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name:-0.015001773834229
name:-0.012677907943726
name:-0.0098888874053955
Zhang; Xikun Patent Filings

Zhang; Xikun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhang; Xikun.The latest application filed is for "package with different types of semiconductor dies attached to a flange".

Company Profile
9.12.13
  • Zhang; Xikun - Shenzhen CN
  • ZHANG; Xikun - Shanghai CN
  • Zhang; Xikun - Chengdu CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method and device for controlling power amplification
Grant 11,303,247 - Yin , et al. April 12, 2
2022-04-12
Package With Different Types Of Semiconductor Dies Attached To A Flange
App 20210233877 - ZHANG; Xikun ;   et al.
2021-07-29
Package with different types of semiconductor dies attached to a flange
Grant 11,004,808 - Zhang , et al. May 11, 2
2021-05-11
Method and Device for Controlling Power Amplification
App 20200295712 - Yin; Weimin ;   et al.
2020-09-17
Method and device for controlling power amplification
Grant 10,622,947 - Yin , et al.
2020-04-14
Semiconductor package with integrated harmonic termination feature
Grant 10,332,847 - Liu , et al.
2019-06-25
Method and Device for Controlling Power Amplification
App 20190140594 - Yin; Weimin ;   et al.
2019-05-09
Power amplification device
Grant 10,224,878 - Wang , et al.
2019-03-05
Method and device for controlling power amplification
Grant 10,177,712 - Yin , et al. J
2019-01-08
Semiconductor Package with Integrated Harmonic Termination Feature
App 20180350758 - Liu; Yang ;   et al.
2018-12-06
Package with Different Types of Semiconductor Dies Attached to a Flange
App 20180254253 - Zhang; Xikun ;   et al.
2018-09-06
Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange
Grant 9,997,476 - Zhang , et al. June 12, 2
2018-06-12
Power Amplification Device
App 20170373646 - Wang; Yanhui ;   et al.
2017-12-28
Multi-Die Package Having Different Types of Semiconductor Dies Attached to the Same Thermally Conductive Flange
App 20170125362 - Zhang; Xikun ;   et al.
2017-05-04
Method and Device for Controlling Power Amplification
App 20160079929 - Yin; Weimin ;   et al.
2016-03-17
Method and device for controlling power amplification
Grant 9,219,454 - Yin , et al. December 22, 2
2015-12-22
Doherty power amplifier, and method and device for improving power amplification efficiency of Doherty power amplifier
Grant 8,994,450 - Zhang , et al. March 31, 2
2015-03-31
Doherty Power Amplifier, And Method And Device For Improving Power Amplification Efficiency Of Doherty Power Amplifier
App 20140306765 - ZHANG; Xikun ;   et al.
2014-10-16
Power Amplifier, Asymmetric Doherty Power Amplifier Device And Base Station
App 20130196714 - Yin; Weimin ;   et al.
2013-08-01
Method and Device for Controlling Power Amplification
App 20130113570 - Yin; Weimin ;   et al.
2013-05-09
Method and device for controlling power amplification
Grant 8,385,856 - Yin , et al. February 26, 2
2013-02-26
High-efficiency power amplifier
Grant 8,013,676 - Su , et al. September 6, 2
2011-09-06
High-Efficiency Power Amplifier
App 20100253426 - Su; Yongge ;   et al.
2010-10-07
Method And Device For Controlling Power Amplification
App 20100112966 - Yin; Weimin ;   et al.
2010-05-06

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