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name:-0.0080480575561523
name:-0.0071389675140381
name:-0.0015339851379395
Zhong; Chong Hua Patent Filings

Zhong; Chong Hua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhong; Chong Hua.The latest application filed is for "ball grid array package substrates with a modified central opening and method for making the same".

Company Profile
0.4.3
  • Zhong; Chong Hua - Irvine CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Low voltage drop and high thermal performance ball grid array package
Grant 7,566,590 - Zhong , et al. July 28, 2
2009-07-28
Ball grid array package substrates with a modified central opening and method for making the same
Grant 7,405,145 - Khan , et al. July 29, 2
2008-07-29
Low voltage drop and high thermal performance ball grid array package
Grant 7,196,415 - Zhong , et al. March 27, 2
2007-03-27
Ball grid array package substrates with a modified central opening and method for making the same
App 20050127501 - Khan, Reza-ur Rahman ;   et al.
2005-06-16
Ball grid array package substrates and method of making the same
Grant 6,879,039 - Khan , et al. April 12, 2
2005-04-12
Low voltage drop and high thermal perfor mance ball grid array package
App 20030179549 - Zhong, Chong Hua ;   et al.
2003-09-25
Ball grid array package substrates and method of making the same
App 20030111726 - Khan, Reza-Ur Rahman ;   et al.
2003-06-19

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