Zhang; Xiao Tian
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zhang; Xiao Tian.The latest application filed is for "flip chip contact (fcc) power package".
- Zhang; Xiao Tian - San Jose CA
| Patent | Date |
|---|---|
| Flip Chip Contact (fcc) Power Package App 20150102425 - Sun; Ming ; et al. | 2015-04-16 |
| Flip chip contact (FCC) power package Grant 8,564,049 - Sun , et al. October 22, 2 | 2013-10-22 |
| Method of making semiconductor package with plated connection Grant 7,897,438 - Luo , et al. March 1, 2 | 2011-03-01 |
| Semiconductor package with plated connection App 20080233679 - Luo; Leeshawn ; et al. | 2008-09-25 |
| Flip chip contact (FCC) power package App 20080211070 - Sun; Ming ; et al. | 2008-09-04 |
| Semiconductor package with plated connection Grant 7,394,151 - Luo , et al. July 1, 2 | 2008-07-01 |
| Power semiconductor package Grant 7,208,818 - Luo , et al. April 24, 2 | 2007-04-24 |
| Semiconductor package with plated connection App 20060180931 - Luo; Leeshawn ; et al. | 2006-08-17 |
| Flip chip contact (FCC) power package App 20060145319 - Sun; Ming ; et al. | 2006-07-06 |
| Power semiconductor package App 20060017141 - Luo; Leeshawn ; et al. | 2006-01-26 |
| Inverted J-lead package for power devices App 20050127532 - Luo, Leeshawn ; et al. | 2005-06-16 |
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