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ZHAN; Kai Jun Patent Filings

ZHAN; Kai Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for ZHAN; Kai Jun.The latest application filed is for "apparatus and method for forming a package structure".

Company Profile
2.5.8
  • ZHAN; Kai Jun - Taoyuan City TW
  • Zhan; Kai Jun - Taoyuan TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatus And Method For Forming A Package Structure
App 20220278071 - ZHAN; Kai Jun ;   et al.
2022-09-01
Semiconductor Device Package And Methods Of Manufacture
App 20220238480 - Zhan; Kai Jun ;   et al.
2022-07-28
Semiconductor Device With Conductive Pad
App 20210384152 - YEN; Chen-En ;   et al.
2021-12-09
Micro-connection structure and manufacturing method thereof
Grant 11,152,319 - Lu , et al. October 19, 2
2021-10-19
Multi-Layer Structures and Methods of Forming
App 20210265165 - Hsueh; Chang-Jung ;   et al.
2021-08-26
Semiconductor device and method for forming the same
Grant 11,101,233 - Yen , et al. August 24, 2
2021-08-24
Multi-layer structures and methods of forming
Grant 11,004,685 - Hsueh , et al. May 11, 2
2021-05-11
Micro-connection Structure And Manufacturing Method Thereof
App 20200273827 - Lu; Wen-Hsiung ;   et al.
2020-08-27
Multi-layer Structures And Methods Of Forming
App 20200176254 - Hsueh; Chang-Jung ;   et al.
2020-06-04
Micro-connection structure and manufacturing method thereof
Grant 10,651,142 - Lu , et al.
2020-05-12
Micro-connection Structure And Manufacturing Method Thereof
App 20190259719 - Lu; Wen-Hsiung ;   et al.
2019-08-22
Micro-connection Structure And Manufacturing Method Thereof
App 20190139917 - Lu; Wen-Hsiung ;   et al.
2019-05-09
Micro-connection structure and manufacturing method thereof
Grant 10,283,471 - Lu , et al.
2019-05-07

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