ZIADEH; Bassam M.
Patent Applications and Registrations
Patent applications and USPTO patent grants for ZIADEH; Bassam M..The latest application filed is for "low cost package warpage solution".
- ZIADEH; Bassam M. - Laveen AZ
- Ziadeh; Bassam M. - Gilbert AZ
| Patent | Date |
|---|---|
| Low Cost Package Warpage Solution App 20220230892 - KARHADE; Omkar G. ; et al. | 2022-07-21 |
| Low cost package warpage solution Grant 11,328,937 - Karhade , et al. May 10, 2 | 2022-05-10 |
| Low Cost Package Warpage Solution App 20200350181 - KARHADE; Omkar G. ; et al. | 2020-11-05 |
| Low cost package warpage solution Grant 10,741,419 - Karhade , et al. A | 2020-08-11 |
| Decoupling systems Grant 10,529,600 - Ziadeh , et al. J | 2020-01-07 |
| Low Cost Package Warpage Solution App 20190341271 - KARHADE; Omkar G. ; et al. | 2019-11-07 |
| Low cost package warpage solution Grant 10,403,512 - Karhade , et al. Sep | 2019-09-03 |
| Containers for holding and dispensing stacks of electronic device components Grant 10,214,340 - Xu , et al. Feb | 2019-02-26 |
| Decoupling Systems And Methods For Same App 20180286832 - Ziadeh; Bassam M. ; et al. | 2018-10-04 |
| Low Cost Package Warpage Solution App 20180190510 - Karhade; Omkar G. ; et al. | 2018-07-05 |
| Integrated circuit assembly that includes stacked dice Grant 9,991,243 - Karhade , et al. June 5, 2 | 2018-06-05 |
| Low cost package warpage solution Grant 9,899,238 - Karhade , et al. February 20, 2 | 2018-02-20 |
| Minimal Contact End-effectors For Handling Microelectronic Devices App 20180005863 - CHAVEZ-CLEMENTE; DANIEL ; et al. | 2018-01-04 |
| Containers For Holding And Dispensing Stacks Of Electronic Device Components App 20180002101 - Xu; Mingjie ; et al. | 2018-01-04 |
| Integrated Circuit Assembly That Includes Stacked Dice App 20170323874 - Karhade; Omkar ; et al. | 2017-11-09 |
| Methods to form high density through-mold interconnections Grant 9,741,692 - Karhade , et al. August 22, 2 | 2017-08-22 |
| Integrated circuit assembly that includes stacked dice Grant 9,576,942 - Karhade , et al. February 21, 2 | 2017-02-21 |
| Methods To Form High Density Through-mold Interconnections App 20160268231 - Karhade; Omkar G. ; et al. | 2016-09-15 |
| Low Cost Package Warpage Solution App 20160181218 - Karhade; Omkar G. ; et al. | 2016-06-23 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 