Zernack; Michael
Patent Applications and Registrations
Patent applications and USPTO patent grants for Zernack; Michael.The latest application filed is for "method for forming a packaged semiconductor device".
- Zernack; Michael - Pinneberg DE
- Zernack; Michael - Hamburg DE
| Patent | Date |
|---|---|
| Method For Forming A Packaged Semiconductor Device App 20210305095 - Moeller; Sascha ; et al. | 2021-09-30 |
| Variable stealth laser dicing process Grant 10,347,534 - Lapke , et al. July 9, 2 | 2019-07-09 |
| Variable Stealth Laser Dicing Process App 20190080963 - LAPKE; Martin ; et al. | 2019-03-14 |
| Die preparation for wafer-level chip scale package (WLCSP) Grant 8,895,363 - Buenning , et al. November 25, 2 | 2014-11-25 |
| Die Preparation for Wafer-Level Chip Scale Package (WLCSP) App 20140264768 - Buenning; Hartmut ; et al. | 2014-09-18 |
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