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name:-0.0070741176605225
name:-0.00093889236450195
name:-0.00097894668579102
ZHAN; Kangshu Patent Filings

ZHAN; Kangshu

Patent Applications and Registrations

Patent applications and USPTO patent grants for ZHAN; Kangshu.The latest application filed is for "mask structure, semiconductor structure and methods for manufacturing same".

Company Profile
0.0.13
  • ZHAN; Kangshu - Hefei City CN
  • ZHAN; Kangshu - Hefei CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Mask Structure, Semiconductor Structure And Manufacturing Method
App 20220310607 - WAN; Qiang ;   et al.
2022-09-29
Manufacturing Method Of Semiconductor Structure
App 20220310402 - WAN; Qiang ;   et al.
2022-09-29
Semiconductor Structure and Method for Manufacturing Semiconductor Structure
App 20220310614 - ZHAN; Kangshu ;   et al.
2022-09-29
Mask Structure, Semiconductor Structure And Methods For Manufacturing Same
App 20220310393 - XU; Penghui ;   et al.
2022-09-29
Method For Preparing Semiconductor Structure And Semiconductor Structure
App 20220310606 - ZHAN; Kangshu ;   et al.
2022-09-29
Semiconductor Structure And Manufacturing Method Thereof
App 20220302127 - LI; Sen ;   et al.
2022-09-22
Semiconductor Structure And Forming Method Thereof
App 20220285481 - ZHAN; Kangshu ;   et al.
2022-09-08
Method For Manufacturing Memory And Memory
App 20220254782 - WAN; Qiang ;   et al.
2022-08-11
Method For Manufacturing Semiconductor Structure And Semiconductor Structure
App 20220246617 - Xia; Jun ;   et al.
2022-08-04
Method For Forming Semiconductor Structure
App 20220246437 - XIA; JUN ;   et al.
2022-08-04
Method For Manufacturing Semiconductor Structure
App 20220246616 - XIA; Jun ;   et al.
2022-08-04
Memory And Fabrication Method Thereof
App 20220208764 - ZHAN; Kangshu ;   et al.
2022-06-30
Method For Preparing Hole In Semiconductor Device, Method For Preparing Semiconductor Device, And Semiconductor Device
App 20210376059 - XIA; Jun ;   et al.
2021-12-02

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