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Patent applications and USPTO patent grants for ZHAN; Kai Jun.The latest application filed is for "apparatus and method for forming a package structure".
Patent | Date |
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Apparatus And Method For Forming A Package Structure App 20220278071 - ZHAN; Kai Jun ;   et al. | 2022-09-01 |
Semiconductor Device Package And Methods Of Manufacture App 20220238480 - Zhan; Kai Jun ;   et al. | 2022-07-28 |
Semiconductor Device With Conductive Pad App 20210384152 - YEN; Chen-En ;   et al. | 2021-12-09 |
Micro-connection structure and manufacturing method thereof Grant 11,152,319 - Lu , et al. October 19, 2 | 2021-10-19 |
Multi-Layer Structures and Methods of Forming App 20210265165 - Hsueh; Chang-Jung ;   et al. | 2021-08-26 |
Semiconductor device and method for forming the same Grant 11,101,233 - Yen , et al. August 24, 2 | 2021-08-24 |
Multi-layer structures and methods of forming Grant 11,004,685 - Hsueh , et al. May 11, 2 | 2021-05-11 |
Micro-connection Structure And Manufacturing Method Thereof App 20200273827 - Lu; Wen-Hsiung ;   et al. | 2020-08-27 |
Multi-layer Structures And Methods Of Forming App 20200176254 - Hsueh; Chang-Jung ;   et al. | 2020-06-04 |
Micro-connection structure and manufacturing method thereof Grant 10,651,142 - Lu , et al. | 2020-05-12 |
Micro-connection Structure And Manufacturing Method Thereof App 20190259719 - Lu; Wen-Hsiung ;   et al. | 2019-08-22 |
Micro-connection Structure And Manufacturing Method Thereof App 20190139917 - Lu; Wen-Hsiung ;   et al. | 2019-05-09 |
Micro-connection structure and manufacturing method thereof Grant 10,283,471 - Lu , et al. | 2019-05-07 |
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