-28
Room temperature metal direct bonding App 20050161795 - Tong, Qin-Yi ; et al.	2005-07-28
Wafer bonding hermetic encapsulation Grant 6,822,326 - Enquist , et al. November 23, 2	2004-11-23
Room temperature metal direct bonding App 20040157407 - Tong, Qin-Yi ; et al.	2004-08-12
Self aligned symmetric intrinsic process and device Grant 6,756,281 - Enquist June 29, 2	2004-06-29
Wafer bonding hermetic encapsulation App 20040058476 - Enquist, Paul M. ; et al.	2004-03-25
Method of epitaxial-like wafer bonding at low temperature and bonded structure App 20030141502 - Tong, Qin-Yi	2003-07-31
Three dimensional device integration method and integrated device App 20030119279 - Enquist, Paul M.	2003-06-26
Three dimensional device integration method and integrated device App 20020173120 - Enquist, Paul M.	2002-11-21
Three dimensional device integration method and integrated device App 20020164839 - Enquist, Paul M.	2002-11-07
Self aligned symmetric intrinsic process and device App 20020100916 - Enquist, Paul M.	2002-08-01
Three dimensional device intergration method and intergrated device App 20020094661 - Enquist, Paul M. ; et al.	2002-07-18
Three dimensional device integration method and integrated device App 20020064906 - Enquist, Paul M.	2002-05-30
Self aligned symmetric process and device Grant 6,368,930 - Enquist April 9, 2	2002-04-09

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