Patent applications and USPTO patent grants for Zhou; Jijie.The latest application filed is for "enhancing metal/low-k interconnect reliability using a protection layer".
Patent | Date |
---|---|
Method of forming an interconnect on a semiconductor substrate Grant 8,647,922 - Zhou , et al. February 11, 2 | 2014-02-11 |
Enhancing metal/low-K interconnect reliability using a protection layer Grant 8,486,824 - Tee , et al. July 16, 2 | 2013-07-16 |
Enhancing Metal/low-k Interconnect Reliability Using A Protection Layer App 20130012016 - Tee; Tong Yan ;   et al. | 2013-01-10 |
Enhancing metal/low-K interconnect reliability using a protection layer Grant 8,217,518 - Tee , et al. July 10, 2 | 2012-07-10 |
Nanoscale wicking methods and devices Grant 8,021,967 - Zhou , et al. September 20, 2 | 2011-09-20 |
Method of Forming an Interconnect on a Semiconductor Substrate App 20090239338 - Zhou; Jijie ;   et al. | 2009-09-24 |
Method for patterning large scale nano-fibrous surfaces using capillography Grant 7,491,628 - Noca , et al. February 17, 2 | 2009-02-17 |
Enhancing metal/low-K interconnect reliability using a protection layer App 20070216032 - Tee; Tong Yan ;   et al. | 2007-09-20 |
Nanoscale wicking methods and devices App 20070099311 - Zhou; Jijie ;   et al. | 2007-05-03 |
Hydroimpedance pump Grant 7,163,385 - Gharib , et al. January 16, 2 | 2007-01-16 |
Method for patterning large scale nano-fibrous surfaces using capillography App 20060088848 - Noca; Flavio ;   et al. | 2006-04-27 |
Hydroimpedance pump App 20040101414 - Gharib, Morteza ;   et al. | 2004-05-27 |
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