| Patent | Date |
|---|
Semiconductor packages having an electric device with a recess
Grant 10,658,238 - Goh , et al. | 2020-05-19 |
Semiconductor Packages Having An Electric Device With A Recess
App 20180040514 - Goh; Kim-Yong ; et al. | 2018-02-08 |
Semiconductor packages having an electric device with a recess
Grant 9,824,924 - Goh , et al. November 21, 2 | 2017-11-21 |
Integrated circuit device with shaped leads and method of forming the device
Grant 9,679,870 - Ma , et al. June 13, 2 | 2017-06-13 |
Electronic device with heat dissipater
Grant 9,620,438 - Duca , et al. April 11, 2 | 2017-04-11 |
Wafer level chip scale package (WLCSP) having edge protection
Grant 9,576,912 - Ma , et al. February 21, 2 | 2017-02-21 |
Electronic Device With Dummy Ic Die And Related Methods
App 20160293512 - MA; Yiyi ; et al. | 2016-10-06 |
Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
Grant 9,449,912 - Zhang , et al. September 20, 2 | 2016-09-20 |
Method Of Making An Electronic Device Including Two-step Encapsulation And Related Devices
App 20160190029 - GOH; Kim-Yong ; et al. | 2016-06-30 |
Method of making an electronic device including two-step encapsulation and related devices
Grant 9,379,034 - Goh , et al. June 28, 2 | 2016-06-28 |
Integrated Circuit Device With Shaped Leads And Method Of Forming The Device
App 20160172262 - MA; Yiyi ; et al. | 2016-06-16 |
Surface mount package for a semiconductor integrated device, related assembly and manufacturing process
Grant 9,257,372 - Duca , et al. February 9, 2 | 2016-02-09 |
Electronic Device With Heat Dissipater
App 20150235929 - Duca; Roseanne ; et al. | 2015-08-20 |
No-lead Semiconductor Package And Method Of Manufacturing The Same
App 20150084171 - Ma; Yiyi ; et al. | 2015-03-26 |
Semiconductor Packages Having An Electric Device With A Recess
App 20140291812 - Goh; Kim-Yong ; et al. | 2014-10-02 |
Piezo-resistive force sensor with bumps on membrane structure
Grant 8,800,391 - Zhang , et al. August 12, 2 | 2014-08-12 |
Window clamp top plate for integrated circuit packaging
Grant 8,796,826 - Zhang , et al. August 5, 2 | 2014-08-05 |
Offset of contact opening for copper pillars in flip chip packages
Grant 8,772,943 - Zhang , et al. July 8, 2 | 2014-07-08 |
Surface Mount Package For A Semiconductor Integrated Device, Related Assembly And Manufacturing Process
App 20140091443 - Duca; Roseanne ; et al. | 2014-04-03 |
Carbon nanotube-modified low-K materials
Grant 8,592,980 - Wang , et al. November 26, 2 | 2013-11-26 |
Enhancing metal/low-K interconnect reliability using a protection layer
Grant 8,486,824 - Tee , et al. July 16, 2 | 2013-07-16 |
Window Clamp Top Plate For Integrated Circuit Packaging
App 20130161806 - ZHANG; Xueren ; et al. | 2013-06-27 |
Balanced Leadframe Package Structure And Method Of Manufacturing The Same
App 20130147024 - GOH; Kim-Yong ; et al. | 2013-06-13 |
Offset Of Contact Opening For Copper Pillars In Flip Chip Packages
App 20130147052 - Zhang; Xueren ; et al. | 2013-06-13 |
Leadframe Pad Design With Enhanced Robustness To Die Crack Failure
App 20130093072 - Zhang; Xueren ; et al. | 2013-04-18 |
Enhancing Metal/low-k Interconnect Reliability Using A Protection Layer
App 20130012016 - Tee; Tong Yan ; et al. | 2013-01-10 |
Enhancing metal/low-K interconnect reliability using a protection layer
Grant 8,217,518 - Tee , et al. July 10, 2 | 2012-07-10 |
Piezo-resistive force sensor with bumps on membrane structure
App 20080178691 - Zhang; Xueren ; et al. | 2008-07-31 |
Enhancing metal/low-K interconnect reliability using a protection layer
App 20070216032 - Tee; Tong Yan ; et al. | 2007-09-20 |
Carbon nanotube-modified low-K materials
App 20070210455 - Wang; Shanzhong ; et al. | 2007-09-13 |
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