Zierath; Daniel J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zierath; Daniel J..The latest application filed is for "integrated circuit interconnects".

Company Profile

5.10.21

Zierath; Daniel J. - Portland OR
Zierath; Daniel J - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit interconnects Grant 11,018,054 - Zierath , et al. May 25, 2	2021-05-25
Diffusion barriers Grant 10,651,082 - Zierath , et al.	2020-05-12
Integrated Circuit Interconnects App 20200013673 - Zierath; Daniel J. ; et al.	2020-01-09
Metal Structures, Devices, And Methods App 20190393156 - Zierath; Daniel J. ; et al.	2019-12-26
Diffusion Barriers App 20190088538 - Zierath; Daniel J. ; et al.	2019-03-21
Cobalt based interconnects and methods of fabrication thereof Grant 9,514,983 - Jezewski , et al. December 6, 2	2016-12-06
Electroless Filled Conductive Structures App 20150371949 - Zierath; Daniel J. ; et al.	2015-12-24
Electroless filled conductive structures Grant 9,123,706 - Zierath , et al. September 1, 2	2015-09-01
Liner layers for metal interconnects Grant 8,779,589 - Simka , et al. July 15, 2	2014-07-15
Cobalt Based Interconnects And Methods Of Fabrication Thereof App 20140183738 - Jezewski; Christopher J. ; et al.	2014-07-03
Electroless Filled Conductive Structures App 20130270703 - Zierath; Daniel J. ; et al.	2013-10-17
Self Forming Metal Fluoride Barriers For Fluorinated Low-k Dielectrics App 20120258588 - Jezewski; Christopher J. ; et al.	2012-10-11
Liner Layers For Metal Interconnects App 20120153478 - Simka; Harsono S. ; et al.	2012-06-21
Barrierless Single-phase Interconnect App 20120153483 - Akolkar; Rohan N. ; et al.	2012-06-21
Self Forming Metal Fluoride Barriers for Fluorinated Low-K Dielectrics App 20100244252 - Jezewski; Christopher J. ; et al.	2010-09-30
Method of fabricating metal interconnects using a sacrificial layer to protect seed layer prior to gap fill App 20080113508 - Akolkar; Rohan N. ; et al.	2008-05-15
Modified electroplating solution components in a low-acid electrolyte solution Grant 7,371,311 - Zierath , et al. May 13, 2	2008-05-13
Apparatus having plating solution container with current applying anodes Grant 7,279,084 - Chalupa , et al. October 9, 2	2007-10-09
Methods for reducing protrusions and within die thickness variations on plated thin film App 20060091018 - Cao; Yang ; et al.	2006-05-04
Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions App 20060006071 - Che; Guangli ; et al.	2006-01-12
Modified electroplating solution components in a low-acid electrolyte solution App 20050274619 - Zierath, Daniel J. ; et al.	2005-12-15
Apparatus having plating solution container with current applying anodes App 20050173241 - Chalupa, Radek P. ; et al.	2005-08-11
Modified electroplating solution components in a low-acid electrolyte solution App 20050077181 - Zierath, Daniel J. ; et al.	2005-04-14
Modified electroplating solution components in a high-acid electrolyte solution App 20050077180 - Zierath, Daniel J. ; et al.	2005-04-14
Method for improving electroplating in sub-0.1um interconnects by adjusting immersion conditions App 20040245107 - Che, Guangli ; et al.	2004-12-09
Methods for reducing protrusions and within die thickness variations on plated thin film App 20040188265 - Cao, Yang ; et al.	2004-09-30

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