| Patent | Date |
|---|
Methods to selectively embed magnetic materials in substrate and corresponding structures
Grant 11,450,471 - Xu , et al. September 20, 2 | 2022-09-20 |
Substrate assembly with encapsulated magnetic feature
Grant 11,443,892 - Lee , et al. September 13, 2 | 2022-09-13 |
Thin film barrier seed metallization in magnetic-plugged through hole inductor
Grant 11,443,885 - Darmawikarta , et al. September 13, 2 | 2022-09-13 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
Grant 11,417,614 - Xu , et al. August 16, 2 | 2022-08-16 |
Techniques For An Inductor At A First Level Interface
App 20220230800 - Xu; Cheng ; et al. | 2022-07-21 |
Magnetic Inductor Structures For Package Devices
App 20220230951 - Chatterjee; Prithwish ; et al. | 2022-07-21 |
Phase change material in substrate cavity
Grant 11,387,224 - Xu , et al. July 12, 2 | 2022-07-12 |
Embedding magnetic material, in a cored or coreless semiconductor package
Grant 11,355,459 - Lee , et al. June 7, 2 | 2022-06-07 |
Magnetic inductor structures for package devices
Grant 11,335,632 - Chatterjee , et al. May 17, 2 | 2022-05-17 |
Techniques for an inductor at a first level interface
Grant 11,322,290 - Xu , et al. May 3, 2 | 2022-05-03 |
Core Layer With Fully Encapsulated Co-axial Magnetic Material Around Pth In Ic Package Substrate
App 20220117089 - ZHANG; Chong ; et al. | 2022-04-14 |
High density package substrate formed with dielectric bi-layer
Grant 11,276,634 - Pietambaram , et al. March 15, 2 | 2022-03-15 |
Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate
Grant 11,246,218 - Zhang , et al. February 8, 2 | 2022-02-08 |
Galvanic corrosion protection for semiconductor packages
Grant 11,217,534 - Xu , et al. January 4, 2 | 2022-01-04 |
Magnetic Structures In Integrated Circuit Package Supports
App 20210305154 - Wang; Ying ; et al. | 2021-09-30 |
Techniques for an inductor at a second level interface
Grant 11,031,360 - Xu , et al. June 8, 2 | 2021-06-08 |
Microelectronic Assemblies Having An Integrated Capacitor
App 20210111166 - Zhang; Chong ; et al. | 2021-04-15 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,971,492 - Xu , et al. April 6, 2 | 2021-04-06 |
Electronic Device Including A Lateral Trace
App 20210020558 - Deng; Yikang ; et al. | 2021-01-21 |
Vented Lids For Integrated Circuit Packages
App 20200402884 - Wan; Zhimin ; et al. | 2020-12-24 |
Techniques For An Inductor At A Second Level Interface
App 20200373257 - Xu; Cheng ; et al. | 2020-11-26 |
Electronic device including a lateral trace
Grant 10,804,188 - Deng , et al. October 13, 2 | 2020-10-13 |
Thermal Management Solutions Using Compartmentalized Phase Change Materials
App 20200312738 - Zhao; Junnan ; et al. | 2020-10-01 |
Semiconductor package substrate with through-hole magnetic core inductor using conductive paste
Grant 10,790,159 - Xu , et al. September 29, 2 | 2020-09-29 |
Techniques for an inductor at a second level interface
Grant 10,777,514 - Xu , et al. Sept | 2020-09-15 |
Thermal Management Solutions For Integrated Circuit Packages
App 20200273776 - Xu; Cheng ; et al. | 2020-08-27 |
Galvanic Corrosion Protection For Semiconductor Packages
App 20200266149 - XU; Cheng ; et al. | 2020-08-20 |
Package-embedded Thin-film Capacitors, Package-integral Magnetic Inductors, And Methods Of Assembling Same
App 20200251467 - Kind Code | 2020-08-06 |
Microelectronic Assemblies Having A Cooling Channel
App 20200211927 - Wan; Zhimin ; et al. | 2020-07-02 |
Microelectronic Assemblies Having An Integrated Capacitor
App 20200212020 - Zhang; Chong ; et al. | 2020-07-02 |
Effective Heat Conduction From Hotspot To Heat Spreader Through Package Substrate
App 20200185300 - Xu; Cheng ; et al. | 2020-06-11 |
Magnetic Core Inductors
App 20200168384 - Zhao; Junnan ; et al. | 2020-05-28 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,643,994 - Xu , et al. | 2020-05-05 |
In-situ Formation Of A Thermoelectric Device In A Substrate Packaging
App 20200119250 - Xu; Cheng ; et al. | 2020-04-16 |
Phase Change Material In Substrate Cavity
App 20200118990 - Xu; Cheng ; et al. | 2020-04-16 |
Electronic Device Including A Lateral Trace
App 20200083153 - Deng; Yikang ; et al. | 2020-03-12 |
High Density Package Substrate Formed With Dielectric Bi-layer
App 20200075473 - Pietambaram; Srinivas V. ; et al. | 2020-03-05 |
Cavity Structures In Integrated Circuit Package Supports
App 20200066543 - Jain; Rahul ; et al. | 2020-02-27 |
Substrate Package With Glass Dielectric
App 20200027728 - Wang; Ying ; et al. | 2020-01-23 |
Chip Package And Method Of Manufacturing
App 20200006210 - Xu; Cheng ; et al. | 2020-01-02 |
Substrate Assembly With Encapsulated Magnetic Feature
App 20200005994 - LEE; Kyu-Oh ; et al. | 2020-01-02 |
Package-embedded Thin-film Capacitors, Package-integral Magnetic Inductors, And Methods Of Assembling Same
App 20190393217 - Xu; Cheng ; et al. | 2019-12-26 |
Techniques For An Inductor At A Second Level Interface
App 20190385959 - Xu; Cheng ; et al. | 2019-12-19 |
Techniques For An Inductor At A First Level Interface
App 20190385780 - Xu; Cheng ; et al. | 2019-12-19 |
Embedding Magnetic Material In A Cored Or Coreless Semiconductor Package
App 20190355675 - LEE; Kyu-Oh ; et al. | 2019-11-21 |
Methods To Selectively Embed Magnetic Materials In Substrate And Corresponding Structures
App 20190304661 - Xu; Cheng ; et al. | 2019-10-03 |
Methods To Embed Magnetic Material As First Layer On Coreless Substrates And Corresponding Structures
App 20190304933 - XU; Cheng ; et al. | 2019-10-03 |
Non-roughened Cu Trace With Anchoring To Reduce Insertion Loss Of High Speed Io Routing In Package Substrate
App 20190295937 - ZHANG; Chong ; et al. | 2019-09-26 |
Magnetic Bilayer Structure For A Cored Or Coreless Semiconductor Package
App 20190287934 - DENG; Yikang ; et al. | 2019-09-19 |
Semiconductor Package Substrate With Through-hole Magnetic Core Inductor Using Conductive Paste
App 20190287815 - XU; CHENG ; et al. | 2019-09-19 |
Thin Film Barrier Seed Matallization In Magnetic-plugged Through Hole Inductor
App 20190279806 - DARMAWIKARTA; Kristof ; et al. | 2019-09-12 |
Fully Embedded Magnetic-core In Core Layer For Custom Inductor In Ic Substrate
App 20190272936 - ZHANG; Chong ; et al. | 2019-09-05 |
Core Layer With Fully Encapsulated Co-axial Magnetic Material Around Pth In Ic Package Substrate
App 20190274217 - ZHANG; Chong ; et al. | 2019-09-05 |
Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same
Grant 10,373,951 - Xu , et al. | 2019-08-06 |
Magnetic Inductor Structures For Package Devices
App 20190206780 - Chatterjee; Prithwish ; et al. | 2019-07-04 |
| 