| Patent | Date |
|---|
Scalable extreme large size substrate integration
Grant 11,404,337 - Hu , et al. August 2, 2 | 2022-08-02 |
Double side mounted large MCM package with memory channel length reduction
Grant 11,158,621 - Zhong , et al. October 26, 2 | 2021-10-26 |
Trimmable banked capacitor
Grant 11,069,665 - Ramachandran , et al. July 20, 2 | 2021-07-20 |
Scalable Extreme Large Size Substrate Integration
App 20210202332 - Hu; Kunzhong ; et al. | 2021-07-01 |
High Density Interconnection Using Fanout Interposer Chiplet
App 20210159180 - Zhai; Jun ; et al. | 2021-05-27 |
High density interconnection using fanout interposer chiplet
Grant 10,943,869 - Zhai , et al. March 9, 2 | 2021-03-09 |
Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module
App 20210043511 - Ramachandran; Vidhya ; et al. | 2021-02-11 |
High Bandwidth Die To Die Interconnect With Package Area Reduction
App 20210020610 - Zhong; Chonghua ; et al. | 2021-01-21 |
Structure and method for fabricating a computing system with an integrated voltage regulator module
Grant 10,818,632 - Ramachandran , et al. October 27, 2 | 2020-10-27 |
High bandwidth die to die interconnect with package area reduction
Grant 10,770,433 - Zhong , et al. Sep | 2020-09-08 |
Double Side Mounted Large Mcm Package With Memory Channel Length Reduction
App 20200279842 - Zhong; Chonghua ; et al. | 2020-09-03 |
High Bandwidth Die To Die Interconnect With Package Area Reduction
App 20200273843 - Zhong; Chonghua ; et al. | 2020-08-27 |
Double side mounted large MCM package with memory channel length reduction
Grant 10,685,948 - Zhong , et al. | 2020-06-16 |
Trimmable Banked Capacitor
App 20200176427 - Ramachandran; Vidhya ; et al. | 2020-06-04 |
Double Side Mounted Large Mcm Package With Memory Channel Length Reduction
App 20200176431 - Zhong; Chonghua ; et al. | 2020-06-04 |
3D thin profile pre-stacking architecture using reconstitution method
Grant 10,181,455 - Zhai , et al. Ja | 2019-01-15 |
High Density Interconnection Using Fanout Interposer Chiplet
App 20180358298 - Zhai; Jun ; et al. | 2018-12-13 |
Dual-sided silicon integrated passive devices
Grant 10,103,138 - Zhai , et al. October 16, 2 | 2018-10-16 |
3d Thin Profile Pre-stacking Architecture Using Reconstitution Method
App 20180204820 - Zhai; Jun ; et al. | 2018-07-19 |
Structure and method for fabricating a computing system with an integrated voltage regulator module
Grant 9,935,076 - Ramachandran , et al. April 3, 2 | 2018-04-03 |
Dual-sided Silicon Integrated Passive Devices
App 20170323883 - Zhai; Jun ; et al. | 2017-11-09 |
Dual-sided silicon integrated passive devices
Grant 9,748,227 - Zhai , et al. August 29, 2 | 2017-08-29 |
Double side mounting memory integration in thin low warpage fanout package
Grant 9,659,907 - Zhai , et al. May 23, 2 | 2017-05-23 |
System in package fan out stacking architecture and process flow
Grant 9,633,974 - Zhai , et al. April 25, 2 | 2017-04-25 |
Dual-sided Silicon Integrated Passive Devices
App 20170018546 - Zhai; Jun ; et al. | 2017-01-19 |
Integrated circuit die decoupling system with reduced inductance
Grant 9,548,288 - Ramachandran , et al. January 17, 2 | 2017-01-17 |
Package-on-package Options With Multiple Layer 3-d Stacking
App 20160300823 - Zhai; Jun ; et al. | 2016-10-13 |
Double Side Mounting Memory Integration In Thin Low Warpage Fanout Package
App 20160300813 - Zhai; Jun ; et al. | 2016-10-13 |
System In Package Fan Out Stacking Architecture And Process Flow
App 20160260684 - Zhai; Jun ; et al. | 2016-09-08 |
Package-on-package Options With Multiple Layer 3-d Stacking
App 20160013156 - Zhai; Jun ; et al. | 2016-01-14 |
Reconfigured Wide I/o Memory Modules And Package Architectures Using Same
App 20150364454 - Zhai; Jun ; et al. | 2015-12-17 |
Thermal enhanced high density flip chip package
Grant 9,153,530 - Zhong , et al. October 6, 2 | 2015-10-06 |
Wideband power efficient high transmission power radio frequency (RF) transmitter
Grant 9,118,367 - Gomez , et al. August 25, 2 | 2015-08-25 |
Wafer level package resistance monitor scheme
Grant 8,957,694 - Hu , et al. February 17, 2 | 2015-02-17 |
Fabricating a wafer level semiconductor package having a pre-formed dielectric layer
Grant 8,945,991 - Hu , et al. February 3, 2 | 2015-02-03 |
Wafer level semiconductor package
Grant 8,922,014 - Hu , et al. December 30, 2 | 2014-12-30 |
Wafer level semiconductor package
Grant 08922014 - | 2014-12-30 |
Wafer Level Semiconductor Package
App 20140084462 - Hu; Kevin (Kunzhong) ; et al. | 2014-03-27 |
Fabricating a Wafer Level Semiconductor Package Having a Pre-formed Dielectric Layer
App 20140087553 - Hu; Kevin (Kunzhong) ; et al. | 2014-03-27 |
Wafer Level Package Resistance Monitor Scheme
App 20130314120 - Hu; Kunzhong ; et al. | 2013-11-28 |
Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer
Grant 8,592,259 - Hu , et al. November 26, 2 | 2013-11-26 |
Wideband Power Efficient High Transmission Power Radio Frequency (RF) Transmitter
App 20130235953 - GOMEZ; Ray (Ramon) ; et al. | 2013-09-12 |
Wafer Level Semiconductor Package
App 20130134596 - Hu; Kevin (Kunzhong) ; et al. | 2013-05-30 |
Wideband power efficient high transmission power radio frequency (RF) transmitter
Grant 8,417,200 - Gomez , et al. April 9, 2 | 2013-04-09 |
Wideband Power Efficient High Transmission Power Radio Frequency (RF) Transmitter
App 20130084816 - Gomez; Ray (Ramon) ; et al. | 2013-04-04 |
Thermal Enhanced High Density Flip Chip Package
App 20120319255 - Zhong; Chonghua ; et al. | 2012-12-20 |
Integrated circuit package substrate having configurable bond pads
Grant 8,138,608 - Zhong March 20, 2 | 2012-03-20 |
IC package sacrificial structures for crack propagation confinement
Grant 8,102,027 - Zhao , et al. January 24, 2 | 2012-01-24 |
Low voltage drop and high thermal performance ball grid array package
Grant 7,781,882 - Zhong , et al. August 24, 2 | 2010-08-24 |
Integrated Circuit Package Substrate Having Configurable Bond Pads
App 20100117245 - Zhong; Chonghua | 2010-05-13 |
Integrated circuit package substrate having configurable bond pads
Grant 7,683,495 - Zhong March 23, 2 | 2010-03-23 |
Low Voltage Drop and High Thermal Performance Ball Grid Array Package
App 20090267222 - Zhong; Chonghua ; et al. | 2009-10-29 |
Integrated Circuit Package Substrate Having Configurable Bond Pads
App 20090212443 - Zhong; Chonghua | 2009-08-27 |
IC package sacrificial structures for crack propagation confinement
App 20090051010 - Zhao; Sam Ziqun ; et al. | 2009-02-26 |
Low Voltage Drop and High Thermal Performance Ball Grid Array Package
App 20070108598 - ZHONG; Chonghua ; et al. | 2007-05-17 |
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