loadpatents
Patent applications and USPTO patent grants for Zhao; Jinyan.The latest application filed is for "workpiece processing method".
Patent | Date |
---|---|
Stacked wafer processing method Grant 11,348,797 - Harada , et al. May 31, 2 | 2022-05-31 |
Tape attaching method Grant 11,325,804 - Zhao , et al. May 10, 2 | 2022-05-10 |
Processing method for wafer Grant 11,315,821 - Zhao April 26, 2 | 2022-04-26 |
Wafer processing method including a test element group (TEG) cutting step Grant 11,315,833 - Zhao April 26, 2 | 2022-04-26 |
Workpiece Processing Method App 20210346990 - ZHAO; Jinyan ;   et al. | 2021-11-11 |
Method of processing wafer Grant 11,158,541 - Zhao October 26, 2 | 2021-10-26 |
Processing Method For Wafer App 20210066111 - ZHAO; Jinyan | 2021-03-04 |
Expanding Method And Expanding Apparatus App 20210028063 - ZHAO; Jinyan ;   et al. | 2021-01-28 |
Workpiece Processing Method App 20210013102 - ZHAO; Jinyan ;   et al. | 2021-01-14 |
Wafer processing method Grant 10,879,122 - Harada , et al. December 29, 2 | 2020-12-29 |
Tape Attaching Method App 20200399090 - ZHAO; Jinyan ;   et al. | 2020-12-24 |
Stacked Wafer Processing Method App 20200343095 - HARADA; Shigenori ;   et al. | 2020-10-29 |
Wafer processing method Grant 10,804,154 - Zhao October 13, 2 | 2020-10-13 |
Wafer Processing Method App 20200035559 - HARADA; Shigenori ;   et al. | 2020-01-30 |
Wafer Processing Apparatus App 20190393089 - ZHAO; Jinyan | 2019-12-26 |
Expanding method and expanding apparatus Grant 10,515,840 - Zhao , et al. Dec | 2019-12-24 |
Wafer processing method Grant 10,468,255 - Zhao No | 2019-11-05 |
Method Of Processing Wafer App 20190326174 - ZHAO; Jinyan | 2019-10-24 |
Wafer Processing Method App 20190279903 - ZHAO; Jinyan | 2019-09-12 |
Wafer Processing Method App 20190096676 - Zhao; Jinyan | 2019-03-28 |
Expanding Method And Expanding Apparatus App 20180350651 - Zhao; Jinyan ;   et al. | 2018-12-06 |
Cleaning Method App 20180158675 - Zhao; Jinyan | 2018-06-07 |
Cleaning Method App 20170154768 - Zhao; Jinyan | 2017-06-01 |
Wafer processing method Grant 8,753,923 - Kobayashi , et al. June 17, 2 | 2014-06-17 |
Wafer Processing Method App 20130183811 - KOBAYASHI; Satoshi ;   et al. | 2013-07-18 |
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