name:-0.0065031051635742
name:-0.0071358680725098
name:-0.00062894821166992
Zhou; Jijie Patent Filings

Zhou; Jijie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhou; Jijie.The latest application filed is for "enhancing metal/low-k interconnect reliability using a protection layer".

Company Profile
0.8.6
  • Zhou; Jijie - Shanghai N/A CN
  • Zhou; Jijie - Singapore N/A SG
  • Zhou; Jijie - Pasadena CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Method of forming an interconnect on a semiconductor substrate
Grant 8,647,922 - Zhou , et al. February 11, 2
2014-02-11
Enhancing metal/low-K interconnect reliability using a protection layer
Grant 8,486,824 - Tee , et al. July 16, 2
2013-07-16
Enhancing Metal/low-k Interconnect Reliability Using A Protection Layer
App 20130012016 - Tee; Tong Yan ;   et al.
2013-01-10
Enhancing metal/low-K interconnect reliability using a protection layer
Grant 8,217,518 - Tee , et al. July 10, 2
2012-07-10
Nanoscale wicking methods and devices
Grant 8,021,967 - Zhou , et al. September 20, 2
2011-09-20
Method of Forming an Interconnect on a Semiconductor Substrate
App 20090239338 - Zhou; Jijie ;   et al.
2009-09-24
Method for patterning large scale nano-fibrous surfaces using capillography
Grant 7,491,628 - Noca , et al. February 17, 2
2009-02-17
Enhancing metal/low-K interconnect reliability using a protection layer
App 20070216032 - Tee; Tong Yan ;   et al.
2007-09-20
Nanoscale wicking methods and devices
App 20070099311 - Zhou; Jijie ;   et al.
2007-05-03
Hydroimpedance pump
Grant 7,163,385 - Gharib , et al. January 16, 2
2007-01-16
Method for patterning large scale nano-fibrous surfaces using capillography
App 20060088848 - Noca; Flavio ;   et al.
2006-04-27
Hydroimpedance pump
App 20040101414 - Gharib, Morteza ;   et al.
2004-05-27

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