Zhang; Jiangyuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zhang; Jiangyuan.The latest application filed is for "four mosfet full bridge module".
- Zhang; Jiangyuan - Jiangsu CN
- Zhang; Jiangyuan - Shanghai CN
- Zhang; JiangYuan - Suzhou N/A CN
- Zhang; JiangYuan - Suzhou Jiangsu CN
| Patent | Date |
|---|---|
| Semiconductor die package including IC driver and bridge Grant 8,674,490 - Liu , et al. March 18, 2 | 2014-03-18 |
| Power package including multiple semiconductor devices Grant 8,399,997 - Zhang , et al. March 19, 2 | 2013-03-19 |
| Four MOSFET full bridge module Grant 8,367,481 - Liu , et al. February 5, 2 | 2013-02-05 |
| Four Mosfet Full Bridge Module App 20130005083 - Liu; Yong ; et al. | 2013-01-03 |
| Thin Power Package App 20120315727 - Zhang; Jiangyuan ; et al. | 2012-12-13 |
| Power Package Including Multiple Semiconductor Devices App 20120313232 - Zhang; Jiangyuan ; et al. | 2012-12-13 |
| Four Mosfet Full Bridge Module App 20120149149 - Liu; Yong ; et al. | 2012-06-14 |
| Four mosfet full bridge module Grant 8,138,585 - Liu , et al. March 20, 2 | 2012-03-20 |
| Semiconductor Die Package Including Ic Driver And Bridge App 20110140255 - Liu; Yong ; et al. | 2011-06-16 |
| Semiconductor die package including IC driver and bridge Grant 7,915,721 - Liu , et al. March 29, 2 | 2011-03-29 |
| Four Mosfet Full Bridge Module App 20090294936 - Liu; Yong ; et al. | 2009-12-03 |
| Semiconductor Die Package Including Ic Driver And Bridge App 20090230518 - Liu; Yong ; et al. | 2009-09-17 |
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