loadpatents
name:-0.0083379745483398
name:-0.0093419551849365
name:-0.0047721862792969
Zhu; Xiaoqi Patent Filings

Zhu; Xiaoqi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhu; Xiaoqi.The latest application filed is for "noninvasive deep brain stimulation system having k focuses".

Company Profile
1.8.5
  • Zhu; Xiaoqi - Xi'an CN
  • Zhu, Xiaoqi - Vista CA
  • Zhu; Xiaoqi - San Diego CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Noninvasive deep brain stimulation system having k focuses
Grant 11,071,862 - Wang , et al. July 27, 2
2021-07-27
Noninvasive Deep Brain Stimulation System Having K Focuses
App 20190366088 - WANG; Jue ;   et al.
2019-12-05
Semiconductor flip-chip package and method for the fabrication thereof
App 20050218517 - Capote, Miguel A. ;   et al.
2005-10-06
Semiconductor flip-chip package and method for the fabrication thereof
Grant 6,774,493 - Capote , et al. August 10, 2
2004-08-10
Semiconductor flip-chip package and method for the fabrication thereof
App 20030218261 - Capote, Miguel A. ;   et al.
2003-11-27
Semiconductor flip-chip package and method for the fabrication thereof
Grant 6,566,234 - Capote , et al. May 20, 2
2003-05-20
Semiconductor flip-chip package and method for the fabrication thereof
Grant 6,518,677 - Capote , et al. February 11, 2
2003-02-11
Semiconductor flip-chip package and method for the fabrication thereof
Grant 6,399,426 - Capote , et al. June 4, 2
2002-06-04
Semiconductor flip-chip package and method for the fabrication thereof
App 20020031868 - Capote, Miguel Albert ;   et al.
2002-03-14
Semiconductor flip-chip package and method for the fabrication thereof
App 20020014703 - Capote, Miguel A. ;   et al.
2002-02-07
Semiconductor flip-chip package and method for the fabrication thereof
Grant 6,335,571 - Capote , et al. January 1, 2
2002-01-01
Semiconductor flip-chip assembly with pre-applied encapsulating layers
Grant 6,297,560 - Capote , et al. October 2, 2
2001-10-02
Semiconductor flip-chip package and method for the fabrication thereof
Grant 6,121,689 - Capote , et al. September 19, 2
2000-09-19

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