Trademark applications and grants for Qinglei Zhang. Qinglei Zhang has 1 trademark applications. The latest application filed is for "TESPO"
Entity Type | INDIVIDUAL |
Address | No. 50, Xizhang Village, Dayu Town, Taiqian, Henan CHINA 457600 |
Patent Application | Date |
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BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES 20210384129 - 17/410716 LIU; Yueli ;   et al. | 2021-12-09 |
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES 20200043852 - 16/596620 Liu; Yueli ;   et al. | 2020-02-06 |
INTEGRATED CIRCUIT PACKAGE SUBSTRATE 20190335591 - 16/504842 Zhang; Qinglei | 2019-10-31 |
INTEGRATED CIRCUIT PACKAGE SUBSTRATE 20190304892 - 16/381889 ZHANG; Qinglei ;   et al. | 2019-10-03 |
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES 20190013271 - 16/129577 Liu; Yueli ;   et al. | 2019-01-10 |
Integrated circuit package substrate 11,166,379 - 16/504,842 Zhang November 2, 2 | 2021-11-02 |
Bridge interconnection with layered interconnect structures 11,133,257 - 16/596,620 Liu , et al. September 28, 2 | 2021-09-28 |
Integrated circuit package substrate 10,770,387 - 16/381,889 Zhang , et al. Sep | 2020-09-08 |
Bridge interconnection with layered interconnect structures 10,475,745 - 16/129,577 Liu , et al. Nov | 2019-11-12 |
Integrated circuit package substrate 10,390,438 - 15/821,532 Zhang A | 2019-08-20 |
Mark Image Registration | Serial | Trademark Application Date |
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![]() "TESPO" 97500374 |
TESPO 2022-07-12 |
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