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Patent applications and USPTO patent grants for Ziesmann; Michael.The latest application filed is for "back-side contact formation".
Patent | Date |
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Semiconductor wafer and method of producing the same Grant 9,754,832 - Schmitt , et al. September 5, 2 | 2017-09-05 |
Tamper resistant IC Grant 9,509,306 - Ostertun , et al. November 29, 2 | 2016-11-29 |
Back-side contact formation Grant 8,860,230 - Schmitt , et al. October 14, 2 | 2014-10-14 |
Back-side Contact Formation App 20130320506 - SCHMITT; Florian ;   et al. | 2013-12-05 |
Tamper Resistant Ic App 20130307578 - Ostertun; Soenke ;   et al. | 2013-11-21 |
Back-side contact formation Grant 8,551,882 - Schmitt , et al. October 8, 2 | 2013-10-08 |
Back-side Contact Formation App 20120319250 - Schmitt; Florian ;   et al. | 2012-12-20 |
Semiconductor wafer and method of producing the same App 20120306056 - Schmitt; Florian ;   et al. | 2012-12-06 |
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