ZHAO; Yan Yang
Patent Applications and Registrations
Patent applications and USPTO patent grants for ZHAO; Yan Yang.The latest application filed is for "wirebondable interposer for flip chip packaged integrated circuit die".
- ZHAO; Yan Yang - Freemont CA
- Zhao; Yan Yang - Fremont CA
| Patent | Date |
|---|---|
| Wirebondable Interposer For Flip Chip Packaged Integrated Circuit Die App 20220254707 - CHEN; Chihhao ; et al. | 2022-08-11 |
| Wirebondable Interposer For Flip Chip Packaged Integrated Circuit Die App 20210028140 - Loy; Edwin ; et al. | 2021-01-28 |
| Multichannel RF feedthroughs Grant 10,845,553 - Zhao , et al. November 24, 2 | 2020-11-24 |
| Flex-less multilayer ceramic substrate Grant 9,900,974 - Ling , et al. February 20, 2 | 2018-02-20 |
| Flex-less Multilayer Ceramic Substrate App 20170354026 - Ling; Wenhua ; et al. | 2017-12-07 |
| Multichannel Rf Feedthroughs App 20170176700 - Zhao; Yan yang ; et al. | 2017-06-22 |
| Multichannel RF feedthroughs Grant 9,538,637 - Zhao , et al. January 3, 2 | 2017-01-03 |
| Multichannel Rf Feedthroughs App 20130001410 - Zhao; Yan yang ; et al. | 2013-01-03 |
| High-speed interconnects Grant 7,978,030 - Lee , et al. July 12, 2 | 2011-07-12 |
| Feed thru with flipped signal plane using guided vias Grant 7,880,570 - Zhou , et al. February 1, 2 | 2011-02-01 |
| Non-coplanar high-speed interconnects Grant 7,859,367 - Zhao , et al. December 28, 2 | 2010-12-28 |
| Feed Thru With Flipped Signal Plane Using Guided Vias App 20090267712 - Zhou; Jianying ; et al. | 2009-10-29 |
| Non-coplanar High-speed Interconnects App 20090033442 - Zhao; Yan Yang ; et al. | 2009-02-05 |
| High-speed Interconnects App 20080191818 - Lee; Yuheng ; et al. | 2008-08-14 |
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