ZHENGYU, ZHU

USPTO Trademark & Patent Filings

Trademark applications and grants for Zhengyu, Zhu. Zhengyu, Zhu has 1 trademark applications. The latest application filed is for "NBFKDO"

Company Profile

ZHENGYU, ZHU
zhu zhengyu
Zhu; Zhengyu - Shanghai CN
Zhu; Zhengyu - Suzhou City CN
Zhu; Zhengyu - Jiangu CN
Zhu; Zhengyu - Suzhou CN
Zhu; Zhengyu - Jiangsu CN

Entity Type	INDIVIDUAL
Address	NO. 46 HOUDONG, DONGPUYU VILLAGE, XINDU TOWN, LICHENG DISTRICT, PUTIAN CITY, FUJIAN CHINA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks Patents

Patent Applications

Patent Application	Date
REPAIRING METHODS FOR HYDRAULIC-END VALVE CAGE CAVITY AND PLUNGER-END SEAL HOLE 20200331088 - 16/464457 Wang; He ; et al.	2020-10-22
RESOURCE SKILL COMPLIANCE OPTIMIZATION 20120232944 - 13/045764 Zhu; Zhengyu ; et al.	2012-09-13
HIGH BOND LINE THICKNESS FOR SEMICONDUCTOR DEVICES 20110037153 - 12/887821 Zhu; Zhengyu ; et al.	2011-02-17
SEMICONDUCTOR DIE PACKAGES SUITABLE FOR OPTOELECTRONIC APPLICATIONS HAVING CLIP ATTACH STRUCTURES FOR ANGLED MOUNTING OF DICE 20090140179 - 11/948170 Liu; Yong ; et al.	2009-06-04
High Bond Line Thickness For Semiconductor Devices 20090115039 - 11/935915 Zhu; Zhengyu ; et al.	2009-05-07
High bond line thickness for semiconductor devices 9,147,665 - 12/887,821 Zhu , et al. September 29, 2	2015-09-29
High bond line thickness for semiconductor devices 9,147,665 - 12/887,821 Zhu , et al. September 29, 2	2015-09-29
High bond line thickness for semiconductor devices 7,825,501 - 11/935,915 Zhu , et al. November 2, 2	2010-11-02
Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice 7,589,338 - 11/948,170 Liu , et al. September 15, 2	2009-09-15

Patent Grants & Applications

Trademark Applications

Mark Image Registration \| Serial	Trademark Application Date
"NBFKDO" 6478965 90422967	NBFKDO 2020-12-29

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