loadpatents
name:-0.018183946609497
name:-0.010555028915405
name:-0.0079259872436523
Zhang; Hongwen Patent Filings

Zhang; Hongwen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhang; Hongwen.The latest application filed is for "reconstruction method of three-dimensional (3d) human body model, storage device and control device".

Company Profile
7.12.16
  • Zhang; Hongwen - Beijing CN
  • Zhang; Hongwen - Utica NY
  • Zhang; Hongwen - Calgary CA
  • Zhang; Hongwen - New Hartford NY
  • Zhang; Hongwen - Lowell MA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Reconstruction method of three-dimensional (3D) human body model, storage device and control device
Grant 11,436,745 - Sun , et al. September 6, 2
2022-09-06
Reconstruction Method Of Three-dimensional (3d) Human Body Model, Storage Device And Control Device
App 20220262024 - SUN; Zhenan ;   et al.
2022-08-18
Low Temperature Melting And Mid Temperature Melting Lead-free Solder Paste With Mixed Solder Alloy Powders
App 20220184749 - Zhang; Hongwen ;   et al.
2022-06-16
Apparatus and methods for network-based line-rate detection of unknown malware
Grant 11,349,852 - Zhang , et al. May 31, 2
2022-05-31
Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
Grant 11,267,080 - Zhang , et al. March 8, 2
2022-03-08
Lead-free Solder Paste With Mixed Solder Powders For High Temperature Applications
App 20210339344 - Zhang; Hongwen ;   et al.
2021-11-04
Hybrid high temperature lead-free solder preform
Grant 10,888,958 - Zhang , et al. January 12, 2
2021-01-12
Low Temperature Melting And Mid Temperature Melting Lead-free Solder Paste With Mixed Solder Alloy Powders
App 20200353572 - Zhang; Hongwen ;   et al.
2020-11-12
High Reliability Leadfree Solder Alloys For Harsh Service Conditions
App 20200269360 - Geng; Jie ;   et al.
2020-08-27
Snbi And Snin Solder Alloys
App 20200070287 - Mutuku; Francis M. ;   et al.
2020-03-05
Hybrid High Temperature Lead-free Solder Preform
App 20190366486 - ZHANG; HONGWEN ;   et al.
2019-12-05
Apparatus and Methods for Network-Based Line-Rate Detection of Unknown Malware
App 20190199740 - Zhang; Hongwen ;   et al.
2019-06-27
Hybrid lead-free solder wire
Grant 10,328,533 - Zhang , et al.
2019-06-25
Deterministic and optimized bit index explicit replication (BIER) forwarding
Grant 10,153,967 - Callon , et al. Dec
2018-12-11
Mixed alloy solder paste
Grant 10,118,260 - Zhang , et al. November 6, 2
2018-11-06
Hybrid Lead-free Solder Wire
App 20180029170 - ZHANG; Hongwen ;   et al.
2018-02-01
Hybrid lead-free solder wire
Grant 9,802,274 - Zhang , et al. October 31, 2
2017-10-31
Hybrid Lead-free Solder Wire
App 20170266765 - ZHANG; HONGWEN ;   et al.
2017-09-21
Mixed alloy solder paste
Grant 9,636,784 - Zhang , et al. May 2, 2
2017-05-02
Deterministic And Optimized Bit Index Explicit Replication (bier) Forwarding
App 20160134518 - CALLON; Ross ;   et al.
2016-05-12
Mixed Alloy Solder Paste
App 20150246417 - ZHANG; HONGWEN ;   et al.
2015-09-03
Mixed Alloy Solder Paste
App 20150224602 - Zhang; Hongwen ;   et al.
2015-08-13
Mixed alloy solder paste
Grant 9,017,446 - Zhang , et al. April 28, 2
2015-04-28
Mixed Alloy Solder Paste
App 20110268985 - ZHANG; HONGWEN ;   et al.
2011-11-03
Systems and methods for improved network based content inspection
Grant 7,630,379 - Morishita , et al. December 8, 2
2009-12-08
Systems And Methods For Improved Network Based Content Inspection
App 20070160062 - Morishita; Isao ;   et al.
2007-07-12
System for bandwidth detection and content switching
App 20050010697 - Kinawi, Husam ;   et al.
2005-01-13

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