ZHOU; Xianfeng

Patent Applications and Registrations

Patent applications and USPTO patent grants for ZHOU; Xianfeng.The latest application filed is for "micro-nano structure formed by self-assembling organic small molecule compound and use thereof".

Company Profile

3.32.33

ZHOU; Xianfeng - Qingdao Shandong
Zhou; Xianfeng - Beijing CN
Zhou; Xianfeng - Meridian ID
Zhou; Xianfeng - Akron OH
Zhou; Xianfeng - Fremont CA
Zhou; Xianfeng - Tempe AZ US
Zhou; Xianfeng - Boise ID US
Zhou; Xianfeng - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Micro-nano Structure Formed By Self-assembling Organic Small Molecule Compound And Use Thereof App 20220105183 - ZHOU; Xianfeng ; et al.	2022-04-07
Heat transfer tube and cracking furnace using the same Grant 11,215,404 - Wang , et al. January 4, 2	2022-01-04
Heat Transfer Tube And Cracking Furnace Using The Same App 20190128622 - WANG; Guoqing ; et al.	2019-05-02
Heat transfer tube and cracking furnace using the same Grant 10,209,011 - Wang , et al. Feb	2019-02-19
Isolation trench fill using oxide liner and nitride etch back technique with dual trench depth capability Grant 9,799,727 - Zhou October 24, 2	2017-10-24
Steam cracking processes Grant 9,505,677 - Wang , et al. November 29, 2	2016-11-29
Polyhedral oligomeric silsesquioxane (poss)-based bioactive hybrid glass as a scaffold for hard tissue engineering Grant 9,486,555 - Sahai , et al. November 8, 2	2016-11-08
Isolation Trench Fill Using Oxide Liner and Nitride Etch Back Technique With Dual Trench Depth Capability App 20160247878 - Zhou; Xianfeng	2016-08-25
Heat transfer tube and cracking furnace using the heat transfer tube Grant 9,359,560 - Wang , et al. June 7, 2	2016-06-07
Isolation trench fill using oxide liner and nitride etch back technique with dual trench depth capability Grant 9,349,632 - Zhou May 24, 2	2016-05-24
Fluorescent potassium ion sensors Grant 9,181,375 - Tian , et al. November 10, 2	2015-11-10
Polyhedral Oligomeric Silsesquioxane (poss)-based Bioactive Hybrid Glass As A Scaffold For Hard Tissue Engineering App 20150297788 - Sahai; Nita ; et al.	2015-10-22
Isolation Trench Fill Using Oxide Liner And Nitride Etch Back Technique With Dual Trench Depth Capability App 20150194336 - Zhou; Xianfeng	2015-07-09
Heat Transfer Tube And Cracking Furnace Using The Same App 20150114609 - Wang; Guoqing ; et al.	2015-04-30
Isolation trench fill using oxide liner and nitride etch back technique with dual trench depth capability Grant 8,952,485 - Zhou February 10, 2	2015-02-10
Fluorescent Potassium Ion Sensors App 20140200319 - Tian; Yanqing ; et al.	2014-07-17
Heat Transfer Tube And Cracking Furnace Using The Heat Transfer Tube App 20140127091 - WANG; Guoqing ; et al.	2014-05-08
Tubular cracking furnace Grant 8,585,890 - Wang , et al. November 19, 2	2013-11-19
Method of fabricating different gate oxides for different transistors in an integrated circuit Grant 8,304,307 - Zhou November 6, 2	2012-11-06
Different Gate Oxides Thicknesses For Different Transistors In An Integrated Circuit App 20120108051 - Zhou; Xianfeng	2012-05-03
Different gate oxides thicknesses for different transistors in an integrated circuit Grant 8,102,006 - Zhou January 24, 2	2012-01-24
Formation of standard voltage threshold and low voltage threshold MOSFET devices Grant 8,053,321 - Helm , et al. November 8, 2	2011-11-08
Semiconductor constructions Grant 8,035,189 - Smith , et al. October 11, 2	2011-10-11
Multiple-depth STI trenches in integrated circuit fabrication Grant 7,939,394 - Batra , et al. May 10, 2	2011-05-10
Formation Of Standard Voltage Threshold And Low Voltage Threshold Mosfet Devices App 20110006372 - Helm; Mark ; et al.	2011-01-13
Method And Apparatus Providing Different Gate Oxides For Different Transitors In An Integrated Circuit App 20100295137 - Zhou; Xianfeng	2010-11-25
Semiconductor Constructions App 20100276781 - Smith; Michael A. ; et al.	2010-11-04
Method of fabricating different gate oxides for different transistors in an integrated circuit Grant 7,790,544 - Zhou September 7, 2	2010-09-07
Semiconductor constructions, and electronic systems Grant 7,781,860 - Smith , et al. August 24, 2	2010-08-24
Formation of standard voltage threshold and low voltage threshold MOSFET devices Grant 7,755,146 - Helm , et al. July 13, 2	2010-07-13
Isolation Trench Fill Using Oxide Liner And Nitride Etch Back Technique With Dual Trench Depth Capability App 20100148300 - Zhou; Xianfeng	2010-06-17
Tubular Cracking Furnace App 20100147672 - Wang; Guoqing ; et al.	2010-06-17
Formation of standard voltage threshold and low voltage threshold MOSFET devices Grant 7,696,579 - Helm , et al. April 13, 2	2010-04-13
Isolation trench fill using oxide liner and nitride etch back technique with dual trench depth capability Grant 7,691,722 - Zhou April 6, 2	2010-04-06
Formation Of Standard Voltage Threshold And Low Voltage Threshold Mosfet Devices App 20090286366 - Helm; Mark ; et al.	2009-11-19
Semiconductor Constructions, and Electronic Systems App 20090072347 - Smith; Michael A. ; et al.	2009-03-19
Semiconductor processing methods Grant 7,473,615 - Smith , et al. January 6, 2	2009-01-06
Formation of standard voltage threshold and low voltage threshold MOSFET devices Grant 7,439,140 - Helm , et al. October 21, 2	2008-10-21
Formation of standard voltage threshold and low voltage threshold MOSFET devices Grant 7,413,946 - Helm , et al. August 19, 2	2008-08-19
Multiple-depth Sti Trenches In Integrated Circuit Fabrication App 20080176378 - Batra; Shubneesh ; et al.	2008-07-24
Multiple-depth STI trenches in integrated circuit fabrication Grant 7,354,812 - Batra , et al. April 8, 2	2008-04-08
Formation Of Standard Voltage Threshold And Low Voltage Threshold Mosfet Devices App 20080042216 - Helm; Mark ; et al.	2008-02-21
Formation of standard voltage threshold and low voltage threshold MOSFET devices Grant 7,304,353 - Helm , et al. December 4, 2	2007-12-04
Method and apparatus providing different gate oxides for different transitors in an integrated circuit App 20070224746 - Zhou; Xianfeng	2007-09-27
Isolation trench fill using oxide liner and nitride etch back technique with dual trench depth capability App 20070218645 - Zhou; Xianfeng	2007-09-20
Formation of standard voltage threshold and low voltage threshold MOSFET devices Grant 7,265,012 - Helm , et al. September 4, 2	2007-09-04
Formation Of Standard Voltage Threshold And Low Voltage Threshold Mosfet Devices App 20070093017 - Helm; Mark ; et al.	2007-04-26
Formation Of Standard Voltage Threshold And Low Voltage Threshold Mosfet Devices App 20070093016 - Helm; Mark ; et al.	2007-04-26
Formation of standard voltage threshold and low voltage threshold MOSFET devices Grant 7,189,607 - Helm , et al. March 13, 2	2007-03-13
Semiconductor processing methods, semiconductor constructions, and electronic systems App 20070029635 - Smith; Michael A. ; et al.	2007-02-08
Flash cell structures and methods of formation App 20060043368 - Li; Di ; et al.	2006-03-02
Multiple-depth STI trenches in integrated circuit fabrication App 20060043455 - Batra; Shubneesh ; et al.	2006-03-02
Flash cell structures and methods of formation App 20060046402 - Li; Di ; et al.	2006-03-02
Formation of standard voltage threshold and low voltage threshold MOSFET devices App 20060003513 - Helm; Mark ; et al.	2006-01-05
Formation of standard voltage threshold and low voltage threshold MOSFET devices App 20050227427 - Helm, Mark ; et al.	2005-10-13
Formation of standard voltage threshold and low voltge threshold MOSFET devices App 20050026352 - Helm, Mark ; et al.	2005-02-03
Method for forming standard voltage threshold and low voltage threshold MOSFET devices Grant 6,849,492 - Helm , et al. February 1, 2	2005-02-01
Imaging system for producing double exposure composite images and application thereof App 20040151489 - Zhou, Xianfeng	2004-08-05
Formation of standard voltage threshold and low voltage threshold MOSFET devices App 20040005752 - Helm, Mark ; et al.	2004-01-08

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