Zhuo; Qizhuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhuo; Qizhuo.The latest application filed is for "method for shielding system-in-package assemblies from electromagnetic interference".

Company Profile

9.10.9

Zhuo; Qizhuo - Irvine CA
Zhuo; Qizhuo - Vista CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for shielding system-in-package assemblies from electromagnetic interference Grant 11,304,346 - Hong , et al. April 12, 2	2022-04-12
Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof Grant 10,985,108 - Hong , et al. April 20, 2	2021-04-20
Method For Shielding System-in-package Assemblies From Electromagnetic Interference App 20210092884 - Hong; Xuan ; et al.	2021-03-25
Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof Grant 10,937,740 - Hong , et al. March 2, 2	2021-03-02
Achieving electromagnetic interference shielding protection by deposition of highly conductive compositions Grant 10,858,523 - Gao , et al. December 8, 2	2020-12-08
Method for shielding system-in-package assemblies from electromagnetic interference Grant 10,834,858 - Hong , et al. November 10, 2	2020-11-10
Graphene-containing materials for coating and gap filling applications Grant 10,741,503 - Hong , et al. A	2020-08-11
Method For Shielding System-in-package Assemblies From Electromagnetic Interference App 20200084924 - Hong; Xuan ; et al.	2020-03-12
Graphene-containing Materials For Coating And Gap Filling Applications App 20190206805 - HONG; Xuan ; et al.	2019-07-04
Compositions For Gap Coating And/or Filling In Or Between Electronic Packages By Capillary Flow And Methods For The Use Thereof App 20190096822 - Hong; Xuan ; et al.	2019-03-28
Sinterable Films And Pastes And Methods For Use Thereof App 20180056449 - ZHU; Pukun ; et al.	2018-03-01
Wafer back side coating as dicing tape adhesive Grant 9,230,888 - Dutt , et al. January 5, 2	2016-01-05
Wafer Back Side Coating As Dicing Tape Adhesive App 20140225283 - Dutt; Gyanendra ; et al.	2014-08-14
B-stageable and skip-curable wafer back side coating adhesives Grant 8,759,422 - Wang , et al. June 24, 2	2014-06-24
B-stageable And Skip-curable Wafer Back Side Coating Adhesives App 20130197130 - Wang; Eric C. ; et al.	2013-08-01
Highly conductive composition for wafer coating Grant 7,422,707 - Zhuo September 9, 2	2008-09-09
Highly conductive composition for wafer coating App 20080164612 - Zhuo; Qizhuo	2008-07-10
Highly Conductive Composition For Wafer Coating App 20080166543 - Zhuo; Qizhuo	2008-07-10
Thermally conductive thermoplastic Grant 6,162,849 - Zhuo , et al. December 19, 2	2000-12-19

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