Zhuhai ACCESS Semiconductor Co., Ltd

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhuhai ACCESS Semiconductor Co., Ltd.The latest application filed is for "heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate".

Company Profile

4.12.18

Zhuhai ACCESS Semiconductor Co., Ltd - Zhuhai City CN
Zhuhai ACCESS Semiconductor Co., Ltd - Guangdong CN
Zhuhai ACCESS Semiconductor Co., Ltd. - Zhuhai City CN
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD - Zhuhai CN
Zhuhai ACCESS Semiconductor Co., Ltd. - Guangdong CN
Zhuhai ACCESS Semiconductor Co., Ltd. - Zhuhai CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat Dissipation-electromagnetic Shielding Embedded Packaging Structure, Manufacturing Method Thereof, And Substrate App 20220310529 - Chen; Xianming ; et al.	2022-09-29
Embedded packaging structure having shielding cavity and manufacturing method thereof Grant 11,450,619 - Chen , et al. September 20, 2	2022-09-20
Temporary Carrier And Method For Manufacturing Coreless Substrate Thereby App 20220295646 - CHEN; Xianming ; et al.	2022-09-15
Inductor-integrating Embedded Support Frame And Substrate, And Manufacturing Method Thereof App 20220285088 - CHEN; Xianming ; et al.	2022-09-08
Packaging Structure With Antenna And Manufacturing Method Thereof App 20220254741 - CHEN; Xianming ; et al.	2022-08-11
Method for manufacturing coreless substrate Grant 11,399,440 - Chen , et al. July 26, 2	2022-07-26
Substrate Manufacturing Method For Realizing Three-dimensional Packaging App 20220189789 - Chen; Xianming ; et al.	2022-06-16
Package structure of integrated passive device and manufacturing method thereof, and substrate Grant 11,342,273 - Chen , et al. May 24, 2	2022-05-24
Cavity Substrate Having Directional Optoelectronic Transmission Channel And Manufacturing Method Thereof App 20220066096 - CHEN; Xianming ; et al.	2022-03-03
Circuit Prearranged Heat Dissipation Embedded Packaging Structure And Manufacturing Method Thereof App 20220068760 - CHEN; Xianming ; et al.	2022-03-03
Connector For Implementing Multi-faceted Interconnection And Manufacturing Method Thereof App 20220068825 - CHEN; Xianming ; et al.	2022-03-03
Embedded Structure, Manufacturing Method Thereof And Substrate App 20220059520 - Chen; Xianming ; et al.	2022-02-24
Interposer board without feature layer structure and method for manufacturing the same Grant 11,257,713 - Chen , et al. February 22, 2	2022-02-22
Passive Device Packaging Structure Embedded In Glass Medium And Method For Manufacturing The Same App 20220053644 - CHEN; Xianming ; et al.	2022-02-17
Embedded Packaging Structure Having Shielding Cavity And Manufacturing Method Thereof App 20220045014 - CHEN; Xianming ; et al.	2022-02-10
Embedded Packaging Structure And Method For Manufacturing The Same App 20220045043 - CHEN; Xianming ; et al.	2022-02-10
Package Substrate And Manufacturing Method Thereof App 20220013462 - CHEN; Xianming ; et al.	2022-01-13
Support Frame Structure And Manufacturing Method Thereof App 20210407921 - CHEN; Xianming ; et al.	2021-12-30
Package Structure Of Integrated Passive Device And Manufacturing Method Thereof, And Substrate App 20210407922 - CHEN; Xianming ; et al.	2021-12-30
Temporary Carrier And Method For Manufacturing Coreless Substrate Thereby App 20210410297 - CHEN; Xianming ; et al.	2021-12-30
Method For Manufacturing Embedded Package Structure Having Air Resonant Cavity App 20210399400 - CHEN; Xianming ; et al.	2021-12-23
Interposer Board Without Feature Layer Structure And Method For Manufacturing The Same App 20210391213 - CHEN; Xianming ; et al.	2021-12-16
Embedded packaging method capable of realizing heat dissipation Grant 11,114,310 - Chen , et al. September 7, 2	2021-09-07
Substrates with ultra fine pitch flip chip bumps Grant 10,779,417 - Hurwitz , et al. Sept	2020-09-15
Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor Grant 10,446,335 - Hurwitz , et al. Oc	2019-10-15

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.