Zillmann; Uwe

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zillmann; Uwe.The latest application filed is for "voltage-to-current conversion".

Company Profile

5.14.22

Zillmann; Uwe - Braunschweig DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for forming backside die planar devices and saw filter Grant 11,037,896 - Lee , et al. June 15, 2	2021-06-15
Voltage-to-current conversion Grant 10,554,212 - Werner , et al. Fe	2020-02-04
Die with integrated microphone device using through-silicon vias (TSVs) Grant 10,455,308 - Lee , et al. Oc	2019-10-22
Backside redistribution layer patch antenna Grant 10,403,511 - Saraswat , et al. Sep	2019-09-03
Voltage-to-current Conversion App 20190229738 - Werner; Frank ; et al.	2019-07-25
Method and apparatus for forming backside die planar devices and saw filter Grant 10,290,598 - Lee , et al.	2019-05-14
Method And Apparatus For Forming Backside Die Planar Devices And Saw Filter App 20190109107 - LEE; Kevin J. ; et al.	2019-04-11
Integrated inductor for integrated circuit devices Grant 10,256,286 - Duevel , et al.	2019-04-09
Power management in multi-die assemblies Grant 10,079,489 - Droege , et al. September 18, 2	2018-09-18
Integrated voltage regulators with magnetically enhanced inductors Grant 9,921,640 - Zillmann , et al. March 20, 2	2018-03-20
Through-body-via isolated coaxial capacitor and techniques for forming same Grant 9,911,689 - Lee , et al. March 6, 2	2018-03-06
Integrated inductor for integrated circuit devices Grant 9,881,990 - Duevel , et al. January 30, 2	2018-01-30
Integrated Inductor For Integrated Circuit Devices App 20170309700 - DUEVEL; Andreas ; et al.	2017-10-26
DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs) App 20170245035 - Lee; Kevin J. ; et al.	2017-08-24
Integrated inductor for integrated circuit devices Grant 9,673,268 - Duevel , et al. June 6, 2	2017-06-06
On-die Inductor With Improved Q-factor App 20170148750 - SARASWAT; Ruchir ; et al.	2017-05-25
Method And Apparatus For Forming Backside Die Planar Devices And Saw Filter App 20170141058 - LEE; Kevin J. ; et al.	2017-05-18
Through-body-via Isolated Coaxial Capacitor And Techniques For Forming Same App 20170040255 - LEE; KEVIN J. ; et al.	2017-02-09
Power Management In Multi-die Assemblies App 20170011779 - Droege; Guido ; et al.	2017-01-12
Integrated Inductor For Integrated Circuit Devices App 20160276424 - DUEVEL; Andreas ; et al.	2016-09-22
Power management in multi-die assemblies Grant 9,391,453 - Droege , et al. July 12, 2	2016-07-12
Resonant clocking for three-dimensional stacked devices Grant 9,287,196 - Saraswat , et al. March 15, 2	2016-03-15
Power Management In Multi-die Assemblies App 20150003181 - Droege; Guido ; et al.	2015-01-01
Backside Redistribution Layer Patch Antenna App 20140198013 - Saraswat; Ruchir ; et al.	2014-07-17
Resonant Clocking For Three-dimensional Stacked Devices App 20140183691 - Saraswat; Ruchir ; et al.	2014-07-03
Integrated Voltage Regulators With Magnetically Enhanced Inductors App 20140092574 - ZILLMANN; Uwe ; et al.	2014-04-03
Integrated Inductor For Integrated Circuit Devices App 20140027880 - Duevel; Andreas ; et al.	2014-01-30
Fast-settling clock generator App 20080002801 - Droege; Guido ; et al.	2008-01-03

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