Zhu; Huanfeng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhu; Huanfeng.The latest application filed is for "protection of seed layers during electrodeposition of metals in semiconductor device manufacturing".

Company Profile

0.5.8

Zhu; Huanfeng - West Linn OR
Zhu; Huanfeng - Tigard OR
Zhu; Huanfeng - Tualatin OR US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Protection Of Seed Layers During Electrodeposition Of Metals In Semiconductor Device Manufacturing App 20220208604 - Zhu; Huanfeng ; et al.	2022-06-30
Method and apparatus for filling interconnect structures Grant 10,006,144 - Reid , et al. June 26, 2	2018-06-26
Bottom-up Fill In Damascene Features App 20150053565 - Zhu; Huanfeng ; et al.	2015-02-26
Methods For Reducing Metal Oxide Surfaces To Modified Metal Surfaces App 20140199497 - Spurlin; Tighe A. ; et al.	2014-07-17
Method And Apparatus For Filling Interconnect Structures App 20140138239 - Reid; Jonathan D. ; et al.	2014-05-22
Method And Apparatus For Filling Interconnect Structures App 20140124361 - Reid; Jonathan D. ; et al.	2014-05-08
Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers Grant 8,703,615 - Ponnuswamy , et al. April 22, 2	2014-04-22
Method and apparatus for filling interconnect structures Grant 8,575,028 - Reid , et al. November 5, 2	2013-11-05
Method And Apparatus For Filling Interconnect Structures App 20120261254 - REID; Jonathan D. ; et al.	2012-10-18
Method And Apparatus For Filling Interconnect Structures App 20120264290 - REID; Jonathan D. ; et al.	2012-10-18

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