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name:-0.010283946990967
name:-0.015388011932373
name:-0.0042319297790527
Zhang; Chunbin Patent Filings

Zhang; Chunbin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhang; Chunbin.The latest application filed is for "method of debonding work-carrier pair with thin devices".

Company Profile
2.12.8
  • Zhang; Chunbin - San Jose CA
  • Zhang; Chunbin - Fremont CA
  • Zhang; Chunbin - Troy MI
  • Zhang; Chunbin - Cincinnati OH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair
Grant 11,274,234 - Zhang , et al. March 15, 2
2022-03-15
Method of debonding work-carrier pair with thin devices
Grant 11,177,153 - Zhang , et al. November 16, 2
2021-11-16
Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using chemical and mechanical means
Grant 10,913,254 - Zhang February 9, 2
2021-02-09
Hermetic flat top integrated heat spreader (IHS)/electromagnetic interference (EMI) shield package and method of manufacturing thereof for reducing warpage
Grant 10,734,326 - Shen , et al.
2020-08-04
Method Of Debonding Work-carrier Pair With Thin Devices
App 20190295877 - Zhang; Chunbin ;   et al.
2019-09-26
Adhesive Composition For Temporary Bonding Of Semiconductor Workpiece And Support Carrier Pair
App 20190276712 - Zhang; Chunbin ;   et al.
2019-09-12
Hermetic Flat Top Integrated Heat Spreader ( Ihs)/electromagnetic Interference (emi) Shield Package And Method Of Manufacturing
App 20190252324 - Shen; Minghao ;   et al.
2019-08-15
Method for debonding temporarily adhesive-bonded carrier-workpiece pair by using high pressure solvent
Grant 10,211,077 - Zhang Feb
2019-02-19
Method For Debonding Temporarily Adhesive-bonded Carrier-workpiece Pair By Using Chemical And Mechanical Means
App 20180264797 - Zhang; Chunbin
2018-09-20
Method For Debonding Temporarily Adhesive-bonded Carrier-workpiece Pair By Using High Pressure Solvent
App 20180269077 - Zhang; Chunbin
2018-09-20
Electrochemical etching of magnetic recording layer
Grant 9,123,373 - Homola , et al. September 1, 2
2015-09-01
Electro-deposited passivation coatings for patterned media
Grant 8,980,076 - Homola , et al. March 17, 2
2015-03-17
Electrochemical etching of magnetic recording layer
Grant 8,492,009 - Homola , et al. July 23, 2
2013-07-23
Electro-deposited Passivation Coatings For Patterned Media
App 20100300884 - HOMOLA; ANDREW ;   et al.
2010-12-02
Primer composition for promoting adhesion of a urethane adhesive to a polymeric substrate
Grant 6,984,287 - Zhang January 10, 2
2006-01-10
Primer composition for promoting adhesion of a urethane adhesive to a polymeric substrate
App 20050100742 - Zhang, Chunbin
2005-05-12
Primer composition for promoting adhesion of a urethane adhesive to a polymeric substrate
App 20030084995 - Zhang, Chunbin
2003-05-08
Method of preventing corrosion of metals using silanes
Grant 6,261,638 - van Ooij , et al. July 17, 2
2001-07-17
Method of preventing corrosion of metals using silanes
Grant 5,750,197 - van Ooij , et al. May 12, 1
1998-05-12

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