loadpatents
Patent applications and USPTO patent grants for Zheng; Guizhen.The latest application filed is for "core via for chip package and interconnect".
Patent | Date |
---|---|
Core Via For Chip Package And Interconnect App 20120180312 - Zhang; Zhichao ;   et al. | 2012-07-19 |
Core via for chip package and interconnect App 20100326716 - Zhang; Zhichao ;   et al. | 2010-12-30 |
Package level noise isolation Grant 7,709,934 - Zeng , et al. May 4, 2 | 2010-05-04 |
Reconfigurable multifrequency antenna with RF-MEMS switches Grant 7,589,674 - Anagnostou , et al. September 15, 2 | 2009-09-15 |
Reconfigurable Multifrequency Antenna With Rf-mems Switches App 20090207091 - Anagnostou; Dimitrios ;   et al. | 2009-08-20 |
Package level integration of antenna and RF front-end module Grant 7,477,197 - Zeng , et al. January 13, 2 | 2009-01-13 |
Package level noise isolation App 20080157294 - Zeng; Xiang Yin ;   et al. | 2008-07-03 |
Package Level Integration Of Antenna And Rf Front-end Module App 20080158063 - ZENG; Xiang Yin ;   et al. | 2008-07-03 |
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