Zhang; Yu Amos

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhang; Yu Amos.The latest application filed is for "side mounted interconnect bridges".

Company Profile

10.9.10

Zhang; Yu Amos - Raleigh NC
Zhang; Yu Amos - Chandler AZ
Zhang; Yu Amos - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Side Mounted Interconnect Bridges App 20210296242 - Hossain; MD Altaf ; et al.	2021-09-23
Side mounted interconnect bridges Grant 11,031,341 - Hossain , et al. June 8, 2	2021-06-08
Rlink-on-die interconnect features to enable signaling Grant 10,886,171 - Zhang , et al. January 5, 2	2021-01-05
Rlink--die to die channel interconnect configurations to improve signaling Grant 10,784,204 - Aygun , et al. Sept	2020-09-22
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices Grant 10,607,951 - Zhang , et al.	2020-03-31
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices Grant 10,580,734 - Zhang , et al.	2020-03-03
Rlink - Die To Die Channel Interconnect Configurations To Improve Signaling App 20200066641 - AYGUN; Kemal ; et al.	2020-02-27
Side Mounted Interconnect Bridges App 20190341349 - Hossain; MD Altaf ; et al.	2019-11-07
Microprocessor package with first level die bump ground webbing structure Grant 10,453,795 - Zhang , et al. Oc	2019-10-22
Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contact Grant 10,396,036 - Zhang , et al. A	2019-08-27
Rlink-on-die Interconnect Features To Enable Signaling App 20190148227 - ZHANG; Yu Amos ; et al.	2019-05-16
Ground Plane Vertical Isolation Of, Ground Line Coaxial Isolation Of, And Impedance Tuning Of Horizontal Data Signal Transmission Lines Routed Through Package Devices App 20180374804 - ZHANG; Yu Amos ; et al.	2018-12-27
Microprocessor Package With First Level Die Bump Ground Webbing Structure App 20180331035 - ZHANG; Yu Amos ; et al.	2018-11-15
Ground Plane Vertical Isolation Of, Ground Line Coaxial Isolation Of, And Impedance Tuning Of Horizontal Data Signal Transmission Lines Routed Through Package Devices App 20180331036 - ZHANG; Yu Amos ; et al.	2018-11-15
Rlink-ground Shielding Attachment Structures And Shadow Voiding For Data Signal Contacts Of Package Devices; Vertical Ground Shielding Structures And Shield Fencing Of Vertical Data Signal Interconnects Of Package Devices; And Ground Shielding For Electro Optical Module Connector Data Signal Contact App 20180331043 - ZHANG; Yu Amos ; et al.	2018-11-15
Rlink-on-die inductor structures to improve signaling Grant 9,935,063 - Zhang , et al. April 3, 2	2018-04-03
Rlink - On-die Inductor Structures To Improve Signaling App 20180005965 - ZHANG; Yu Amos ; et al.	2018-01-04

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.