| Patent | Date |
|---|
Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same
Grant 11,430,756 - Huo , et al. August 30, 2 | 2022-08-30 |
Method For Forming Lead Wires In Hybrid-bonded Semiconductor Devices
App 20220270919 - YAN; Meng ; et al. | 2022-08-25 |
Method For Forming Lead Wires In Hybrid-bonded Semiconductor Devices
App 20220216099 - YAN; Meng ; et al. | 2022-07-07 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20220208677 - ZHU; Jifeng ; et al. | 2022-06-30 |
Method for forming lead wires in hybrid-bonded semiconductor devices
Grant 11,322,392 - Yan , et al. May 3, 2 | 2022-05-03 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 11,276,642 - Zhu , et al. March 15, 2 | 2022-03-15 |
Three-dimensional memory devices and methods for forming the same
Grant 11,211,397 - Lu , et al. December 28, 2 | 2021-12-28 |
Semiconductor Structure And Method Of Forming The Same
App 20210398932 - CHEN; Jun ; et al. | 2021-12-23 |
Memory Cell Structure Of A Three-dimensional Memory Device
App 20210399001 - DAI; Xiaowang ; et al. | 2021-12-23 |
Hybrid bonding using dummy bonding contacts and dummy interconnects
Grant 11,205,619 - Wang , et al. December 21, 2 | 2021-12-21 |
Semiconductor Structure And Method Of Forming The Same
App 20210335745 - CHEN; Jun ; et al. | 2021-10-28 |
Staircase structure for memory device
Grant 11,145,666 - Lu , et al. October 12, 2 | 2021-10-12 |
Memory cell structure of a three-dimensional memory device
Grant 11,133,325 - Dai , et al. September 28, 2 | 2021-09-28 |
Three-dimensional Memory Devices Having A Plurality Of Nand Strings
App 20210296341 - ZHU; Jifeng ; et al. | 2021-09-23 |
Word line contact structure for three-dimensional memory devices and fabrication methods thereof
Grant 11,101,276 - Zhu , et al. August 24, 2 | 2021-08-24 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 11,056,387 - Zhu , et al. July 6, 2 | 2021-07-06 |
Hybrid bonding using dummy bonding contacts
Grant 11,049,834 - Wang , et al. June 29, 2 | 2021-06-29 |
Three-dimensional memory devices having a plurality of NAND strings
Grant 11,031,333 - Zhu , et al. June 8, 2 | 2021-06-08 |
Three-Dimensional Memory Devices and Methods for Forming the Same
App 20210098491 - LU; Zhenyu ; et al. | 2021-04-01 |
Hybrid Bonding Using Dummy Bonding Contacts
App 20210035941 - Wang; Tao ; et al. | 2021-02-04 |
Memory Cell Structure Of A Three-dimensional Memory Device
App 20210005625 - DAI; Xiaowang ; et al. | 2021-01-07 |
Three-dimensional Memory Devices And Fabricating Methods Thereof
App 20200411547 - LU; Zhenyu ; et al. | 2020-12-31 |
Method For Forming Lead Wires In Hybrid-bonded Semiconductor Devices
App 20200402841 - YAN; Meng ; et al. | 2020-12-24 |
Three-dimensional memory devices
Grant 10,867,678 - Chen , et al. December 15, 2 | 2020-12-15 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20200381360 - ZHU; Jifeng ; et al. | 2020-12-03 |
Bonded Semiconductor Structures Having Bonding Contacts Made Of Indiffusible Conductive Materials And Methods For Forming The Same
App 20200381384 - Huo; Zongliang ; et al. | 2020-12-03 |
Memory cell structure of a three-dimensional memory device
Grant 10,847,528 - Dai , et al. November 24, 2 | 2020-11-24 |
Memory structure and method for forming the same
Grant 10,840,125 - Dong , et al. November 17, 2 | 2020-11-17 |
Hybrid bonding using dummy bonding contacts
Grant 10,833,042 - Wang , et al. November 10, 2 | 2020-11-10 |
Hybrid Bonding Using Dummy Bonding Contacts And Dummy Interconnects
App 20200335450 - Wang; Tao ; et al. | 2020-10-22 |
Three-dimensional memory devices and fabricating methods thereof
Grant 10,804,287 - Lu , et al. October 13, 2 | 2020-10-13 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 10,796,993 - Zhu , et al. October 6, 2 | 2020-10-06 |
Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same
Grant 10,784,225 - Huo , et al. Sept | 2020-09-22 |
Staircase Structure For Memory Device
App 20200295019 - LU; Zhenyu ; et al. | 2020-09-17 |
Method for forming lead wires in hybrid-bonded semiconductor devices
Grant 10,763,158 - Yan , et al. Sep | 2020-09-01 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20200266147 - ZHU; Jifeng ; et al. | 2020-08-20 |
Hybrid bonding using dummy bonding contacts and dummy interconnects
Grant 10,748,851 - Wang , et al. A | 2020-08-18 |
Word Line Contact Structure For Three-dimensional Memory Devices And Fabrication Methods Thereof
App 20200258837 - A1 | 2020-08-13 |
Bonded Semiconductor Structures Having Bonding Contacts Made Of Indiffusible Conductive Materials And Methods For Forming The Sa
App 20200258857 - A1 | 2020-08-13 |
Memory Cell Structure Of A Three-dimensional Memory Device
App 20200243553 - DAI; Xiaowang ; et al. | 2020-07-30 |
Hybrid Bonding Using Dummy Bonding Contacts
App 20200243473 - Wang; Tao ; et al. | 2020-07-30 |
Hybrid Bonding Using Dummy Bonding Contacts And Dummy Interconnects
App 20200243455 - Wang; Tao ; et al. | 2020-07-30 |
Staircase structure for memory device
Grant 10,680,003 - Lu , et al. | 2020-06-09 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 10,679,941 - Zhu , et al. | 2020-06-09 |
Word line contact structure for three-dimensional memory devices and fabrication methods thereof
Grant 10,672,711 - Zhu , et al. | 2020-06-02 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20200152515 - ZHU; Jifeng ; et al. | 2020-05-14 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 10,651,087 - Zhu , et al. | 2020-05-12 |
Memory cell structure of a three-dimensional memory device
Grant 10,644,015 - Dai , et al. | 2020-05-05 |
Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof
Grant 10,607,887 - Zhu , et al. | 2020-03-31 |
Methods for forming three-dimensional memory devices
Grant 10,580,788 - Zhu , et al. | 2020-03-03 |
Memory Structure And Method For Forming The Same
App 20200035542 - Dong; Jin Wen ; et al. | 2020-01-30 |
Methods For Forming Three-dimensional Memory Devices
App 20200027892 - Zhu; Jifeng ; et al. | 2020-01-23 |
Three-dimensional Memory Devices
App 20200027509 - Chen; Jun ; et al. | 2020-01-23 |
Semiconductor Structure And Method Of Forming The Same
App 20200006284 - CHEN; Jun ; et al. | 2020-01-02 |
Semiconductor Structure And Method Of Forming The Same
App 20200006275 - CHEN; Jun ; et al. | 2020-01-02 |
Method for forming dual-deck channel hole structure of three-dimensional memory device
Grant 10,515,975 - Tao , et al. Dec | 2019-12-24 |
Method For Forming Dual-deck Channel Hole Structure Of Three-dimensional Memory Device
App 20190378849 - Tao; Qian ; et al. | 2019-12-12 |
Memory structure and forming method thereof
Grant 10,497,708 - Chen , et al. De | 2019-12-03 |
Three-dimensional Memory Devices Having A Plurality Of Nand Strings
App 20190244893 - ZHU; Jifeng ; et al. | 2019-08-08 |
Three-dimensional Memory Devices Having A Plurality Of Nand Strings
App 20190244892 - Zhu; Jifeng ; et al. | 2019-08-08 |
Three-dimensional memory devices having a plurality of NAND strings
Grant 10,283,452 - Zhu , et al. | 2019-05-07 |
Word Line Contact Structure For Three-dimensional Memory Devices And Fabrication Methods Thereof
App 20190096810 - ZHU; Jifeng ; et al. | 2019-03-28 |
Memory Cell Structure Of A Three-dimensional Memory Device
App 20190096901 - DAI; Xiaowang ; et al. | 2019-03-28 |
Three-Dimensional Memory Devices and Methods for Forming the Same
App 20190088589 - ZHU; Jifeng ; et al. | 2019-03-21 |
Method For Forming Lead Wires In Hybrid-bonded Semiconductor Devices
App 20190088535 - Yan; Meng ; et al. | 2019-03-21 |
Three-dimensional Memory Devices And Methods For Forming The Same
App 20190081069 - LU; Zhenyu ; et al. | 2019-03-14 |
Staircase Structure For Memory Device
App 20190081070 - LU; Zhenyu ; et al. | 2019-03-14 |
Three-dimensional Memory Devices And Fabricating Methods Thereof
App 20190074291 - Lu; Zhenyu ; et al. | 2019-03-07 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20190067105 - ZHU; Jifeng ; et al. | 2019-02-28 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20190067196 - ZHU; Jifeng ; et al. | 2019-02-28 |
Method For Forming Three-dimensional Integrated Wiring Structure And Semiconductor Structure Thereof
App 20190067106 - ZHU; Jifeng ; et al. | 2019-02-28 |
Backside Illuminated Cmos Image Sensor And Method Of Fabricating The Same
App 20180342543 - LIU; Yanyun ; et al. | 2018-11-29 |
Semiconductor cooling method and method of heat dissipation
Grant 9,589,937 - Mei , et al. March 7, 2 | 2017-03-07 |
Preparation method of three-dimensional integrated inductor-capacitor structure
Grant 9,455,221 - Mei , et al. September 27, 2 | 2016-09-27 |
Preparation process of image sensors
Grant 9,455,297 - Hu , et al. September 27, 2 | 2016-09-27 |
Preparation Process Of Image Sensors
App 20160093663 - HU; Siping ; et al. | 2016-03-31 |
Image Sensor Having An Embedded Color Filter And Its Preparation Method
App 20160093661 - Hu; Siping ; et al. | 2016-03-31 |
Preparation Method Of Three-dimensional Integrated Inductor-capacitor Structure
App 20160079165 - MEI; Shaoning ; et al. | 2016-03-17 |
Semiconductor Cooling Structure And Method In A Mixed Bonding Process
App 20160043058 - Mei; Shaoning ; et al. | 2016-02-11 |
| 