Zhang; Beichao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhang; Beichao.The latest application filed is for "implantation for shallow trench isolation (sti) formation and for stress for transistor performance enhancement".

Company Profile

0.6.9

Zhang; Beichao - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods to eliminate contact plug sidewall slit Grant 7,670,946 - Siew , et al. March 2, 2	2010-03-02
Implantation for shallow trench isolation (STI) formation and for stress for transistor performance enhancement App 20090315115 - Zhang; Beichao ; et al.	2009-12-24
Protruded contact and insertion of inter-layer-dielectric material to match damascene hardmask to improve undercut for low-k interconnects Grant 7,601,607 - Liu , et al. October 13, 2	2009-10-13
Metal barrier cap fabrication by polymer lift-off Grant 7,323,408 - Zhang , et al. January 29, 2	2008-01-29
Methods to eliminate contact plug sidewall slit App 20070264824 - Siew; Yong Kong ; et al.	2007-11-15
Protruded contact and insertion of inter-layer-dielectric material to match damascene hardmask to improve undercut for low-k interconnects App 20070264820 - Liu; Wuping ; et al.	2007-11-15
Metal barrier cap fabrication by polymer lift-off Grant 7,153,766 - Zhang , et al. December 26, 2	2006-12-26
Via electromigration improvement by changing the via bottom geometric profile App 20060160354 - Zhang; BeiChao ; et al.	2006-07-20
Via electromigration improvement by changing the via bottom geometric profile Grant 7,045,455 - Zhang , et al. May 16, 2	2006-05-16
Metal barrier cap fabrication by polymer lift-off App 20060088995 - Zhang; Beichao ; et al.	2006-04-27
Barrier metal cap structure on copper lines and vias App 20050191851 - Liu, Wuping ; et al.	2005-09-01
Via electromigration improvement by changing the via bottom geometric profile App 20050090097 - Zhang, Beichao ; et al.	2005-04-28
Metal barrier cap fabrication by polymer lift-off App 20040137709 - Zhang, Beichao ; et al.	2004-07-15
Barrier metal cap structure on copper lines and vias App 20040048468 - Liu, Wuping ; et al.	2004-03-11
Method of cobalt silicidation using an oxide-Titanium interlayer Grant 6,653,227 - Lai , et al. November 25, 2	2003-11-25

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