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Zhang; Tengyuan Patent Filings

Zhang; Tengyuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhang; Tengyuan.The latest application filed is for "react-on-demand (rod) fabrication method for high performance printed electronics".

Company Profile
7.4.9
  • Zhang; Tengyuan - London CA
  • ZHANG; Tengyuan - Shandong CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
React-on-demand (ROD) fabrication method for high performance printed electronics
Grant 10,772,218 - Zhang , et al. Sep
2020-09-08
Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling
Grant 10,660,217 - Yang , et al.
2020-05-19
React-on-demand (rod) Fabrication Method For High Performance Printed Electronics
App 20190208646 - Zhang; Tengyuan ;   et al.
2019-07-04
Method For Solvent-free Printing Conductors On Substrate
App 20190104618 - YANG; Jun ;   et al.
2019-04-04
15993351
App 20180352661 - YANG; Jun ;   et al.
2018-12-06
Film Coating And Film Coating Compositions For Surface Modification And Metallization
App 20180208792 - YANG; Jun ;   et al.
2018-07-26
Printing Method for Fabrication of Printed Electronics
App 20160353578 - Yang; Jun ;   et al.
2016-12-01

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