ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD..The latest application filed is for "manufacturing method for back drilling hole in pcb and pcb".

Company Profile

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ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD. - Zhuhai N/A CN
ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD - Zhuhai CN
Zhuhai Founder Tech Hi-Density Electronic Co Ltd. - Guangdong Province N/A CN
ZHUHAI FOUNDER TECH HI-DENSITY ELECTRONIC CO., LTD. - Zhuhai, Guangdong N/A CN
Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd. - Zhuhai City, Guangdong CN
Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd.; - Zhuhai City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method for back drilling hole in PCB and PCB Grant 9,756,734 - Chen , et al. September 5, 2	2017-09-05
Manufacturing Method For Back Drilling Hole In Pcb And Pcb App 20160150653 - CHEN; Xiaren ; et al.	2016-05-26
PCB back drill detection method and PCB plating Grant 9,258,885 - Huang , et al. February 9, 2	2016-02-09
Methods and apparatuses for detecting registration offsets Grant 9,232,632 - Su , et al. January 5, 2	2016-01-05
Printed circuit board compensation processing method, device, and PCB Grant 9,185,808 - Chen , et al. November 10, 2	2015-11-10
Pcb Back Drill Detection Method And Pcb Plating App 20150264804 - Huang; Shiqing ; et al.	2015-09-17
Fabrication Method Of A Rigid-flexible Circuit Board And Rigid-flexible Printed Circuit Board App 20140318832 - Huang; Yong ; et al.	2014-10-30
Printed Circuit Board Compensation Processing Method, Device, and PCB App 20130180761 - CHEN; Lanyuan ; et al.	2013-07-18
Printed Circuit Board and Method of Manufacturing Same App 20130168140 - CHEN; Xianren ; et al.	2013-07-04
Methods and Apparatuses for Detecting Registration Offsets App 20130161072 - SU; Xinhong ; et al.	2013-06-27

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