loadpatents
name:-0.024784088134766
name:-0.022610902786255
name:-0.0035560131072998
Zenz; Christian Patent Filings

Zenz; Christian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zenz; Christian.The latest application filed is for "integrated circuit saw bow break point".

Company Profile
3.27.26
  • Zenz; Christian - Graz AT
  • Zenz; Christian - Gratkorn AT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Dual-interface IC card module
Grant 11,222,861 - Zenz January 11, 2
2022-01-11
Integrated circuit saw bow break point
Grant 10,896,878 - Kamphuis , et al. January 19, 2
2021-01-19
Integrated Circuit Saw Bow Break Point
App 20200402918 - Kamphuis; Antonius Hendrikus Jozef ;   et al.
2020-12-24
Dual-interface Ic Card Module
App 20190355693 - ZENZ; CHRISTIAN
2019-11-21
Dual-interface IC card module
Grant 10,461,057 - Zenz Oc
2019-10-29
Dual-interface IC card
Grant 10,366,320 - Zenz July 30, 2
2019-07-30
Method of producing a transponder and a transponder
Grant 9,779,349 - Rogy , et al. October 3, 2
2017-10-03
Dual-interface Ic Card
App 20170140257 - Zenz; Christian
2017-05-18
Dual-interface Ic Card Module
App 20170092612 - Zenz; Christian
2017-03-30
Dual-interface IC card components and method for manufacturing the dual-interface IC card components
Grant 9,536,188 - Schoengrundner , et al. January 3, 2
2017-01-03
Antenna or a strap for accommodating an integrated circuit, an antenna on a substrate, a strap for an integrated circuit and a transponder
Grant 9,425,500 - Zenz , et al. August 23, 2
2016-08-23
Dual interface IC card components and method for manufacturing the dual-interface IC card components
Grant 9,424,507 - Zenz , et al. August 23, 2
2016-08-23
Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)
Grant 9,245,804 - Zenz , et al. January 26, 2
2016-01-26
Protection of a wafer-level chip scale package (WLCSP)
Grant 9,196,537 - Van Gemert , et al. November 24, 2
2015-11-24
Dual Interface Ic Card Components And Method For Manufacturing The Dual-interface Ic Card Components
App 20150278673 - Zenz; Christian ;   et al.
2015-10-01
Dual-interface Ic Card Components And Method For Manufacturing The Dual-interface Ic Card Components
App 20150278674 - Schoengrundner; Patrick ;   et al.
2015-10-01
Encapsulated Wafer-level Chip Scale (wlscp) Pedestal Packaging
App 20150162306 - VAN GEMERT; Leonardus Antonius Elisabeth ;   et al.
2015-06-11
Method Of Producing A Transponder And A Transponder
App 20150144704 - Rogy; Reinhard ;   et al.
2015-05-28
Encapsulated wafer-level chip scale (WLSCP) pedestal packaging
Grant 8,987,057 - Van Gemert , et al. March 24, 2
2015-03-24
Method of producing a transponder and a transponder
Grant 8,968,510 - Rogy , et al. March 3, 2
2015-03-03
IC package with stainless steel leadframe
Grant 8,884,415 - Khunpukdee , et al. November 11, 2
2014-11-11
Integrated circuit transponder, method of producing an integrated circuit and method of producing a transponder
Grant 8,844,826 - Rogy , et al. September 30, 2
2014-09-30
Ic Package With Stainless Steel Leadframe
App 20140239471 - Khunpukdee; Peeradech ;   et al.
2014-08-28
Protection Of A Wafer-level Chip Scale Package (wlcsp)
App 20140138855 - VAN GEMERT; Leonardus Antonius Elisabeth ;   et al.
2014-05-22
Backside Protection For A Wafer-level Chip Scale Package (wlcsp)
App 20140110826 - BUENNING; Hartmut ;   et al.
2014-04-24
Using A Double-cut For Mechanical Protection Of A Wafer-level Chip Scale Package (wlcsp)
App 20140110842 - ZENZ; Christian ;   et al.
2014-04-24
Chip card for insertion into a holder
Grant 8,695,881 - Schober , et al. April 15, 2
2014-04-15
Method for manufacturing an electronic device
Grant 8,695,207 - Zenz April 15, 2
2014-04-15
Encapsulated Wafer-level Chip Scale (wlscp) Pedestal Packaging
App 20140091458 - VAN GEMERT; Leonardus Antonius Elisabeth ;   et al.
2014-04-03
Method of and device for determining and controlling the distance between an integrated circuit and a substrate
Grant 8,669,123 - Zenz March 11, 2
2014-03-11
RFID circuit and method
Grant 8,628,018 - Zenz , et al. January 14, 2
2014-01-14
Rfid Circuit And Method
App 20130270348 - Zenz; Christian ;   et al.
2013-10-17
Transponder and method of producing a transponder
Grant 8,448,870 - Rogy , et al. May 28, 2
2013-05-28
Method For Manufacturing An Electronic Device
App 20110189824 - ZENZ; Christian
2011-08-04
Electronic Device And Method Of Manufacturing An Electronic Device
App 20110073357 - Zenz; Christian
2011-03-31
Method Of And Device For Determining And Controlling The Distance Between An Integrated Circuit And A Substrate
App 20100323459 - Zenz; Christian
2010-12-23
Method Of And Device For Determining The Distance Between An Integrated Circuit And A Substrate
App 20100310124 - Zenz; Christian ;   et al.
2010-12-09
Antenna Or A Strap For Accommodating An Integrated Circuit, An Antenna On A Substrate, A Strap For An Integrated Circuit And A Transponder
App 20100253589 - Zenz; Christian ;   et al.
2010-10-07
Transponder and Method of Producing a Transponder
App 20090294542 - Rogy; Reinard ;   et al.
2009-12-03
Integrated Circuit Transponder, Method of Producing an Integrated Circuit and Method of Producing a Transponder
App 20090283602 - Rogy; Reinard ;   et al.
2009-11-19
Chip card for insertion into a holder
App 20090200381 - Schober; Joachim Heinz ;   et al.
2009-08-13
Device Comprising a Substrate Including an Electronic Contact, and Transponder
App 20080308310 - Rogy; Reinhard ;   et al.
2008-12-18
Method of Producing a Transponder and a Transponder
App 20080309462 - Rogy; Reinhard ;   et al.
2008-12-18
Chip with Light Protection Layer
App 20080093712 - Zenz; Christian
2008-04-24

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