Zhou; Zengyu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zhou; Zengyu.The latest application filed is for "packaged memory device with flip chip and wire bond dies".
- Zhou; Zengyu - Shanghai CN
| Patent | Date |
|---|---|
| Packaged Memory Device With Flip Chip And Wire Bond Dies App 20220285316 - Yuan; Rui ; et al. | 2022-09-08 |
| Reducing Keep-out-zone Area For A Semiconductor Device App 20220093559 - Du; Kevin ; et al. | 2022-03-24 |
| Semiconductor device including high speed heterogeneous integrated controller and cache Grant 11,031,378 - Zhang , et al. June 8, 2 | 2021-06-08 |
| Semiconductor Device Including High Speed Heterogeneous Integrated Controller And Cache App 20200411479 - Zhang; Yazhou ; et al. | 2020-12-31 |
| Semiconductor device including vertically integrated groups of semiconductor packages Grant 10,236,276 - Liu , et al. | 2019-03-19 |
| Fan out semiconductor device including a plurality of semiconductor die Grant 10,177,119 - Zhang , et al. J | 2019-01-08 |
| Semiconductor Device Including Vertically Integrated Groups Of Semiconductor Packages App 20180294251 - Liu; Yangming ; et al. | 2018-10-11 |
| Fan Out Semiconductor Device Including A Plurality Of Semiconductor Die App 20180019228 - Zhang; Cong ; et al. | 2018-01-18 |
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