| Patent | Date |
|---|
Method for defect reduction in magnetic write head fabrication
Grant 8,828,248 - Mao , et al. September 9, 2 | 2014-09-09 |
Method For Defect Reduction In Magnetic Write Head Fabrication
App 20140217060 - MAO; Guomin ; et al. | 2014-08-07 |
Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone
Grant 8,231,799 - Bera , et al. July 31, 2 | 2012-07-31 |
Methods to avoid unstable plasma states during a process transition
Grant 8,048,806 - Kutney , et al. November 1, 2 | 2011-11-01 |
Process Kit Having Reduced Erosion Sensitivity
App 20100101729 - KIM; JONG MUN ; et al. | 2010-04-29 |
Chamber recovery after opening barrier over copper
Grant 7,575,007 - Tang , et al. August 18, 2 | 2009-08-18 |
Hardmask Open Process With Enhanced Cd Space Shrink And Reduction
App 20090191711 - Rui; Ying ; et al. | 2009-07-30 |
Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content
Grant 7,540,971 - Bera , et al. June 2, 2 | 2009-06-02 |
Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones
Grant 7,541,292 - Bera , et al. June 2, 2 | 2009-06-02 |
Method of forming a low-K dual damascene interconnect structure
Grant 7,435,685 - Delgadino , et al. October 14, 2 | 2008-10-14 |
Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation
Grant 7,431,859 - Bera , et al. October 7, 2 | 2008-10-07 |
Method of fabricating a dual damascene interconnect structure
Grant 7,413,990 - Ye , et al. August 19, 2 | 2008-08-19 |
Method Of Forming A Low-k Dual Damascene Interconnect Structure
App 20080145998 - DELGADINO; GERARDO A. ; et al. | 2008-06-19 |
Chamber recovery after opening barrier over copper
App 20080050922 - Tang; Hairong ; et al. | 2008-02-28 |
Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material
Grant 7,309,448 - Chae , et al. December 18, 2 | 2007-12-18 |
Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material
Grant 7,300,597 - Chae , et al. November 27, 2 | 2007-11-27 |
Plasma etch process using polymerizing etch gases and an inert diluent gas in independent gas injection zones to improve etch profile or etch rate uniformity
App 20070254483 - Bera; Kallol ; et al. | 2007-11-01 |
Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone
App 20070251642 - Bera; Kallol ; et al. | 2007-11-01 |
Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content
App 20070251917 - Bera; Kallol ; et al. | 2007-11-01 |
Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones
App 20070254486 - Bera; Kallol ; et al. | 2007-11-01 |
Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation
App 20070251918 - Bera; Kallol ; et al. | 2007-11-01 |
Selective etching of carbon-doped low-k dielectrics
Grant 7,256,134 - Kim , et al. August 14, 2 | 2007-08-14 |
Methods to avoid unstable plasma states during a process transition
App 20070066064 - Kutney; Michael C. ; et al. | 2007-03-22 |
MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
Grant 7,186,943 - Hoffman , et al. March 6, 2 | 2007-03-06 |
Method to reduce plasma-induced charging damage
App 20070048882 - Kutney; Michael C. ; et al. | 2007-03-01 |
Selective Etch Process Of A Sacrificial Light Absorbing Material (slam) Over A Dielectric Material
App 20070020944 - Chae; Hee Yeop ; et al. | 2007-01-25 |
Method of forming a low-K dual damascene interconnect structure
Grant 7,132,369 - Delgadino , et al. November 7, 2 | 2006-11-07 |
MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
Grant 7,132,618 - Hoffman , et al. November 7, 2 | 2006-11-07 |
Method of fabricating a dual damascene interconnect structure
Grant 7,115,517 - Ye , et al. October 3, 2 | 2006-10-03 |
Method Of Fabricating A Dual Damascene Interconnect Structure
App 20060216926 - Ye; Yan ; et al. | 2006-09-28 |
Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
Grant 7,030,335 - Hoffman , et al. April 18, 2 | 2006-04-18 |
Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
App 20050236377 - Hoffman, Daniel J. ; et al. | 2005-10-27 |
Method for modifying dielectric characteristics of dielectric layers
Grant 6,921,727 - Chiang , et al. July 26, 2 | 2005-07-26 |
Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
Grant 6,894,245 - Hoffman , et al. May 17, 2 | 2005-05-17 |
Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric material
App 20050029229 - Chae, Hee Yeop ; et al. | 2005-02-10 |
Selective etching of carbon-doped low-k dielectrics
App 20050026430 - Kim, Yunsang ; et al. | 2005-02-03 |
Merie plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
App 20040211759 - Hoffman, Daniel J. ; et al. | 2004-10-28 |
Method of fabricating a dual damascene interconnect structure
App 20040198062 - Ye, Yan ; et al. | 2004-10-07 |
Method for modifying dielectric characteristics of dielectric layers
App 20040180556 - Chiang, Kang-Lie ; et al. | 2004-09-16 |
Method of forming a low-K dual damascene interconnect structure
App 20040157453 - Delgadino, Gerardo A. ; et al. | 2004-08-12 |
Gas distribution plate electrode for a plasma receptor
Grant 6,677,712 - Katz , et al. January 13, 2 | 2004-01-13 |
Dielectric etching with reduced striation
App 20030228768 - Chae, Heeyeop ; et al. | 2003-12-11 |
Gas Distribution Plate Electrode For A Plasma Reactor
App 20030201723 - Katz, Dan ; et al. | 2003-10-30 |
MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
App 20030136766 - Hoffman, Daniel J. ; et al. | 2003-07-24 |
Gas distribution plate electrode for a plasma reactor
Grant 6,586,886 - Katz , et al. July 1, 2 | 2003-07-01 |
Gas Distribution Plate Electrode For A Plasma Reactor
App 20030111961 - Katz, Dan ; et al. | 2003-06-19 |
Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression
App 20020108933 - Hoffman, Daniel J. ; et al. | 2002-08-15 |
Post-etch treatment of plasma-etched feature surfaces to prevent corrosion
Grant 6,153,530 - Ye , et al. November 28, 2 | 2000-11-28 |
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